OUR EQUIPMENT PORTFOLIO
Equipment for Every Stage of Wafer Manufacturing
From single crystal growth to mirror-finished wafers, our equipment portfolio covers every stage of semiconductor manufacturing. Below, machines are organized by process stage — each engineered for specific material hardness, workpiece geometry, and throughput requirements.
- Method: Continuous Czochralski (CCz) / H-MCZ
- Max Capacity: 1000kg (Customizable)
- Max Diameter: 300 mm / 12 inch
- Uniformity: < 6.0% Resistivity (RRG)
- Method: Continuous Czochralski (CCz) / H-MCZ
- Max Capacity: 1000kg (Customizable)
- Max Diameter: 300 mm / 12 inch
- Uniformity: < 6.0% Resistivity (RRG)
- Technology: Continuous CZ (CCz) / H-MCZ
- Max Diameter: 300 mm / 12 inch
- Chamber ID: Φ1400 mm
- Diameter Control: ±0.05 mm
- 2 station
- Workpiece Length:10–70 mm
- Workpiece Width: 10-90 mm
- 15 pcs/min
- 4 station
- Workpiece Length:10–70 mm
- Workpiece Width: 10-90 mm
- 15 pcs/min
- Max Workpiece Dia (mm): Φ480
- Max Processing Force: 9000 N
- Plate Flatness: ≤0.02 mm
- Total Power: 36 kW
- Max Workpiece Dia (mm): Φ390
- Bearing: P5 Crossed Roller
- Plate Flatness: ≤0.015 mm
- Thickness Accuracy: ±2 μm (opt.)
- Max Workpiece Dia (mm): Φ210
- Carriers: 6 pcs
- Plate Flatness: ≤0.015 mm
- Pressure Control: ±10 N
- Max Workpiece Length (mm): dia 330*2500
- Top-Tail Cut
- Bridge Cut
- Seeding
- Max Workpiece Length (mm): 1000*200*150
- 2 Loading Stations
- Slicing Thickness (mm): 1.5-25mm
- Huge Output
- Max Workpiece Length (mm): 750*180*150
- 2 loading Stations
- Slicing Thickness (mm): 1.5-20mm
- Replace ID Saw
- Max Workpiece Length (mm): 430*160*150
- Slicing Thickness (mm): 0.5-3mm
- Swing Cut
- Super Hard Cutting
- Max Workpiece Length (mm): 660*160*150
- Slicing Thickness (mm): 0.3-3mm
- Inverted sawing
- Wire traverse speed: Max 2200 m/min
- Max Workpiece Length (mm): 630*160*150
- 2 Working Stations
- Slicing Thickness (mm): 1.5-20mm
- Faster Cut Speed
- Max Workpiece Length (mm): 200
- Max Workpiece Width (mm): 200
- Max Workpiece Height (mm): 200
- Cutting Tool: Endless Wire
- Max Workpiece Dia (mm): 600
- Max Workpiece Height (mm): 500
- Cutting Tool: Endless Wire
- With Rotary Function
- Max Workpiece Length (mm): 400
- Max Workpiece Width (mm): 400
- Max Workpiece Height (mm): 350
- Cutting Tool: Endless Wire
- Max Workpiece Length (mm): 200
- Max Workpiece Width (mm): 200
- Max Workpiece Height (mm): 200
- Cutting Tool: Endless Wire
- Max Workpiece Length (mm): 200
- Max Workpiece Width (mm): 200
- Max Workpiece Height (mm): 200
- Max Workpiece Length (mm): 200
- Max Workpiece Width (mm): 200
- Max Workpiece Height (mm): 200
- Cutting Tool: Endless Wire
Silicon ingot slicing
Slicing monocrystalline Si ingots into wafers with ultra-low kerf loss. Compatible with 6-inch to 12-inch diameters.
Check Machine
Astronomical Optics Pre-Cut
Cutting thick glass substrates used in telescope and observatory optics.
Check Machine
Germanium Wafer
Slicing CZ-grown germanium ingots into wafers for SiGe applications, solar cells, and detector substrates.
Check Machine
GaN & GaAs Substrate
Precision cutting of compound semiconductor crystals for RF, power, and optoelectronic device manufacturing.
Check Machine
Quartz Rod Cut
Precisely slice quartz blocks into smooth, chip-free cylindrical rods, ideal for light guides, fiber optic preforms, and infrared transmission components.
Check Machine
Sapphire Wafer for LED & MEMS
Slicing C-plane and A-plane sapphire ingots into ultra-thin wafers for LED epitaxy, MEMS, and protective covers.
Check Machine
Piezoelectric Ceramic Slicing
Ultra-thin slicing of PZT, lithium niobate, and quartz crystals for sensors, transducers, and SAW filters.
Check Machine
Ultra-Thin Wafer (≤0.2mm)
Specialized SOM2-600S for ultra-thin wafer production where kerf loss control is critical.
Check Machine
SPECIALTY EQUIPMENT
For Permanent Magnet Manufacturing
Beyond semiconductor wafers, Vimfun manufactures specialized arc-form grinding machines for high-volume permanent magnet (NdFeB) motor magnet production. For our complete permanent magnet processing portfolio, please visit our dedicated site.
- 2 station
- Workpiece Length:10–70 mm
- Workpiece Width: 10-90 mm
- 15 pcs/min
- 4 station
- Workpiece Length:10–70 mm
- Workpiece Width: 10-90 mm
- 15 pcs/min
- Max Workpiece Length (mm): 630*160*150
- 2 Working Stations
- Slicing Thickness (mm): 1.5-20mm
- Faster Cut Speed
- Max Workpiece Length (mm): 200
- Max Workpiece Width (mm): 200
- Max Workpiece Height (mm): 200
- Cutting Tool: Endless Wire
🔹 Chip-Free Edge Quality
🔹 Ultra-Smooth Surface Finish
🔹 Minimal Kerf Loss
🔹 Low Cutting Stress
🔹 Supports Thin and Hard Materials
🔹 Cleanroom-Compatible Operation