Process Coverage
The machine line covers high-precision lapping, polishing and grinding after slicing or forming. It is designed to improve surface quality, thickness consistency and geometry accuracy before downstream inspection, coating or assembly.
For wafer-like parts requiring parallelism, controlled thickness and stable plate flatness.
For surface finishing of ceramic, sapphire, semiconductor and hard brittle components.
For inner and outer arc profiles on ferrite magnets and curved magnetic parts.
Configurable stations, carriers and processing pressure for batch manufacturing.
Machine Models
Click any machine image or button to open the corresponding product detail page.
Materials & Applications
Select machine configuration according to material size, target flatness, surface finish, pressure control and production takt time.
Discuss Your ProcessWhy Choose Our Machines
Designed for hard material finishing where vibration control and processing stability matter.
Supports repeatable lapping and polishing force for thickness and surface consistency.
Choose two-station, four-station or carrier-based solutions according to capacity needs.
Machine selection can be matched with part size, material, target flatness and line output.
Get the right machine
Send your material, workpiece size, target flatness, surface finish and required capacity. Our team will help match the suitable lapping, polishing or arc grinding machine.
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