Precision Semiconductor Cutting Equipment for Advanced Ceramic & Materials
Semiconductor Cutting Equipment with diamond wire technology optimized for silicon, SiC, sapphire, and ceramic wafers.
N . A . Office
Winnipeg, MB, Canada
Call Us
(1)408-571-8651
7:30 AM - 7:30 PM
7 days
WHAT WE DO
Advanced Semiconductor Cutting Equipment for Hard & Brittle Materials
We specialize in designing and manufacturing semiconductor cutting equipment, featuring precision diamond wire cutting machines tailored for ultra-hard, brittle, and high-value materials used in the semiconductor and advanced electronics industries. Our solutions cover wafer slicing, rod segmentation, contour cutting, and inner-hole cutting, ensuring clean, low-kerf results. Equipped with programmable automation and complete process control, our semiconductor cutting equipment guarantees high accuracy and efficiency for your production needs.
Free Sample Cut
We provide free sample cut if you send workpiece and drawing
Machine Design
Design machines for your specific Cutting needs
Consumables
Offer all essential consumables for a smooth machine operation
CUTTING MACHIES WE OFFER
Explore Our Advanced Semiconductor Cutting Equipment
From thin wafer slicing to complex contour cutting, our semiconductor cutting equipment covers a wide range of tasks in the industry. Whether working with alumina, silicon carbide, sapphire, or piezoelectric ceramics, we provide reliable, customizable solutions designed for high-precision results and efficient operation.

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- Max Workpiece Length (mm): 200
- Max Workpiece Width (mm): 200
- Max Workpiece Height (mm): 200

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- Max Workpiece Dia (mm): 600
- Max Workpiece Height (mm): 500

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- Max Workpiece Length (mm): 400
- Max Workpiece Width (mm): 400
- Max Workpiece Height (mm): 350

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- Max Workpiece Length (mm): 200
- Max Workpiece Width (mm): 200
- Max Workpiece Height (mm): 200

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- Max Workpiece Length (mm): 200
- Max Workpiece Width (mm): 200
- Max Workpiece Height (mm): 200

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- Max Workpiece Length (mm): 200
- Max Workpiece Width (mm): 200
- Max Workpiece Height (mm): 200

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- Wire Diameter (mm): 0.3 – 3.5
- Wire Length (mm): 700 – 10000

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- Wire Diameter (mm): 0.55-1.0 mm
- Wire Length (m): 1-10

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- Wire Diameter (mm): 0.65-3.5 mm
- Wire Length (m): 1-10

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- Wire Diameter (mm): 2.0 mm
- Wire Length (mm): 4500 mm
MATERIALS WE CUT
Semiconductor Cutting Equipment for Precision-Grade Material Solutions
Our semiconductor cutting equipment is trusted worldwide by semiconductor material manufacturers, ceramic processors, and photonics companies. Typical applications include slicing sapphire rods, segmenting silicon carbide ingots, contour-cutting alumina substrates, and producing ultrathin piezoelectric wafers—delivering clean edges, minimal chipping, and stable throughput.
Lens Windows Cut
Ideal for lens windows and high-precision components.
Cutting 0.3mm blue optical filter glass with clean edges and no chipping
Check Machine Astronomical Optics Pre-Cut
Cutting thick glass substrates used in telescope and observatory optics.
Check Machine Infrared Night Vision Goggles
Ultra-precise Cut of germanium glass used in infrared lenses for night vision goggles, thermal scopes, and IR optical sensors.
Check Machine Sapphire Cut
Stress-free cutting of large synthetic ruby crystals used in laser cavities, infrared windows, and mechanical components.
Check Machine Quartz Rod Cut
Precisely slice quartz blocks into smooth, chip-free cylindrical rods, ideal for light guides, fiber optic preforms, and infrared transmission components.
Check Machine Ultra-Thin Sapphire Wafer Cutting
Slices sapphire into ultra-thin wafers as thin as 0.2mm, enabling high-precision applications in IR optics, laser protection, and sensor covers.
Check Machine Precision Prism Block Cutting
Manufacturing prisms, beam splitters, and retroreflectors, especially from BK7, fused silica, and other optical-grade materials.
Check Machine Glass Angle Cut
Custom angle or bevel cutting for shielding windows used in aerospace and medical equipment.
Check Machine ABOUT US
Why Our Cutting Machine Is Better
With years of experience in cutting hard and brittle materials, we deliver more than just machines—we provide complete cutting solutions. Our equipment features ultra-low kerf loss, programmable motion control, clean slicing surfaces, and flexible configuration options. Backed by global support and real-world success, we help our clients cut smarter, faster, and cleaner.
🔹 Chip-Free Edge Quality
🔹 Ultra-Smooth Surface Finish
🔹 Minimal Kerf Loss
🔹 Low Cutting Stress
🔹 Supports Thin and Hard Materials
🔹 Cleanroom-Compatible Operation
NEWS & INSIGHTS
Stay ahead with expert
Explore in-depth articles on optical material processing, cutting techniques, and application-specific challenges.