카테고리: Multi-Wire Saw Machines
실리콘 잉곳 스퀘어링 및 단단하고 부서지기 쉬운 재료를 위한 4롤 듀얼 스테이션 접선 절단. 위치당 630 × 160 × 150mm 용량.
Dual work-plate cutting equipment for large-section hard and brittle blocks. 400 × 400 × 830 mm charge arrangement; 1–35 mm slice range.
Two-axis inverted cutting for silicon, sapphire and ceramics. 430 × 160 × 150 mm workpieces; 0.3–3 mm slice range.
Four-axis dual-board tangential cutting. Listed 1000 × 200 × 150 mm capacity per position, 1.5–25 mm slices and 85 kW main-unit power.
Four-axis dual-workstation cutting for straight magnet slices. 220 × 220 × 150 mm × 2 capacity; 2–8 mm slice range.
Three-spindle swing cutting for silicon carbide, alumina and sapphire. 400 × 160 × 160 mm billets; 0.3–15 mm slice range.
Compact multi-wire cutting equipment for laboratories and pilot production. 200 × 200 × 200 mm workpieces; 0.3–12 mm slice range.
Two-axis single-workstation inverted cutting. 660 × 160 × 150 mm blank capacity, 0.3–3 mm slice range and maximum 2,200 m/min reciprocating wire speed.