Category: Crystal Growth Furnace
FULL EQUIPMENT PORTFOLIO
Crystal Growth and Wafer Manufacturing Equipment by Process Stage
Crystal growth furnace equipment for semiconductor manufacturing, including silicon crystal pullers, MCZ furnace systems, and sapphire crystal growth furnaces. This category connects the growth stage with downstream ingot cropping, wafer slicing, lapping, and polishing equipment.
- Technology: Continuous CZ (CCz) / H-MCZ
- Max Diameter: 300 mm / 12 inch
- Chamber ID: Φ1400 mm
- Diameter Control: ±0.05 mm
- Method: Continuous Czochralski (CCz) / H-MCZ
- Max Capacity: 1000kg (Customizable)
- Max Diameter: 300 mm / 12 inch
- Uniformity: < 6.0% Resistivity (RRG)
- Method: Continuous Czochralski (CCz) / H-MCZ
- Max Capacity: 1000kg (Customizable)
- Max Diameter: 300 mm / 12 inch
- Uniformity: < 6.0% Resistivity (RRG)