Complete Equipment Catalog for Semiconductor Wafer Manufacturing

FULL EQUIPMENT PORTFOLIO

Crystal Growth · Cutting · Lapping · Polishing — Four Process Stages, One Supplier

Vimfun manufactures the full equipment chain for semiconductor wafer manufacturing — from single crystal ingot growth to mirror-finished polished wafers. Our catalog includes crystal growth furnaces (CCz / Kyropoulos methods), multi-wire diamond saws for high-throughput wafer slicing, double-sided lapping and polishing machines for sub-micron flatness, and a complete consumables supply (diamond wire loops).
inner and outer arc grinding machine VMG-290

2 Station Grinding Machine

  • 2 station
  • Workpiece Length:10–70 mm
  • Workpiece Width: 10-90 mm
  • 15 pcs/min
Get a Quote
Tile Magnet Grinding Machine

Arc Magnet Grinding Machine

  • 4 station
  • Workpiece Length:10–70 mm
  • Workpiece Width: 10-90 mm
  • 15 pcs/min
Get a Quote
22BF-5LY Double Sided Polishing Machine

Double sided polishing

  • Max Workpiece Dia (mm): Φ480
  • Max Processing Force: 9000 N
  • Plate Flatness: ≤0.02 mm
  • Total Power: 36 kW
Get a Quote
industrial Lapping Machine

Lapping Machine

  • Max Workpiece Dia (mm): Φ390
  • Bearing: P5 Crossed Roller
  • Plate Flatness: ≤0.015 mm
  • Thickness Accuracy: ±2 μm (opt.)
Get a Quote
Lapping Machine-13B-6LY_P

Polishing Machine

  • Max Workpiece Dia (mm): Φ210
  • Carriers: 6 pcs
  • Plate Flatness: ≤0.015 mm
  • Pressure Control: ±10 N
Get a Quote
Scroll to Top
Contact the Vimfun Team
Need a quote, support, or partnership discussion? Let’s connect.

Request a Quote！

Want pricing or customization options for this model? Fill out the form below and we’ll get back to you with a detailed offer.