Vimfun SOMI-430 · Two-axis inverted cutting

Inverted Multi Wire Saw SOMI-430

An inverted multi wire saw for thin slices of silicon, sapphire, ceramics, optical glass and silicon carbide. The workpiece feeds upward into the wire web.

430 mm
Max. workpiece length
3–3 mm
슬라이스 두께
2 axes
Spindle arrangement
1,200
Max. wire speed, m/min
무료 샘플 절단 요청View specifications
SOMI-430 inverted multi wire saw equipment illustration
Equipment illustration from the SOMI-430 technical presentation; not a machine photograph.
From ingot to slice

Where does SOMI-430 fit in your process?

SOMI-430 accepts a prepared hard and brittle workpiece within a listed 430 × 160 × 150 mm envelope. It divides the material into parallel slices before subsequent grinding, lapping or polishing. Define the as-cut thickness together with the allowance needed for those later operations.

Prepare the ingot
Mount the workpiece
Inverted slicing
Inspect the slices
Lap / polish

The 0.3–3 mm range describes slice thickness, not flatness, total thickness variation or finished-wafer quality. Those acceptance requirements need to be agreed and checked on the actual material. For downstream equipment, see our double-sided lapping machine guide.

The defining mechanism

How does an inverted multi wire saw feed the workpiece?

In inverted cutting, the workpiece approaches the running wire web from below. In standard downward-feed cutting, it approaches from above. The distinction is the workpiece feed direction; both arrangements can use wire that reverses direction during the cutting cycle.

SOMI-430: inverted feedStandard downward feedWorkpieceWorkpieceMoving wire webWorkpiece moves down

Feed-direction illustration only. Wire routing, fixturing and machine clearances are schematic, not to scale.

Diamond wire passes from the pay-off spool through the grooved-roller system and onto the take-up spool. The parallel wire spans cut the workpiece as the table advances. Roller groove pitch establishes the spacing between cuts; actual kerf removes material from that spacing. Measure kerf on a trial cut rather than equating it with nominal wire diameter.

Specify the mounting arrangement

Review how the workpiece is supported during upward feed and how the resulting slices will be handled. Include bonding or fixture dimensions in the usable-capacity check.

Verify the thin-slice result

Feed direction alone does not establish a yield or edge-chipping improvement. The supplied material, wire, feed recipe and holding method must be evaluated together before accepting a production process.

Materials and applications

Which workpieces are within the intended application range?

The technical presentation identifies photovoltaic, semiconductor, optical and electronic-ceramic slicing. Material suitability still depends on the grade, geometry and acceptance criteria.

재료What to specify before a trial
실리콘Ingot dimensions, orientation and downstream finishing allowance
사파이어Crystal orientation, workpiece section and edge-quality requirement
Silicon carbideMaterial grade, target slice thickness and surface acceptance
세라믹Composition, incoming condition and support during slicing
Optical glassGlass type, dimensions and permitted edge damage

The minimum listed thickness is not a promise for every material in this table. Request sample cutting when thin sections, expensive material or limited finishing allowance make the result especially sensitive.

데이터시트

Technical specifications

항목SOMI-430
절단 방법Inverted feed; reciprocating wire
Maximum workpiece dimensions430 × 160 × 150 mm
슬라이스 두께3–3 mm
Spindles2 axes
Grooved roller materialPolyurethane
Roller diameter140–160 mm
와이어 직경0.13–0.25 mm
Wire spool capacityUp to 30,000 m
Reciprocating wire speedUp to 1,200 m/min
Direction reversalsUp to 10 per minute
Worktable lift strokeUp to 180 mm
Traverse stroke80 mm
Main-unit power (listed)20 kW
전체 치수2,450 × 2,000 × 2,000 mm
기계 중량3,000 kg

These are listed equipment specifications, not the recommended settings for every cut. Cutting-feed settings and electrical load calculations are confirmed in the technical agreement. No numerical thickness-tolerance claim is supplied for this model.

Machine assemblies

What controls the wire web and cutting motion?

SOMI-430 spindle and grooved roller illustration
Spindle and roller illustration from the technical presentation.

Clamped spindle and roller support

The specification describes clamped spindles with synchronized control. The roller bearings use an oil-cooled bushing arrangement to manage their operating conditions during high-speed running. Roller condition and groove selection remain part of the cutting setup.

SOMI-430 machine layout illustration
Machine layout illustration from the technical presentation.

Servo-driven feed and wire handling

Spindle rotation, wire pay-off, take-up, traverse, tension and worktable feed use servo drives and an EtherCAT control system. The axes perform different tasks: moving wire, laying it onto the spool, controlling tension and advancing the workpiece.

Process monitoring and wire-break protection

Process data such as cutting tension are monitored during operation. Depending on alarm severity, the controller warns or stops the machine; operation can resume after user confirmation. The documented wire-break protection stops the machine when a break is detected. This protective function does not replace correct setup and inspection.

Model selection

SOMI-430 or SOMI2-600S?

Start with workpiece length, then review the required process window. Both are inverted-cutting models with a listed 0.3–3 mm slice range. The larger model accommodates a longer workpiece and has a higher maximum wire speed; that does not automatically mean a shorter accepted-part cycle for your material.

모델Workpiece capacityMaximum wire speed
SOMI-430430 × 160 × 150 mm1,200 m/min
SOMI2-600S660 × 160 × 150 mm2,200 m/min

For workpieces up to 430 mm long, assess SOMI-430 first. When the same width and height must accommodate a longer charge, compare SOMI2-600S. For small laboratory batches within 200 × 200 × 200 mm, consider SOM200. For swing-assisted cutting of SiC, alumina or sapphire, compare the SOMIS-400 oscillating multi wire saw. If you need a different loading arrangement, use the complete multi wire saw model guide.

When a specification uses the term reverse cutting wire saw, confirm whether it describes upward workpiece feed or simply reciprocating wire travel. On SOMI-430, inverted cutting refers to upward workpiece feed.

Before ordering

Utilities, installation and sample cutting

Power supply, coolant, compressed air, foundation, lifting access, service space and site safety requirements are confirmed with your order — please ask us. Overall machine dimensions alone do not define the complete installation area.

For a useful trial, provide the material grade, incoming dimensions, finished-part drawing, target as-cut thickness and finishing allowance. Agree the inspection method and acceptance criteria before comparing results. Include loading, unloading and changeover when estimating production capacity.

Warranty and after-sales support

CE certified · 12-month warranty · Response within 12 hours · Free sample cutting.

Discuss your application

Send your material and target slice thickness

Share the workpiece dimensions and required result so we can review the inverted cutting multi wire saw configuration with you.

무료 샘플 절단 요청

Include with your enquiry

  • Material grade and incoming condition
  • Workpiece and fixture dimensions
  • Target thickness and finishing allowance
  • Batch size and inspection requirements
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