Category: Products
- Technology: Continuous CZ (CCz) / H-MCZ
- Max Diameter: 300 mm / 12 inch
- Chamber ID: Φ1400 mm
- Diameter Control: ±0.05 mm
- 2 station
- Workpiece Length:10–70 mm
- Workpiece Width: 10-90 mm
- 15 pcs/min
Four-roller dual-station tangential cutting for silicon ingot squaring and hard, brittle materials. 630 × 160 × 150 mm capacity per position.
- Max Workpiece Length (mm): 200
- Max Workpiece Width (mm): 200
- Max Workpiece Height (mm): 200
- Cutting Tool: Endless Wire
- 4 station
- Workpiece Length:10–70 mm
- Workpiece Width: 10-90 mm
- 15 pcs/min
- Max Workpiece Length (mm): 200
- Max Workpiece Width (mm): 200
- Max Workpiece Height (mm): 200
- Cutting Tool: Endless Wire
- Max Workpiece Length (mm): 200
- Max Workpiece Width (mm): 200
- Max Workpiece Height (mm): 200
- Cutting Tool: Endless Wire
- Max Workpiece Dia (mm): Φ480
- Max Processing Force: 9000 N
- Plate Flatness: ≤0.02 mm
- Total Power: 36 kW
Dual work-plate cutting equipment for large-section hard and brittle blocks. 400 × 400 × 830 mm charge arrangement; 1–35 mm slice range.
Two-axis inverted cutting for silicon, sapphire and ceramics. 430 × 160 × 150 mm workpieces; 0.3–3 mm slice range.
- Max Workpiece Dia (mm): Φ390
- Bearing: P5 Crossed Roller
- Plate Flatness: ≤0.015 mm
- Thickness Accuracy: ±2 μm (opt.)