Category: Products
FULL EQUIPMENT PORTFOLIO
Crystal Growth and Wafer Manufacturing Equipment by Process Stage
Vimfun manufactures the full equipment chain for semiconductor wafer manufacturing — from single crystal ingot growth to mirror-finished polished wafers. Our catalog includes crystal growth furnaces (CCz / Kyropoulos methods), multi-wire diamond saws for high-throughput wafer slicing, double-sided lapping and polishing machines for sub-micron flatness, and a complete consumables supply (diamond wire loops).
- Max Workpiece Length (mm): 430*160*150
- Slicing Thickness (mm): 0.5-3mm
- Swing Cut
- Super Hard Cutting
Two-axis single-workstation inverted cutting. 660 × 160 × 150 mm blank capacity, 0.3–3 mm slice range and maximum 2,200 m/min reciprocating wire speed.
- Max Workpiece Length (mm): 400
- Max Workpiece Width (mm): 400
- Max Workpiece Height (mm): 350
- Cutting Tool: Endless Wire
- Max Workpiece Length (mm): 200
- Max Workpiece Width (mm): 200
- Max Workpiece Height (mm): 200