Identify the material and drawing
Define the blank, cut direction and finishing allowance
For quartz crystal wafer cutting, the drawing should identify the material, blank dimensions, cutting plane and inspection datums. For piezoelectric parts, also specify the crystal orientation and axis convention. Keep enough stock for the required lapping or polishing operation.
01 · REFERENCEIdentify the blank
Supply dimensions, material identification and the available clamping surfaces. Distinguish crystal slicing from a rod feature or an individual profile.
02 · CUTSpecify the output
State the target slice thickness, quantity, cut direction and allowance for later material removal. Identify which surfaces are inspection datums.
03 · QUALIFYInspect the cut sample
Measure slice thickness, inspect the edges and surface, and check the stock remaining for finishing.
The drawing should state its axis convention. See the technical reference on quartz crystal orientation for background.