The go-to replacement for traditional ID (inner diameter) saws. Dual-station design processes two 750mm workpieces simultaneously, delivering dramatically higher throughput on large blocks and squared ingots — with tighter center-to-center wire spacing, compact low-CG frame, and the precision to satisfy the most demanding large-workpiece customers.
ID saws cut one wafer at a time with high kerf loss and slow cycle times. The SOM4-750D cuts an entire 750mm workpiece into all slices in a single pass — across two stations simultaneously. Throughput increases by orders of magnitude while kerf loss drops dramatically, lowering total cost of ownership.
Two independent workstations enable simultaneous cutting of two large 750mm × 180mm workpieces. Each station can run with independent slice thickness and feed rate parameters, enabling flexible multi-material or multi-spec production scheduling within a single machine cycle.
Compact, low-profile frame design improves mechanical rigidity and vibration dampening on large workpieces where resonance is most pronounced. Delivers superior surface finish (Ra) and tight dimensional tolerance — critical when squaring large silicon blocks or NdFeB bricks.
Single-board center-to-center distance is minimized in the dual-station layout, allowing more slices per run and reducing material waste between cuts. This is a key differentiator over older multi-wire saw architectures when processing high-value large ingots.
1.5–20 mm slice range covers both precision wafer production and coarse block-squaring applications. The SOM4-750D handles the full spectrum of large-workpiece slicing tasks that previously required multiple machine types on the factory floor.
Fully programmable cutting parameters with an intuitive touchscreen interface. Each station supports independent parameter settings, enabling operators to run different materials or slice specifications simultaneously without reconfiguration downtime.
| 아니요. | 매개변수 | 사양 | Notes |
|---|---|---|---|
| 1 | Max. Workpiece Size (L×W×H) | 750 × 180 × 150 mm × 2 | Dual-station configuration |
| 2 | Slice Thickness Range | 1.5 – 20 mm | Wafer production to block squaring |
| 3 | Groove Wheel Diameter | 160 – 180 mm | Larger wheels for large workpiece stability |
| 4 | Main Motor Power | 42 kW | — |
| 5 | Average Power Consumption | ≤ 30 kW | — |
| 6 | Overall Dimensions (L×W×H) | 2450 × 2000 × 2000 mm | Compact dual-station footprint |
| 7 | Number of Stations | 2 (Dual-Station) | Simultaneous dual-block cutting |
| 8 | 커팅 모드 | Straight-Cut (正切), 4-Axis | — |
| 9 | Compatible Materials | Si, SiC, Sapphire, GaAs, NdFeB, Ceramics, Metal | — |
| 10 | Quality Certifications | ISO 9001 · CE | — |
Squaring large polysilicon and monocrystalline silicon ingots for PV and semiconductor substrate production. The SOM4-750D's 750mm capacity covers oversized silicon blocks that smaller models cannot handle.
Slicing large SiC boules and blocks into power device substrates. Low kerf loss is critical for expensive SiC material — the dual-station setup maximizes yield per boule.
Batch slicing large sapphire boules into LED substrates and optical-grade wafers. 750mm capacity accommodates the largest commercially available sapphire boule sizes.
High-volume slicing of large NdFeB sintered blocks into thin magnet segments for EV traction motors, wind turbine generators, and industrial servo motors.
Precise slicing of large GaAs and InP ingots for high-frequency RF devices and photonic components. Dual-station design doubles output for high-demand compound semiconductor facilities.
Alumina, zirconia ceramic slabs and large-format molybdenum and tungsten alloy plates for structural and high-temperature applications.
| 기능 | SOM4-630D | SOM4-750D ★ | SOM4-1000D | SOMS3-430S |
|---|---|---|---|---|
| Max Workpiece | 630 mm ×2 | 750 mm ×2 | 1000 mm ×2 | 430 mm |
| Min Slice Thickness | 1.5 mm | 1.5 mm | 1.5 mm | 0.5mm |
| Groove Wheel Dia. | 140–160 mm | 160–180 mm | 140–160 mm | 140–160 mm |
| Main Power | 38 kW | 42 kW | 85 kW | — |
| Avg. Power (kW) | ≤ 15 | ≤ 30 | ≤ 30 | ≤ 15 |
| Station Count | Dual | Dual | Dual | Single |
| ID Saw Replacement | ✓ | ✓ Best fit | ✓ | ✗ |
| Best For | High-efficiency dual-station | Large workpiece + ID saw replacement | Largest capacity, max volume | Ultra-hard thin slice |
Built in-house at our Shanghai facility. No intermediary markup — factory pricing with direct engineering access and full process customization for your specific workpiece geometry.
Installed at leading silicon, SiC, NdFeB, and sapphire manufacturers across China. The SOM4-750D is validated in demanding high-volume production environments where large workpiece consistency is non-negotiable.
Vimfun has guided numerous customers through the transition from traditional ID saws to the SOM4-750D. We provide ROI analysis, parameter migration support, and training to ensure a smooth cutover with minimal production downtime.
Vimfun supplies precision diamond wire matched to SOM4-750D's 160–180mm groove wheel specifications — single-source supply ensures optimal wire-to-wheel compatibility and repeatable cutting quality.
Traditional ID saws cut one wafer per cycle with a single rotating blade, resulting in slow throughput and high kerf loss. The SOM4-750D cuts an entire large workpiece (up to 750mm) into all wafers simultaneously in a single multi-wire pass — across two stations at once. Throughput increases by 10–50× depending on slice count, while kerf loss is reduced to the wire diameter (typically 0.1–0.3mm) versus ID saw kerf of 0.3–0.5mm per cut.
Yes. Each station can be programmed with independent slice thickness, feed rate, and material type parameters — enabling flexible production scheduling. For example, one station can be running a silicon block while the other runs an NdFeB brick, optimized for each material's cutting requirements.
Both are 4-axis dual-station straight-cut models. The SOM4-750D handles larger workpieces (750mm vs 630mm), uses larger groove wheels (160–180mm vs 140–160mm) for better stability on oversized material, and has a higher main motor power (42 kW vs 38 kW). Average power consumption is also higher (≤30 kW vs ≤15 kW). Choose the SOM4-750D when your workpiece length exceeds 630mm or when you are replacing ID saws on large-format production lines.
Silicon, polysilicon, SiC, sapphire, GaAs, germanium, NdFeB magnets, industrial ceramics (alumina, zirconia), and hard metals (molybdenum, tungsten alloy). Slice thickness 1.5–20mm covers both precision wafer production and coarse block squaring. For thinner slices (0.5–3mm), the SOMS3-430S or SOM2-600S are recommended.
Standard lead time is 60–90 days from order confirmation. On-site installation, commissioning, and operator training are included with every machine. Contact us for expedited delivery options or to discuss site preparation requirements for your facility.
Tell us your workpiece dimensions, material type, and current cutting method — our engineers respond within 24 hours with a customized proposal and ID saw migration analysis.
Email: daria@endlesswiresaw.com | Tel: +86 130 2773 8908