Complete Equipment Catalog for Semiconductor Wafer Manufacturing

FULL EQUIPMENT PORTFOLIO

Crystal Growth · Cutting · Lapping · Polishing — Four Process Stages, One Supplier

Vimfun manufactures the full equipment chain for semiconductor wafer manufacturing — from single crystal ingot growth to mirror-finished polished wafers. Our catalog includes crystal growth furnaces (CCz / Kyropoulos methods), multi-wire diamond saws for high-throughput wafer slicing, double-sided lapping and polishing machines for sub-micron flatness, and a complete consumables supply (diamond wire loops).

4 axis Single Diamond Wire Saw

Max Workpiece Length (mm): 200
Max Workpiece Width (mm): 200
Max Workpiece Height (mm): 200
Cutting Tool: Endless Wire

CNC Single Wire Saw

Max Workpiece Length (mm): 200
Max Workpiece Width (mm): 200
Max Workpiece Height (mm): 200
Cutting Tool: Endless Wire

Max Workpiece Length (mm): 200
Max Workpiece Width (mm): 200
Max Workpiece Height (mm): 200
Cutting Tool: Endless Wire

SH60-R

Max Workpiece Dia (mm): 600
Max Workpiece Height (mm): 500
Cutting Tool: Endless Wire
With Rotary Function

Silicon Ingot Cropper

Max Workpiece Length (mm): dia 330*2500
Top-Tail Cut
Bridge Cut
Seeding

Vertical Single Wire Saw

Max Workpiece Length (mm): 400
Max Workpiece Width (mm): 400
Max Workpiece Height (mm): 350
Cutting Tool: Endless Wire

Max Workpiece Length (mm): 200
Max Workpiece Width (mm): 200
Max Workpiece Height (mm): 200