In the semiconductor wafer manufacturing industry, long-term asset value is defined by equipment flexibility and process precision. The KX240MCZR series semiconductor crystal growing furnace is engineered to adapt to rapidly changing market demandsKX240MCZR. By easily accommodating various hot zone sizes, this system ensures your investment remains at the forefront of technology throughout its entire lifecycle.
1. Exceptional Multi-Specification Compatibility
The KX240MCZR is designed to produce high-quality single crystal silicon ingots across a range of industry-standard diameters, supporting applications from power devices to advanced IC fabrication:
- Crystal DiametersCrystal Diameters: Capable of growing ingot diameters of 8″ (200 mm), 10″ (250 mm), and 12″ (300 mm)8″ (200 mm)10″ (250 mm)12″ (300 mm).
- Precision Lifting SystemsPrecision Lifting Systems: Features a seed lift rate of 0-508 mm/hr and a crucible lift rate of 0-127 mm/hr for meticulous process control0-508 mm/hr0-127 mm/hr.
- Chamber SpecificationsChamber Specifications: Standard furnace chamber diameter of 1100 mm (43.3 in) with an optional 1200 mm (47.2 in) configuration for larger scale production1100 mm (43.3 in)1200 mm (47.2 in).
2. Magnet-Ready and Energy-Efficient Design
To achieve the ultra-low oxygen content and superior resistivity uniformity required for semiconductor-grade wafers, the KX240MCZR integrates advanced control technologiesTo achieve the ultra-low oxygen content and superior resistivity uniformity required for semiconductor-grade wafers, the KX240MCZR integrates advanced control technologies:
- Cusp Magnet TechnologyCusp Magnet Technology: The system is magnet-ready, with options including a 1,000-gauss resistive cusp magnet to effectively suppress melt convection1,000-gauss resistive cusp magnet.
- Low Power ConsumptionLow Power Consumption: An optimized control system not only enhances crystal quality but also significantly reduces operational power consumption, optimizing overall production costs.
3. Enhanced Throughput with Xtramelt™ Technology
In conjunction with the Xtramelt™ feeder, the KX240MCZR significantly boosts single-run charge capacity, supporting various crucible configurations to maximize yieldXtramelt™ feeder:
| Crucible Diameter | Crucible Height | Nominal Charge Size |
|---|---|---|
| 24.0 in | 343 mm (13.5 in) | 220 kg |
| 26.0 in | 483 mm (19.0 in) | 300 kg |
| 28.0 in | 496 mm (19.5 in) | 350 kg |
4. Modular Customization and Intelligent Integration
The equipment offers industry-leading modular options to fit specific facility requirements and Industry 4.0 standardsThe equipment offers industry-leading modular options to fit specific facility requirements and Industry 4.0 standards:
- Spatial AdaptationSpatial Adaptation: Standard receiving chamber height is 4000 mm, with optional field-upgrades available for 3500 mm and 3000 mm heightsSpatial Adaptation: Standard receiving chamber height is 4000 mm, with optional field-upgrades available for 3500 mm and 3000 mm heightsSpatial Adaptation: Standard receiving chamber height is 4000 mm, with optional field-upgrades available for 3500 mm and 3000 mm heights4000 mm3500 mm3000 mm.
- Throat DiameterThroat Diameter: Standard 350 mm (13.8 in), with an optional 400 mm (15.7 in) upgrade availableThroat Diameter: Standard 350 mm (13.8 in), with an optional 400 mm (15.7 in) upgrade available350 mm (13.8 in)400 mm (15.7 in).
- Digital ManagementDigital Management: Integrated communications are available via the optional WINGS system for comprehensive production monitoringWINGS system.
5. Integrated Semiconductor Production Line Solutions
Producing a high-quality silicon ingot is only the first step. To transform these ingots into high-precision wafers, we provide a complete range of downstream processing equipment:
- Precision Slicing: Utilize our Mehrdraht-SägemaschinenMehrdraht-Sägemaschinen for high-speed, low-loss wafering of 12-inch ingots.
- Surface Preparation: Ensure every wafer meets nanometer-scale flatness and surface quality requirements with our specialized Grinding MachinesGrinding Machines.
Technical StatementTechnical Statement: The specifications above are based on KX240MCZR technical data as of April 2023. All specifications are subject to change without notice.
