Complete Equipment Catalog for Semiconductor Wafer Manufacturing

FULL EQUIPMENT PORTFOLIO

Crystal Growth · Cutting · Lapping · Polishing — Four Process Stages, One Supplier

Vimfun manufactures the full equipment chain for semiconductor wafer manufacturing — from single crystal ingot growth to mirror-finished polished wafers. Our catalog includes crystal growth furnaces (CCz / Kyropoulos methods), multi-wire diamond saws for high-throughput wafer slicing, double-sided lapping and polishing machines for sub-micron flatness, and a complete consumables supply (diamond wire loops).

Sapphire Crystal Growth Furnace

Method: Continuous Czochralski (CCz) / H-MCZ
Max Capacity: 1000kg (Customizable)
Max Diameter: 300 mm / 12 inch
Uniformity: < 6.0% Resistivity (RRG)

Segment Coated Diamond Wire Loop

Wire Diameter (mm): 0.65-3.5 mm
Wire Length (m): 1-10

SH60-R

Max Workpiece Dia (mm): 600
Max Workpiece Height (mm): 500
Cutting Tool: Endless Wire
With Rotary Function

Silicon Crystal Puller

Method: Continuous Czochralski (CCz) / H-MCZ
Max Capacity: 1000kg (Customizable)
Max Diameter: 300 mm / 12 inch
Uniformity: < 6.0% Resistivity (RRG)

Silicon Ingot Cropper

Max Workpiece Length (mm): dia 330*2500
Top-Tail Cut
Bridge Cut
Seeding

SOM2-600S

Max Workpiece Length (mm): 660*160*150
Slicing Thickness (mm): 0.3-3mm
Inverted sawing
Wire traverse speed: Max 2200 m/min

SOM4-750D

Max Workpiece Length (mm): 750*180*150
2 loading Stations
Slicing Thickness (mm): 1.5-20mm
Replace ID Saw

SOMS3-430S

Max Workpiece Length (mm): 430*160*150
Slicing Thickness (mm): 0.5-3mm
Swing Cut
Super Hard Cutting

Spliceable Quartz Cutting Wire

Wire Diameter (mm): 2.0 mm
Wire Length (mm): 4500 mm

Thread Coated Diamond Wire Loop

Wire Diameter (mm): 0.55-1.0 mm
Wire Length (m): 1-10

Vertical Single Wire Saw

Max Workpiece Length (mm): 400
Max Workpiece Width (mm): 400
Max Workpiece Height (mm): 350
Cutting Tool: Endless Wire

Max Workpiece Length (mm): 200
Max Workpiece Width (mm): 200
Max Workpiece Height (mm): 200