Complete Equipment Catalog for Semiconductor Wafer Manufacturing
FULL EQUIPMENT PORTFOLIO
Crystal Growth · Cutting · Lapping · Polishing — Four Process Stages, One Supplier
Vimfun manufactures the full equipment chain for semiconductor wafer manufacturing — from single crystal ingot growth to mirror-finished polished wafers. Our catalog includes crystal growth furnaces (CCz / Kyropoulos methods), multi-wire diamond saws for high-throughput wafer slicing, double-sided lapping and polishing machines for sub-micron flatness, and a complete consumables supply (diamond wire loops).
- Technology: Continuous CZ (CCz) / H-MCZ
- Max Diameter: 300 mm / 12 inch
- Chamber ID: Φ1400 mm
- Diameter Control: ±0.05 mm
- Method: Continuous Czochralski (CCz) / H-MCZ
- Max Capacity: 1000kg (Customizable)
- Max Diameter: 300 mm / 12 inch
- Uniformity: < 6.0% Resistivity (RRG)
- Method: Continuous Czochralski (CCz) / H-MCZ
- Max Capacity: 1000kg (Customizable)
- Max Diameter: 300 mm / 12 inch
- Uniformity: < 6.0% Resistivity (RRG)