Double Sided Lapping Machine Series
3 Models for Sapphire, SiC & Advanced Materials
Vimfun's double sided lapping machine series delivers precision flatness ≤0.015 mm and sub-nanometer surface roughness for sapphire wafers, silicon carbide (SiC), optical filters, glass, and advanced ceramics. Three models — 13B, 16B및 22BF — cover workpiece diameters from Φ210 mm up to Φ480 mm. Formerly a qualified supplier for Biel Crystal, Foxconn, Lens Technology, and BYD.
Each double sided lapping machine in the Vimfun series uses a planetary gear drive with counter-rotating upper and lower plates, ensuring simultaneous and uniform material removal on both workpiece surfaces. The series covers compact 6-carrier systems for wafer R&D labs, mid-size production systems for 8-inch semiconductor wafers, and heavy-duty models for large ceramics and thick industrial components up to 9000 N processing force. All models support both lapping (ductile cast iron slotted plates) and polishing (SUS 410 stainless steel plates), and include optional in-process thickness measurement for closed-loop precision control.
Choose Your Double Sided Lapping Machine — 3 Models
6-carrier planetary system for sapphire wafers, optical filters, SiC substrates, and glass up to Φ210 mm. Compact footprint, ≤0.015 mm flatness, ±10 N pressure control.
- Max Workpiece Dia: Φ210 mm
- Carriers: 6 pcs
- Plate Flatness: ≤0.015 mm
- Pressure Control: ±10 N
5-carrier system with P5-grade crossed roller bearing for larger wafers and filters up to Φ390 mm. Most popular model for 8-inch SiC and sapphire production lines.
- Max Workpiece Dia: Φ390 mm
- Bearing: P5 Crossed Roller
- Plate Flatness: ≤0.015 mm
- Thickness Accuracy: ±2 μm (opt.)
Largest Vimfun lapping system. 5 carriers, 9000 N force (expandable to 12000 N), 36 kW total power. For large ceramics, thick components, and 12-inch wafer production.
- Max Workpiece Dia: Φ480 mm
- Max Processing Force: 9000 N
- Plate Flatness: ≤0.02 mm
- Total Power: 36 kW
Precision Lapping Machine Specifications — Full Comparison
Compare all 3 double sided lapping machine models side by side to select the right fit for your workpiece size, precision, and production requirements.
| 매개변수 | 13B-6LY/P Compact | 16B-5LY/P Most Popular ★ | 22BF-5LY/P Heavy-Duty |
|---|---|---|---|
| Max Workpiece Diameter | Φ210 mm | Φ390 mm | Φ480 mm |
| Max Workpiece Thickness | — | — | 45 mm |
| Plate Diameter (OD) | Φ933 mm | Φ1154 mm | Φ1492 mm |
| Number of Carriers | 6 pcs | 5 pcs | 5 pcs |
| Plate Flatness | ≤0.015 mm | ≤0.015 mm | ≤0.02 mm |
| Lower Plate Runout | ≤0.04 mm | ≤0.04 mm | ≤0.03 mm |
| Processing Force Range | 120 ~ 3500 N | — | 150 ~ 9000 N (exp. 12000 N) |
| Pressure Control Accuracy | ±10 N | ±10 N | ±20 N |
| Main Bearing Type | High-precision CRB | P5-grade CRB | High-precision CRB |
| Thickness Measurement (opt.) | ±2 μm | ±2 μm | ±0.01 mm |
| 총 전력 | 18 kW | 20 kW | 36 kW |
| 기계 무게 | ~4300 kg | ~4800 kg | ~9000 kg |
| Detailed Page | View 13B → | View 16B → | View 22BF → |
CRB = Crossed Roller Bearing · opt. = optional add-on · ★ Most popular model for semiconductor and optical applications
What Materials Can Our Double Sided Lapping Machines Process?
All 3 models support precision double-sided lapping and polishing of the following hard and brittle materials. Click each material to see the full solution including recommended machine model and process parameters.
LED substrates, optical-grade wafers, and laser sapphire. Mohs 9 hardness. Sub-nm Ra achievable. TTV <1 μm.
