Precision Surface Processing
Double Sided Grinding Machine
3 models covering Φ210 mm to Φ480 mm workpieces. Flatness ≤ 0.015 mm, pressure control ±10 N, sub-nanometer Ra surface — for SiC wafers, sapphire, optical glass, and advanced ceramics.
High-Precision Double Sided Grinding Machine for Advanced Materials
A double sided grinding machine simultaneously processes both faces of a workpiece between two counter-rotating lapping plates, achieving flatness and parallelism that single-sided methods cannot match. Vimfun's planetary-drive series is purpose-built for hard, brittle, and high-value materials: silicon carbide (SiC) wafers, sapphire substrates, optical filters, alumina ceramics, crystal quartz, and precision mechanical components.
Each model uses a high-precision crossed roller bearing as the main spindle bearing — the same bearing class found in German and Japanese machine tool spindles. The planetary carrier system (sun gear + ring gear + planet carriers) ensures even pressure distribution across all workpieces simultaneously, eliminating the edge rolloff and flatness drift common in conventional single-axis grinding.
Vimfun's double sided grinding machine line inherits the complete R&D base of AVIC Jiangxi Optoelectronics, with 35+ patents and proven deployments at BYD, Foxconn, Lens Technology, and Bill Crystal. Whether your application demands TTV control for next-generation SiC power devices or flatness for precision optics, there is a Vimfun model matched to your production scale.
Choose Your Double Sided Grinding Machine
Compact Series
13B-6LY/P
6-Carrier · Max Φ210 mm · R&D & Small Batch
Max workpiece dia.Φ210 mm
Plate flatness≤ 0.015 mm
Processing force120–3500 N
Pressure control±10 N
Thickness accuracy±2 μm (opt.)
Total power18 kW
Machine weight~4,300 kg
Best for: optical filters, sapphire wafers ≤ 8-inch, SiC substrates, R&D labs and small production batches
El más popular
Mid-Size Series
16B-5LY/P
5-Carrier · P5 Bearing · Max Φ390 mm
Max workpiece dia.Φ390 mm
Plate flatness≤ 0.015 mm
Bearing gradeP5 crossed roller
Pressure control±10 N
Thickness accuracy±2 μm (opt.)
Total power20 kW
Machine weight~4,800 kg
Best for: 12-inch wafer production, large optical glass, industrial ceramics, mid-to-high volume semiconductor lines
Heavy-Duty Series
22BF-5LY/P
5-Carrier · Max Φ480 mm · 9000 N Force
Max workpiece dia.Φ480 mm
Plate flatness≤ 0.02 mm
Max force9000 N (→12000)
Pressure control±20 N
Thickness accuracy±0.01 mm (opt.)
Total power36 kW
Machine weight~9,000 kg
Best for: large ceramic blocks, thick mechanical components, heavy industrial production at maximum scale
Full Specification Comparison — All 3 Double Sided Lapping Machine Models
| Parámetro | 13B-6LY/P | 16B-5LY/P ⭐ | 22BF-5LY/P |
|---|---|---|---|
| Diámetro Máximo de Pieza de Trabajo | Φ210 mm | Φ390 mm | Φ480 mm |
| Grosor Máx. de Pieza | 25 mm | 25 mm | 45 mm |
| Planitud de la placa inferior | ≤ 0.015 mm | ≤ 0.015 mm | ≤ 0.02 mm |
| Rango de Fuerza de Procesamiento | 120–3500 N | — | 150–9000 N |
| Precisión de control de presión | ±10 N | ±10 N | ±20 N |
| Main Bearing | Crossed roller | P5 crossed roller | Crossed roller |
| Medición de espesor (opcional) | ±2 μm | ±2 μm | ±0,01 mm |
| Número de Portadores | 6 piezas | 5 piezas | 5 piezas |
| Plate OD | Φ933 mm | Φ1154 mm | Φ1492 mm |
| Potencia total | 18 kW | 20 kW | 36 kW |
| Peso de la máquina | ~4,300 kg | ~4,800 kg | ~9,000 kg |
Materials Processed by Vimfun Double Sided Lapping Machines
Obleas semiconductoras
SiC (silicon carbide), Si (silicon), GaAs — precision lapping to TTV < 1 μm for power device and IC production. → Semiconductor solutions
Sustratos de Zafiro
LED-grade and optical-grade sapphire wafers. Sub-nanometer Ra surface roughness with diamond slurry on the double sided lapping machine. → Sapphire solutions
Optical Glass & Filters
Optical filter glass, blue glass substrates, BK7, fused silica. Flatness ≤ 0.015 mm for interference-quality surfaces in optical systems.
