OUR EQUIPMENT PORTFOLIO
Equipment for Every Stage of Wafer Manufacturing
From single crystal growth to mirror-finished wafers, our equipment portfolio covers every stage of semiconductor manufacturing. Below, machines are organized by process stage — each engineered for specific material hardness, workpiece geometry, and throughput requirements.
- 방법: 연속 초크랄스키 (CCz) / H-MCZ
- 최대 용량: 1000kg (맞춤 가능)
- 최대 직경: 300 mm / 12 인치
- 균일성: < 6.0% 비저항 (RRG)
- 방법: 연속 초크랄스키 (CCz) / H-MCZ
- 최대 용량: 1000kg (맞춤 가능)
- 최대 직경: 300 mm / 12 인치
- 균일성: < 6.0% 비저항 (RRG)
Silicon ingot slicing
Slicing monocrystalline Si ingots into wafers with ultra-low kerf loss. Compatible with 6-inch to 12-inch diameters.
기계 확인
Germanium Wafer
Slicing CZ-grown germanium ingots into wafers for SiGe applications, solar cells, and detector substrates.
기계 확인
GaN & GaAs Substrate
Precision cutting of compound semiconductor crystals for RF, power, and optoelectronic device manufacturing.
기계 확인
Sapphire Wafer for LED & MEMS
Slicing C-plane and A-plane sapphire ingots into ultra-thin wafers for LED epitaxy, MEMS, and protective covers.
기계 확인
Piezoelectric Ceramic Slicing
Ultra-thin slicing of PZT, lithium niobate, and quartz crystals for sensors, transducers, and SAW filters.
기계 확인
Ultra-Thin Wafer (≤0.2mm)
Specialized SOM2-600S for ultra-thin wafer production where kerf loss control is critical.
기계 확인
SPECIALTY EQUIPMENT
For Permanent Magnet Manufacturing
Beyond semiconductor wafers, Vimfun manufactures specialized arc-form grinding machines for high-volume permanent magnet (NdFeB) motor magnet production. For our complete permanent magnet processing portfolio, please visit our dedicated site.
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