Diamond wire slicing equipment

Wafer Slicing Machine Range: Multi-Wire and Single-Wire Saws

Select a wafer slicing machine based on your material, workpiece dimensions and required slice thickness. Compare ten SOM multi-wire models for batch slicing and the SVO-40 for individual cuts and CNC profiles.

Find your machine Request free sample cutting

SOM multi-wire models

0.3–35 mm

Listed slice thickness across the series

1000 mm

Longest workpiece, SOM4-1000D

400×400×300 mm

Single-wire work envelope, SVO-40

Two product lines

Batch slicing or one programmed cut?

Both lines run open-end diamond wire wound on spools. The difference is how many wires cut at once.

SOM series · 10 models

SOM4-1000D multi-wire wafer slicing machine

Multi-wire saws

A parallel diamond-wire web produces multiple slices from one workpiece in a single cutting cycle. Choose multi-wire cutting for batches of parallel slices with a specified thickness.

200 mm to 1000 mm workpiecesInverted and swing-table modelsMagnet models

Open the multi-wire selection guide

SVO-40 · vertical single wire Concept illustration

Single-wire saw

Choose the SVO-40 for individual cuts, programmed profiles and internal features within its specified work envelope.

400 × 400 × 300 mm envelopeCNC profile cuttingQuartz rod inner holes

See the SVO-40

Machine finder

Find the wafer slicing machine for your part

Filter by job, then compare the listed workpiece size and slice thickness.

Lab & pilot

SOM200

Compact multi-wire saw for research and pilot lines.

Workpiece200 × 200 × 200 mm

Slice thickness0.3–12 mm

Thin slices

Illustration

SOMI-430

Inverted feed: the workpiece rises into the wire web.

Workpiece430 × 160 × 150 mm

Slice thickness0.3–3 mm

Thin slices

SOMI2-600S

High-speed inverted feed for longer ingots.

Workpiece660 × 160 × 150 mm

Slice thickness0.3–3 mm

Thin slices

SOMS3-430

Swing table for batch slicing of ultra-hard materials.

Workpiece430 × 160 × 150 mm

Slice thickness0.5–3 mm

Ultra-hard ceramics

Illustration

SOMIS-400

Inverted feed with a swinging cut for SiC, alumina and sapphire.

Workpiece400 × 160 × 160 mm

Slice thickness0.3–15 mm

Large format

Illustration

SOM400

Dual work plates for 400 × 400 mm cross-sections.

Workpiece400 × 400 × 830 mm

Slice thickness1–35 mm

Production

SOM4-630D

Four rollers, dual workstation; silicon ingot squaring.

Workpiece630 × 160 × 150 mm × 2

Slice thicknessConfirm for your part

Production

SOM4-1000D

Dual workstation for long workpieces.

Workpiece1000 × 200 × 150 mm × 2

Slice thickness1.5–25 mm

Magnets

Illustration

SOM-220D

Dual workstation for straight magnet slices.

Workpiece220 × 220 × 150 mm × 2

Slice thickness2–8 mm

Magnets

SOM4-750D

Straight slices and arc (tile) segments in one machine.

Workpiece750 × 120 × 150 mm × 2

Slice thickness1.5–20 mm

Single-wire

SVO-40

Vertical single-wire saw with CNC profile cutting.

Work envelope400 × 400 × 300 mm

Typical jobsSlabs, profiles

Compare all multi-wire models

Applications

What are you slicing?

Each material page explains the cutting route and compares the models that suit it.

Silicon

Ingot slicing and squaring for wafer production.

SOMI2-600S · SOMI-430 · SOM4-630D

Silicon carbide

Slicing SiC ingots and opening SiC blanks.

SOMIS-400 · SOMI-430 · SVO-40

Round wafer held beside a wafer storage box

Sapphire

Slicing sapphire ingots for LED substrates.

SOMIS-400 · SOMI-430

Quartz & piezo crystals

Crystal wafer slicing and quartz rod inner features.

SOM200 · SOMI-430 · SVO-40

Magnet block on a wire web and sliced magnets

Magnetic materials

Straight slices and arc segments from magnet billets.

SOM-220D · SOM4-750D

Germanium

Notes on cutting germanium into wafers.

Read the guide

CE certifiedEquipment certification

12-month warrantyWarranty period

12-hour responseTo enquiries and service requests

Free sample cuttingSend your material and target thickness

Process chain

From crystal growth to wafer finishing

Compare slicing equipment alongside upstream crystal growth and downstream grinding, lapping and polishing.

Crystal growthIngot or boule

Cropping & squaringBlank preparation

SlicingMulti-wire or single-wire

Grinding & lappingThickness and flatness

PolishingSurface finish

Upstream

Crystal growing furnaces

Silicon, germanium and sapphire growth.

Downstream

Grinding, lapping & polishing

Double-sided machines for sliced wafers.

Downstream

Magnet grinding machines

Arc grinding for tile magnets.

Equipment selection FAQ

Before you choose a slicing machine

Should I choose a multi-wire or a single-wire saw?

Choose a multi-wire saw for batches of parallel slices. Choose the SVO-40 for individual cuts, programmed profiles or internal features within its specified work envelope. Confirm the material, blank dimensions and fixture requirements for either process.

What do you need from me for a sample cut?

The material, the workpiece dimensions, the target slice thickness and how many pieces you need per run. A drawing helps when the cut is a profile.

Can one machine cover several materials?

Yes, within its listed workpiece size and slice thickness range. The SOM200 is the usual choice when materials change often. Each product page lists the materials given in that model's specification.