SH60-R Rotierende Diamant-Seilsäge

The SH60-R is a high-capacity horizontal diamond wire saw designed for rotary cutting of large, hard, and brittle materials such as sapphire, quartz, ferrites, ceramics, and composite oxides. Its robust structure, powerful drive, and pneumatic tensioning system enable continuous wire rotation for smooth slicing and shaping of cylindrical or irregular workpieces.
Wesentliche Merkmale
- Endloses Diamantdrahtschneiden
Utilizes a high-speed endless diamond wire system for stable, smooth, and chip-free cutting of fragile graphite materials. Low Kerf Loss, High Precision
Achieves clean slicing with kerf widths as narrow as 0.4 mm, minimizing material waste and reducing edge damage.- Ultra-Low Cutting Force
Abrasive cutting method reduces mechanical stress on delicate edges, preventing chipping or microfractures. - Simple Slice-Only Configuration
This machine is optimized for straight slicing only, ensuring maximum mechanical stability and throughput for high-volume production. Rotary Cutting Mode: Workpiece rotates continuously during cutting for smoother surface finish
Large Cutting Size: Supports up to Ø600 mm diameter × 500 mm height
High-Precision Construction: Flatness accuracy up to ≤ 0.1 mm, surface roughness ≤ Ra 0.8 μm
Heavy Load Capacity: 500 kg worktable with IP55-rated sealed structure
Endless Diamond Wire System: Smooth, closed-loop wire motion avoids vibration
Oil Cooling with Mist Collection: Prevents dust dispersion and ensures clean operation
Independent PLC System: Intuitive panel control, no external PC required
TECHNISCHE SPEZIFIKATION
| Parameter | Wert |
|---|---|
| Machine Dimensions | 1646 × 1733 × 2010 mm |
| Worktable Size | Ø600 mm |
| Max Cutting Area | Ø600 mm × 500 mm height |
| Travel Range | Ø635 mm × 505 mm |
| Cutting Accuracy (Flatness) | ≤ 0.1 mm |
| Surface Roughness | ≤ Ra 0.8 μm |
| Max Load Capacity | 500 kg |
| Hauptmotorleistung | 0.75 kW, 2800 rpm |
| Drahtdurchmesser | 0.35 – 0.8 mm |
| Drahtlänge | ~3710 mm |
| Drahtgeschwindigkeit | Up to 84 m/s (adjustable) |
| Tension Method | Pneumatic |
| Drive Motor | Asynchronous motor |
| Drive Type | 4-motor drive |
| Kontrollsystem | SHTC T30 PLC (independent operation) |
| Stromversorgung | Single-phase 220V / 50Hz |
| Installed Power | 3.2 kW |
| Dust & Mist Collection | Oil-cooled, mist-recycling system |
| Protection Grade | IP55 |
| Maschine Gewicht | Approx. 1250 kg |
VIDEO-VORFÜHRUNG

COMPARISON OF THE CUT SURFACE EFFECT

TECHNOLOGIEVERGLEICH
Rotary Diamond Wire Cutting vs. Flat Slicing and Blade Systems
For large and dense ceramic or magnetic components, conventional cutting methods often fail:
Flat slicing causes uneven pressure and surface distortion
Blades introduce microcracks and are prone to quick wear
EDM systems are slow and can’t process non-conductive materials
Die SH60-R’s rotary design allows:
Constant wire-to-material contact and uniform force distribution
Continuous cutting across all angles without stopping rotation
Cleaner edges, reduced stress, and longer consumable life
This makes it the optimal solution for cutting round, curved, or cylindrical hard materials.
TYPICAL APPLICATIONS OF THIS GRAPHITE BOAT CUTTING MACHINE
Ferrite Magnetic Cylinders
Cutting round ferrite magnets for industrial motors, sensors, and transformers
Alumina Ceramic Rods
Shaping insulation-grade alumina cylinders for power electronics
PZT Piezoelectric Blanks
Rotary slicing of piezoelectric blocks for high-performance actuator production
Sapphire and Quartz Tubes
Processing precision sapphire and quartz materials for optics and photonics
Composite Ceramics and Oxides
Cutting large hybrid materials in aerospace and defense applications
HINWEIS ZUR PRODUKTVERFÜGBARKEIT
The equipment models listed on this website represent only a selection of our full product range.
For each type of diamond wire slicing machine or semiconductor cutting equipment, we offer größere Größen, kundenspezifische Konfigurationenund anwendungsspezifische Designs basierend auf Kundenbedürfnissen.
Wenn Ihre Material-, Größen- oder Prozessanforderungen nicht von den aufgeführten Produkten abgedeckt werden, kontaktieren Sie uns bitte direkt. Unser Ingenieurteam wird die am besten geeignete Lösung für Ihre Anwendung empfehlen oder anpassen.
WARUM SIE UNS WÄHLEN
Endloses Hochgeschwindigkeits-Drahtschneiden
Hochstabile Gussstruktur
Hochpräzise Führungsschienen und Kugelumlaufspindel
Automatisches Konstantspannungssystem
Vorschubsteuerung auf Mikron-Ebene
Benutzerfreundliches Smart Interface
Vollständig geschlossene Schutzkonstruktion (optional)
Geringe Wartung und Kosteneffizienz
Modularer Aufbau
Geringe Wartung und Kosteneffizienz
Automatisches Abschmiersystem
Erfahrungsberichte von Kunden
Semiconductor Material Cut
Häufig gestellte Fragen
Welche maximale Dicke kann die Maschine beim Schneiden verarbeiten?
Was ist der Unterschied zwischen dieser Seilsäge und der BANDSÄGE?
Die Schnittgeschwindigkeit wäre ähnlich, aber die Schnittflächenqualität der Seilsäge ist viel besser und der Schnittfugenverlust ist geringer.