Sapphire Lapping Solution →SiC power device substrates for EV and renewable energy. 8-inch capability on 16B. TTV control to <1 μm.
SiC Grinding Solution →Bandpass filters, interference filters, and AR-coated substrates requiring flatness ≤0.015 mm and precision parallelism.
Optical Filter Solution →Display cover glass, borosilicate, and semiconductor packaging glass wafers. Ultra-thin 0.1 mm workpieces supported.
Glass Wafer Solution →Alumina, silicon nitride, zirconia, and AlN substrates. 22BF handles large-format and thick ceramic components up to Φ480 mm.
Ceramic Grinding Solution →Quartz crystals for frequency control, blue glass for optical components. Optional ±2 μm closed-loop thickness control.
Crystal Lapping Solution →Why Choose Vimfun Double Sided Lapping & Polishing Machines
Vimfun inherits all technical expertise from the former Jiangxi AVIC Optics — including 17 utility model and design patents, 14 software copyrights, and 4 invention patents. The technology foundation behind our double sided lapping machines has been refined over decades of precision grinding R&D.
Previously a qualified supplier for Biel Crystal, Foxconn, Lens Technology, and BYD. Our lapping and polishing machines have been validated in the most demanding high-volume production environments in China's semiconductor and 3C industries.
Vimfun manufactures its own QT500-7 ductile cast iron lapping plates using CNC double-sided grinding. Plates ship with runout ≤0.04 mm and flatness ≤0.015 mm — verified and ready to use, with no break-in dressing cycle required.
Beyond the machines, Vimfun supplies slotted lapping plates, diamond conditioning wheels, internal ring gears, sun gears, and polishing pads matched to exact model specifications. One supplier for equipment and all ongoing consumables. See our lapping accessories page.
Frequently Asked Questions — Double Sided Lapping Machine Selection
The primary selection factor is workpiece diameter. Choose the 13B-6LY/P (Φ210 mm max) for compact production lines, R&D labs, or smaller wafer formats. Choose the 16B-5LY/P (Φ390 mm max) for 6-inch or 8-inch semiconductor wafers and larger optical filters — it is the most versatile model and most widely deployed. Choose the 22BF-5LY/P (Φ480 mm max) when workpiece size exceeds Φ390 mm, thickness exceeds 25 mm, or processing force requirements exceed 3500 N for large ceramics and thick components.
Under appropriate slurry selection and polishing pad conditions, all three models achieve sub-nanometer Ra on sapphire. Combined with plate flatness ≤0.015 mm and TTV under 1 μm, this meets epi-ready and optical-grade wafer specifications. For independent research on sapphire surface preparation parameters, see ScienceDirect: Sapphire Wafer Processing.
Yes. All models ship with two interchangeable plate sets: a ductile cast iron slotted plate for lapping operations, and a SUS 410 stainless steel plate for polishing. Switching between lapping and polishing modes takes approximately 2 hours with standard tooling included with the machine.
The thickness measurement system is an optional add-on for all three models. The 13B and 16B achieve ±2 μm accuracy over a 0–25 mm range. The 22BF offers a higher-precision option at ±0.01 mm accuracy. These systems enable real-time closed-loop thickness control, stopping the machine at the target dimension without manual measurement interruptions.
Vimfun's machines deliver comparable precision specifications — flatness ≤0.015 mm, sub-nanometer Ra — at significantly lower cost than equivalent imports from Japan or Germany. Backed by AVIC Optics technology heritage and validated at Biel Crystal and Foxconn, they provide domestic Chinese pricing with full local service, spare parts support, and technical commissioning included. For an independent technical overview of double-sided lapping technology, see MDPI: Double-Sided Lapping Research.
Standard lead time is 60–90 days from order confirmation for all three models. On-site installation, machine commissioning, and operator training are included with every purchase. The 22BF-5LY/P requires a reinforced concrete foundation — Vimfun provides full foundation drawings and installation specifications as part of the pre-order technical package.
Find Your Double Sided Lapping Machine
Tell us your material, workpiece diameter, and flatness requirement — our engineers will recommend the right model and send a detailed proposal within 24 hours.
Email: daria@endlesswiresaw.com | Tel: +86 130 2773 8908