Complete Equipment Catalog for Semiconductor Wafer Manufacturing
FULL EQUIPMENT PORTFOLIO
Crystal Growth · Cutting · Lapping · Polishing — Four Process Stages, One Supplier
Vimfun manufactures the full equipment chain for semiconductor wafer manufacturing — from single crystal ingot growth to mirror-finished polished wafers. Our catalog includes crystal growth furnaces (CCz / Kyropoulos methods), multi-wire diamond saws for high-throughput wafer slicing, double-sided lapping and polishing machines for sub-micron flatness, and a complete consumables supply (diamond wire loops).
- Technology: Continuous CZ (CCz) / H-MCZ
- Max Diameter: 300 mm / 12 inch
- Chamber ID: Φ1400 mm
- Diameter Control: ±0.05 mm
- 2 station
- Workpiece Length:10–70 mm
- Workpiece Width: 10-90 mm
- 15 pcs/min
- Max Workpiece Length (mm): 200
- Max Workpiece Width (mm): 200
- Max Workpiece Height (mm): 200
- Cutting Tool: Endless Wire
- 4 station
- Workpiece Length:10–70 mm
- Workpiece Width: 10-90 mm
- 15 pcs/min
- Max Workpiece Length (mm): 200
- Max Workpiece Width (mm): 200
- Max Workpiece Height (mm): 200
- Cutting Tool: Endless Wire
- Max Workpiece Length (mm): 200
- Max Workpiece Width (mm): 200
- Max Workpiece Height (mm): 200
- Cutting Tool: Endless Wire
- Max Workpiece Length (mm): 630*160*150
- 2 Working Stations
- Slicing Thickness (mm): 1.5-20mm
- Faster Cut Speed
- Max Workpiece Dia (mm): Φ480
- Max Processing Force: 9000 N
- Plate Flatness: ≤0.02 mm
- Total Power: 36 kW
- Max Workpiece Dia (mm): Φ390
- Bearing: P5 Crossed Roller
- Plate Flatness: ≤0.015 mm
- Thickness Accuracy: ±2 μm (opt.)
- Max Workpiece Length (mm): 1000*200*150
- 2 Loading Stations
- Slicing Thickness (mm): 1.5-25mm
- Huge Output
- Max Workpiece Dia (mm): Φ210
- Carriers: 6 pcs
- Plate Flatness: ≤0.015 mm
- Pressure Control: ±10 N