Category: Products
FULL EQUIPMENT PORTFOLIO
Crystal Growth and Wafer Manufacturing Equipment by Process Stage
Vimfun manufactures the full equipment chain for semiconductor wafer manufacturing — from single crystal ingot growth to mirror-finished polished wafers. Our catalog includes crystal growth furnaces (CCz / Kyropoulos methods), multi-wire diamond saws for high-throughput wafer slicing, double-sided lapping and polishing machines for sub-micron flatness, and a complete consumables supply (diamond wire loops).
Four-axis dual-board tangential cutting. Listed 1000 × 200 × 150 mm capacity per position, 1.5–25 mm slices and 85 kW main-unit power.
Four-axis dual-workstation cutting for straight magnet slices. 220 × 220 × 150 mm × 2 capacity; 2–8 mm slice range.
Three-spindle swing cutting for silicon carbide, alumina and sapphire. 400 × 160 × 160 mm billets; 0.3–15 mm slice range.
- Max Workpiece Dia (mm): Φ210
- Carriers: 6 pcs
- Plate Flatness: ≤0.015 mm
- Pressure Control: ±10 N
Vertical single-wire slicing and CNC profile cutting for hard, brittle workpieces. Listed 400 × 400 × 300 mm envelope. Ask about free sample cutting.
- Method: Continuous Czochralski (CCz) / H-MCZ
- Max Capacity: 1000kg (Customizable)
- Max Diameter: 300 mm / 12 inch
- Uniformity: < 6.0% Resistivity (RRG)
- Max Workpiece Dia (mm): 600
- Max Workpiece Height (mm): 500
- Cutting Tool: Endless Wire
- With Rotary Function
- Method: Continuous Czochralski (CCz) / H-MCZ
- Max Capacity: 1000kg (Customizable)
- Max Diameter: 300 mm / 12 inch
- Uniformity: < 6.0% Resistivity (RRG)
- Max Workpiece Length (mm): dia 330*2500
- Top-Tail Cut
- Bridge Cut
- Seeding
Compact multi-wire cutting equipment for laboratories and pilot production. 200 × 200 × 200 mm workpieces; 0.3–12 mm slice range.
- Max Workpiece Length (mm): 750*180*150
- 2 loading Stations
- Slicing Thickness (mm): 1.5-20mm
- Replace ID Saw