Category: Grinding Machine

FULL EQUIPMENT PORTFOLIO

Crystal Growth and Wafer Manufacturing Equipment by Process Stage

Vimfun manufactures the full equipment chain for semiconductor wafer manufacturing — from single crystal ingot growth to mirror-finished polished wafers. Our catalog includes crystal growth furnaces (CCz / Kyropoulos methods), multi-wire diamond saws for high-throughput wafer slicing, double-sided lapping and polishing machines for sub-micron flatness, and a complete consumables supply (diamond wire loops).

2 Station Grinding Machine

2 station
Workpiece Length:10–70 mm
Workpiece Width: 10-90 mm
15 pcs/min

Arc Magnet Grinding Machine

4 station
Workpiece Length:10–70 mm
Workpiece Width: 10-90 mm
15 pcs/min

Double sided polishing

Max Workpiece Dia (mm): Φ480
Max Processing Force: 9000 N
Plate Flatness: ≤0.02 mm
Total Power: 36 kW

Lapping Machine

Max Workpiece Dia (mm): Φ390
Bearing: P5 Crossed Roller
Plate Flatness: ≤0.015 mm
Thickness Accuracy: ±2 μm (opt.)

Polishing Machine

Max Workpiece Dia (mm): Φ210
Carriers: 6 pcs
Plate Flatness: ≤0.015 mm
Pressure Control: ±10 N