Grinding Machine

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Crystal Growth and Wafer Manufacturing Equipment by Process Stage

This catalogue brings together magnet grinding machines and wafer lapping and polishing equipment. Choose a subgroup by workpiece type, then review the individual machine pages. Grinding, lapping and polishing perform different operations, so selection should follow the required process and finished-part requirements.

inner and outer arc grinding machine VMG-290

2 Station Grinding Machine

  • 2 station
  • Workpiece Length:10–70 mm
  • Workpiece Width: 10-90 mm
  • 15 pcs/min
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Industrial Magnet Grinding Machine

Arc Magnet Grinding Machine

  • 4 station
  • Workpiece Length:10–70 mm
  • Workpiece Width: 10-90 mm
  • 15 pcs/min
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industrial Double Sided Polishing Machine

Double sided polishing

  • Max Workpiece Dia (mm): Φ480
  • Max Processing Force: 9000 N
  • Plate Flatness: ≤0.02 mm
  • Total Power: 36 kW
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industrial Lapping Machine

Lapping Machine

  • Max Workpiece Dia (mm): Φ390
  • Bearing: P5 Crossed Roller
  • Plate Flatness: ≤0.015 mm
  • Thickness Accuracy: ±2 μm (opt.)
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Lapping Machine-13B-6LY_P

Polishing Machine

  • Max Workpiece Dia (mm): Φ210
  • Carriers: 6 pcs
  • Plate Flatness: ≤0.015 mm
  • Pressure Control: ±10 N
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