Products

Kyropoulos Sapphire Crystal Growth Furnace
  • Method: Continuous Czochralski (CCz) / H-MCZ
  • Max Capacity: 1000kg (Customizable)
  • Max Diameter: 300 mm / 12 inch
  • Uniformity: < 6.0% Resistivity (RRG)
segmented diamond wire loop
  • Wire Diameter (mm): 0.65-3.5 mm
  • Wire Length  (m): 1-10
Rotary diamond wire saw price
  • Max Workpiece Dia (mm): 600
  • Max Workpiece Height (mm): 500
  • Cutting Tool: Endless Wire
  • With Rotary Function
Continuous Czochralski Crystal Puller
  • Method: Continuous Czochralski (CCz) / H-MCZ
  • Max Capacity: 1000kg (Customizable)
  • Max Diameter: 300 mm / 12 inch
  • Uniformity: < 6.0% Resistivity (RRG)
silicon ingot cropping machne SGC45-200
  • Max Workpiece Length (mm): dia 330*2500
  • Top-Tail Cut
  • Bridge Cut
  • Seeding
Wire Saw Wafer Slicing
  • Max Workpiece Length (mm): 660*160*150
  • Slicing Thickness (mm): 0.3-3mm
  • Inverted sawing
  • Wire traverse speed: Max 2200 m/min
SMO4-750D Multiwire saw
  • Max Workpiece Length (mm): 750*180*150
  • 2 loading Stations
  • Slicing Thickness (mm): 1.5-20mm
  • Replace ID Saw
430S Multi Wire Saw
  • Max Workpiece Length (mm): 430*160*150
  • Slicing Thickness (mm): 0.5-3mm
  • Swing Cut
  • Super Hard Cutting
Field connectable diamond wire loop price
  • Wire Diameter (mm): 2.0 mm
  • Wire Length  (mm): 4500 mm
Thread-Coated Diamond Wire Loop
  • Wire Diameter (mm): 0.55-1.0 mm
  • Wire Length  (m): 1-10
semiconductor material cutting machine
  • Max Workpiece Length (mm): 400
  • Max Workpiece Width (mm): 400
  • Max Workpiece Height (mm): 350
  • Cutting Tool: Endless Wire
4-axis diamond wire cutting machine
  • Max Workpiece Length (mm): 200
  • Max Workpiece Width (mm): 200
  • Max Workpiece Height (mm): 200
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