Cerámica avanzada
Alumina (Al₂O₃), silicon nitride (Si₃N₄), zirconia, AlN substrates. The 22BF handles large ceramic blocks up to Φ480 mm at 9000 N. → Ceramics solutions
Crystal & Quartz
Quartz wafers, piezoelectric crystals (LiNbO₃, LiTaO₃), optical crystals. Flatness and parallelism directly affect resonant frequency consistency.
Precision Mechanical Parts
Bearing rings, seal faces, valve plates, and carbide components. The 22BF's 12,000 N expandable force handles hardened steels and cemented carbides.
Why Choose Vimfun Double Sided Lapping Machine
Full Technology Inheritance from AVIC
Inherits the complete R&D and manufacturing base of AVIC Jiangxi Optoelectronics — the original developer of this planetary lapping architecture in China.
Planitud de Placa Reparable en Campo
All models ship with field-repairable lapping plates. Flatness drift can be corrected on-site without returning the machine — minimizing production downtime.
Independent 4-Axis VFD Speed Control
Lower plate, upper plate, outer ring gear, and sun gear are each independently variable-frequency driven for full lapping kinematic control across all materials.
In-Process Thickness Measurement
Optional real-time thickness monitoring at ±2 μm (13B/16B) or ±0.01 mm (22BF). Closed-loop control stops automatically at target thickness — no manual gauge checks needed.
Cadena de suministro completa de consumibles
Vimfun supplies matching lapping accessories: slotted carriers, diamond conditioning wheels, ring gears, and polishing pads — all matched to exact machine specifications.
Breaks the Import Equipment Monopoly
High-precision double sided lapping machines were previously dominated by SPEEDFAM (Japan) and German systems. Vimfun delivers equivalent precision at significantly lower total cost, with local service and rapid spare parts supply.
Preguntas frecuentes
What is the difference between lapping and polishing on these machines?
Lapping uses a cast iron plate with free abrasive slurry (diamond or SiC) to remove material and establish flatness. Polishing uses a softer plate (polyurethane pad or stainless steel) with fine diamond suspension to achieve the final surface finish (Ra). Both operations run on the same machine with a plate changeover of approximately 2 hours. For semiconductor wafer manufacturing, lapping establishes flatness and TTV first, followed by polishing to the required Ra for downstream CMP or epitaxy.
Which double sided lapping machine model is right for SiC wafer production?
For 4-inch and 6-inch SiC wafers the 16B-5LY/P is the most common choice — P5-grade bearing stability delivers TTV < 1 μm results. For 8-inch SiC or high-volume 6-inch batches, the 22BF-5LY/P is recommended. For R&D labs processing 2–4 inch material the 13B-6LY/P offers the lowest entry cost with full flatness performance. See our semiconductor wafer processing solutions page for detailed process parameters.
What flatness can a double sided lapping machine achieve?
The 13B and 16B achieve lower plate flatness ≤ 0.015 mm as standard. With optimized slurry and carrier parameters, workpiece flatness within 1–2 μm and TTV under 1 μm are routinely achieved. For flatness measurement standards, see ScienceDirect: Estándares de planitud óptica. The 22BF achieves ≤ 0.02 mm, appropriate for large-format ceramics and thick components.
Can the machine process ultra-thin workpieces (0.1 mm)?
Yes. Vimfun's double sided lapping machine series has demonstrated successful processing of workpieces as thin as 0.1 mm using slotted carrier plates with appropriate backing support. Ultra-thin processing requires carrier slot design matched to workpiece material — Vimfun's engineering team provides carrier specifications as part of the application review for thin-workpiece orders.
What consumables and accessories are required?
Primary consumables are: (1) lapping slurry or polishing suspension matched to your material, (2) carrier plates (slotted plates) sized to your workpiece, (3) diamond conditioning wheels for plate dressing, and (4) polishing pads for the polishing step. Vimfun supplies all of these through our lapping accessories program, with specifications matched to each model to eliminate compatibility issues.
Ready to Select Your Double Sided Grinding Machine?
Send your workpiece specs and production targets — our engineers review your application and recommend the right model and process parameters before you commit.
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