Complete Equipment Catalog for Semiconductor Wafer Manufacturing

FULL EQUIPMENT PORTFOLIO

Crystal Growth · Cutting · Lapping · Polishing — Four Process Stages, One Supplier

Vimfun manufactures the full equipment chain for semiconductor wafer manufacturing — from single crystal ingot growth to mirror-finished polished wafers. Our catalog includes crystal growth furnaces (CCz / Kyropoulos methods), multi-wire diamond saws for high-throughput wafer slicing, double-sided lapping and polishing machines for sub-micron flatness, and a complete consumables supply (diamond wire loops).
22BF-5LY Double Sided Polishing Machine

Double sided polishing

  • Max Workpiece Dia (mm): Φ480
  • Max Processing Force: 9000 N
  • Plate Flatness: ≤0.02 mm
  • Total Power: 36 kW
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industrial Lapping Machine

Lapping Machine

  • Max Workpiece Dia (mm): Φ390
  • Bearing: P5 Crossed Roller
  • Plate Flatness: ≤0.015 mm
  • Thickness Accuracy: ±2 μm (opt.)
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Lapping Machine-13B-6LY_P

Polishing Machine

  • Max Workpiece Dia (mm): Φ210
  • Carriers: 6 pcs
  • Plate Flatness: ≤0.015 mm
  • Pressure Control: ±10 N
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