Complete Equipment Catalog for Semiconductor Wafer Manufacturing

FULL EQUIPMENT PORTFOLIO

Crystal Growth · Cutting · Lapping · Polishing — Four Process Stages, One Supplier

Vimfun manufactures the full equipment chain for semiconductor wafer manufacturing — from single crystal ingot growth to mirror-finished polished wafers. Our catalog includes crystal growth furnaces (CCz / Kyropoulos methods), multi-wire diamond saws for high-throughput wafer slicing, double-sided lapping and polishing machines for sub-micron flatness, and a complete consumables supply (diamond wire loops).
contour Cutting Machine
  • Max Workpiece Length (mm): 200
  • Max Workpiece Width (mm): 200
  • Max Workpiece Height (mm): 200
  • Cutting Tool: Endless Wire
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semiconductor material cutting machine

Vertical Single Wire Saw

  • Max Workpiece Length (mm): 400
  • Max Workpiece Width (mm): 400
  • Max Workpiece Height (mm): 350
  • Cutting Tool: Endless Wire
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