Category: Multi-Wire Saw Machines
Four-roller dual-station tangential cutting for silicon ingot squaring and hard, brittle materials. 630 × 160 × 150 mm capacity per position.
Dual work-plate cutting equipment for large-section hard and brittle blocks. 400 × 400 × 830 mm charge arrangement; 1–35 mm slice range.
Two-axis inverted cutting for silicon, sapphire and ceramics. 430 × 160 × 150 mm workpieces; 0.3–3 mm slice range.
Four-axis dual-board tangential cutting. Listed 1000 × 200 × 150 mm capacity per position, 1.5–25 mm slices and 85 kW main-unit power.
Four-axis dual-workstation cutting for straight magnet slices. 220 × 220 × 150 mm × 2 capacity; 2–8 mm slice range.
Three-spindle swing cutting for silicon carbide, alumina and sapphire. 400 × 160 × 160 mm billets; 0.3–15 mm slice range.
Compact multi-wire cutting equipment for laboratories and pilot production. 200 × 200 × 200 mm workpieces; 0.3–12 mm slice range.
- Max Workpiece Length (mm): 750*180*150
- 2 loading Stations
- Slicing Thickness (mm): 1.5-20mm
- Replace ID Saw
- Max Workpiece Length (mm): 430*160*150
- Slicing Thickness (mm): 0.5-3mm
- Swing Cut
- Super Hard Cutting
Two-axis single-workstation inverted cutting. 660 × 160 × 150 mm blank capacity, 0.3–3 mm slice range and maximum 2,200 m/min reciprocating wire speed.