SOM4-630D Multi-Wire Saw – Dual-Ingot 630mm Slicing Machine
The SOM4-630D is a 4-axis dual-station multi-wire saw machine designed for high-throughput silicon ingot, SiC, and sapphire wafer slicing. With two workpiece stations running simultaneously, it delivers exceptional productivity — cutting two 630×160×150mm ingots per cycle with an average arc-out time of less than 10 minutes.
Key Features
- 🔹 Dual-Station Design: Two 630mm workpiece stations process ingots simultaneously — doubles output vs. single-station machines
- 🔹 Fast Arc-Out Time: Average arc-out time <10 minutes — minimizes idle time between cuts
- 🔹 Wide Slice Range: Slice thickness 1.5–20 mm, covering both wafer production and block squaring
- 🔹 38kW Main Drive: Delivers stable cutting force for hard materials including SiC and sapphire
- 🔹 Energy Efficient: Average power consumption ≤15 kW despite high-capacity dual-station operation
- 🔹 Precision Groove Wheels: 140–160mm diameter groove wheels for accurate wire pitch and consistent slice thickness
- 🔹 CNC Control System: Fully programmable cutting parameters with touchscreen interface
- 🔹 Stable Rigid Frame: Low center-of-gravity design minimizes vibration for superior surface quality
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SOM4-630D TECHNICAL SPECIFICATION
| No. | Parameter | Specification |
| 1 | Max. Workpiece Size (L×W×H mm) | 630 × 160 × 150 (×2 stations) |
| 2 | Slice Thickness Range (mm) | 1.5 – 20 |
| 3 | Groove Wheel Diameter (mm) | 140 – 160 |
| 4 | Main Motor Power (kW) | 38 |
| 5 | Average Power Consumption (kW) | ≤ 15 |
| 6 | Machine Dimensions L×W×H (mm) | 2450 × 2000 × 2000 |
| 7 | Number of Stations | 2 (Dual-Station) |
| 8 | Cutting Mode | Forward-cut (正切), 4-axis |
| 9 | Average Arc-Out Time | < 10 minutes |
| 10 | Compatible Materials | Silicon, SiC, Sapphire, GaAs, NdFeB, Ceramics |
TYPICAL APPLICATIONS
- Slicing polysilicon ingots into wafers for solar cell manufacturing
- Cutting silicon carbide (SiC) blocks into substrates for power semiconductors
- Batch processing sapphire boules into LED and optical wafers
- Slicing GaAs and InP compound semiconductor ingots for high-frequency devices
- High-volume NdFeB permanent magnet block slicing for motor manufacturing
- Industrial ceramic slab production from alumina and zirconia blocks
MULTI-WIRE SAW ADVANTAGES OVER ID SAWS AND BAND SAWS
- ⚠️ ID Saw: Blade size limits max ingot diameter; high tool cost; cuts one wafer at a time.
- ⚠️ Band Saw: High kerf loss and poor surface quality; requires extensive post-processing.
- ⚠️ Reciprocating Wire Saw: Speed limited by reversal cycles; surface waviness from direction changes.
- ✅ SOM4-630D: Cuts full ingot into all wafers in one pass. Low kerf, high surface quality, dual-station doubles throughput.
WHY CHOOSE VIMFUN SOM4-630D
- Manufacturer-Direct: Built in-house at our Shanghai facility — no intermediary markup
- Proven at Scale: Installed at leading silicon and SiC manufacturers across 18+ provinces in China
- Full Process Support: On-site commissioning, parameter optimization, operator training included
- Consumable Supply: Vimfun supplies matching endless diamond wire loops optimized for SOM4-630D groove wheel specs
FREQUENTLY ASKED QUESTIONS
Q: What materials can the SOM4-630D cut?
Silicon, polysilicon, SiC, sapphire, GaAs, germanium, NdFeB magnets, alumina ceramics, and quartz crystal.
Q: What is the minimum slice thickness?
1.5 mm. For thinner slices (0.3–3mm), see the SOM2-600S.
Q: Can both stations run independently?
Yes. Each station can be programmed with independent slice thickness, feed rate, and material type.
Q: What is the delivery lead time?
60–90 days from order confirmation. Contact us for rush delivery options.
Q: Is on-site installation included?
Yes. Installation, commissioning, and operator training are included with every purchase.
RELATED PRODUCTS
Compare our full multi-wire saw lineup: SOMS3-430S (430mm compact) | SOM4-750D (750mm, ID saw replacement) | SOM4-1000D (1000mm, maximum capacity)
Also see: Diamond Wire for Semiconductor Cutting | Spiral-Coated Endless Diamond Wire