The SGC 33-250 uses a unidirectional endless loop diamond wire to crop, de-head, and sample-slice monocrystalline silicon ingots up to Φ330mm in a single integrated machine. Automation-ready design minimizes operator intervention between cuts — reducing auxiliary time, lowering labor intensity, and improving overall line efficiency.
The SGC 33-250 consolidates three ingot preparation tasks that traditionally required separate equipment or manual handling into a single automated workflow.
Cross-cuts the full silicon ingot into defined-length segments for downstream multi-wire slicing. Each crop section is precisely positioned and cut automatically by the machine's servo-driven advance system.
Removes the non-uniform head and tail portions of the ingot that cannot be used for wafer production. The loop wire cuts cleanly through the full ingot diameter without the blade deflection issues of ID saws.
Cuts thin characterization samples from the ingot for resistivity, oxygen content, and crystal quality testing before committing the full ingot to the wafer slicing line.
| No. | Parameter | Specification | Notes |
|---|---|---|---|
| 1 | Model | SGC 33-250 | Standard configuration |
| 2 | Ingot Diameter Range | Φ230 – Φ330 mm | Monocrystalline silicon ingot |
| 3 | Max Ingot Length (Standard) | 500 – 2500 mm | — |
| 4 | Max Ingot Length (Extended) | Up to 6000 mm | Extended rail configuration |
| 5 | Crop Section Length | 200 – 950 mm (auto) / 1–5 mm (sample, manual) | Servo-controlled positioning |
| 6 | Loop Wire Diameter | Φ0.38 – Φ0.5 mm | Diamond endless loop wire |
| 7 | Avg. Cutting Time (M10 silicon) | 8.5 min | Excluding auxiliary / loading time |
| 8 | Overall Dimensions (L×W×H) | 5950 × 2100 × 2700 mm | Standard rail length |
| 9 | Automation Compatibility | Yes — auto-advance between crop positions | Except sample slices and head/tail |
| 10 | Quality Certifications | ISO 9001 · CE | — |
The SGC 33-250 is designed to minimize the operator actions required between cuts. Here is how the automated cutting sequence works, and what still requires manual handling.
Operator places the ingot on the feed rail and secures the clamp. This is the primary manual step in the entire process.
Operator inputs the desired crop positions — number of sections, lengths, and head/tail removal dimensions — on the CNC control panel.
The servo-driven rail automatically advances the ingot to each programmed cut position. The loop wire cuts, retracts, and the ingot advances — all without operator intervention.
Cut segments are automatically discharged onto the output conveyor for downstream loading into multi-wire saw machines.
- Ingot advance positioning between cuts
- All standard crop cuts (200–950mm)
- Head and tail removal cuts
- Segment discharge to output conveyor
- Cut cycle repetition across full ingot length
- Initial ingot loading and clamping
- Sample slice retrieval (1–5mm pieces)
- Head and tail material removal from machine
- Ingot changeover between batches
The SGC series is sized to match your ingot diameter and line length. The two standard configurations cover the most common silicon ingot diameters — and any configuration in between can be built to order.
An endless loop wire is a continuous diamond wire formed into a closed loop that runs in a single direction around two drive wheels. Unlike multi-wire saws that use a long spool of wire threaded back and forth, the loop wire's unidirectional motion produces consistent cutting force throughout the cut. This results in a flat, perpendicular cut face with minimal bow — critical for ingot segments that will go directly into a multi-wire saw where flatness affects slice quality.
Yes. The standard machine configuration supports ingots up to 2500mm, but the feed rail can be extended to accommodate ingots up to 6000mm. This extended configuration requires a longer machine footprint — contact us with your ingot length to confirm the required machine dimensions and floor space.
The SGC 45-200 handles ingots up to Φ450mm in diameter — currently the largest standard SGC configuration. If your ingot diameter or length falls outside this range, we can engineer a custom SGC configuration. Provide your ingot diameter, length, and crop section requirements and our team will design and quote a suitable machine.
Sample slices are 1–5mm thick — too thin for the output conveyor to handle reliably without risk of breakage or misplacement. They require careful manual extraction to preserve the sample integrity for lab testing. All other operations — including all standard crop cuts and head/tail removal — are handled automatically.
Yes. The SGC is specifically designed as the upstream preparation stage before multi-wire slicing. Cropped segments from the SGC are the exact input format for Vimfun's SOM-series saws. Running both machines from the same manufacturer simplifies the interface between equipment, parameter matching, and after-sales support for your complete ingot-to-wafer line.
Tell us your ingot diameter, length, and daily volume — we'll confirm the right SGC model or design a custom configuration within 24 hours.
Email: daria@endlesswiresaw.com | Tel: +86 130 2773 8908