Sapphire ingots · LED substrates
Prepare sapphire ingots for substrate finishing with spooled-wire, multi-wire slicing. Compare inverted and oscillating cutting configurations against your blank size and target slice requirements.
Application requirements
Separate the requested as-cut thickness from the finished substrate thickness. Include the stock that subsequent finishing will remove.
Define acceptable edge damage, thickness variation and surface condition before the trial. A listed slice range does not establish wafer quality.
Provide the crystal orientation, shape and mounting method. The fixture and bonded support must be considered alongside the machine's listed blank envelope.
Process boundary
Confirm orientation and the prepared blank geometry, then review the fixture and support with the cutting team.
Parallel cutting wires produce multiple slices. The SOM configurations here use spooled wire with reciprocating travel; their motion and setup must match the material and cut.
Inspect the separated slices against the agreed criteria before downstream finishing. Do not equate an as-cut slice with an epitaxy-ready LED substrate.
Cutting demonstration
This video shows a 12-inch sapphire ingot being sliced with a diamond multi-wire saw. For a similar cutting trial, provide the ingot dimensions, fixture details and target slice thickness.
Watch on YouTube ↗Recommended equipment
A three-axis, single-workstation configuration with a worktable that rocks through a small angle during cutting. Consider this option when evaluating oscillating cutting for hard, brittle sapphire blanks.
Listed blank envelope: 400 × 160 × 160 mm
Listed slice thickness: 0.3–15 mm
Confirm the feed-direction configuration and the applicable recipe for your order. A general machine range is not a guaranteed sapphire process window.
View SOMIS-400
A dual-axis inverted multi-wire machine listed for sapphire and other hard, brittle materials. Consider it when evaluating an inverted cutting setup for thin slices.
Listed blank envelope: 430 × 160 × 150 mm
Listed slice thickness: 0.3–3 mm
Confirm workpiece support, unloading and the target slice condition in a material trial. These published limits do not establish thickness tolerance.
View SOMI-430| Selection factor | SOMIS-400 | SOMI-430 |
|---|---|---|
| Cutting configuration | Three-axis, single workstation; small-angle worktable oscillation | Dual-axis inverted cutting |
| Listed maximum blank size | 400 × 160 × 160 mm | 430 × 160 × 150 mm |
| Listed slice thickness | 0.3–15 mm | 0.3–3 mm |
| Application to evaluate | Oscillating slicing of hard, brittle blanks | Thin slicing with an inverted setup |
| Product details | SOMIS-400 specifications | SOMI-430 specifications |
Dimensions and thickness ranges are machine specifications, not sapphire-specific acceptance guarantees. Throughput, usable yield, thickness variation and surface quality require a trial with your material and setup.
For other sizes or process requirements, see the multi-wire saw model selection guide.
Before production selection
Wire specification, tension, feed and coolant conditions should be selected for the agreed trial. There is no single validated recipe on this page for every sapphire grade and geometry.
Start with SOMIS-400 if you want to evaluate small-angle oscillating cutting, or SOMI-430 for a dual-axis inverted setup. Check blank size and slice requirements first; use sample results to choose between applicable configurations.
No. The listed range describes machine slice thickness. Finished substrate thickness depends on the agreed cutting result and downstream material removal. Confirm the allowance before selecting the as-cut thickness.
This page does not set a universal cutting-rate, roughness or yield guarantee. Those values need material-specific trial conditions and agreed acceptance criteria.
Open the SOMIS-400 product page or SOMI-430 product page. This application page covers LED substrate ingot slicing and model selection.
Plan the next cut
Share the blank drawing, target thickness and inspection limits so the team can review the machine configuration and sample-cutting scope.
Request free sample cutting