12-inch MCZ Crystal Puller for 300mm Wafers | KX360MCZ — Vimfun
Crystal Growing / MCZ Series / 12-inch Semiconductor Grade

KX360MCZ

12-inch MCZ Crystal Puller for 300mm IC-Grade Silicon

The KX360MCZ is a 12-дюймовая установка для выращивания кристаллов MCZ engineered to grow 300mm COP-free monocrystalline silicon ingots for IC-grade wafer manufacturing. A horizontal superconducting magnetic field suppresses melt convection during growth, while the 316L mirror-polished chamber and ±0.05mm vision-based diameter control deliver the defect profile required for advanced logic and memory wafer fabs.

12-inch COP-Free Horizontal SC Magnet Φ1400mm Chamber One-Click Recipe 316L Mirror Polished
12
Max Crystal Diameter
300mm
COP-Free IC-Grade Si
±0.05
Diameter Control mm
FIG. 01 / KX360MCZ
REV. A · 2026
12-INCH MCZ PULLER
VIMFUN /SEM
KX360MCZ 12-inch MCZ crystal puller for 300mm COP-free semiconductor silicon ingots
[ 01 ] CHAMBER
Φ1400 mm
Inner diameter, 316L mirror polished
[ 02 ] PULL HEIGHT
3500–5000
Pull chamber height (mm), customizable
[ 03 ] HOT ZONE
32″ – 36″
Configurable hot zone size range
[ 04 ] MAGNET
H-MCZ
Horizontal superconducting (standard)
[ 02 ] / PRODUCT STORY
Why MCZ at 300mm

Built for COP-Free Wafers.
Optimized for Advanced Nodes.

Standard Czochralski pullers run into hard limits at 300mm. Natural melt convection at this diameter introduces oxygen striations and microdefects that disqualify the crystal for advanced logic and DRAM. The KX360MCZ adds a horizontal superconducting magnetic field — the same approach used at the world's leading 12-inch IC fabs — to actively suppress convection in the molten silicon. The result: COP-free crystal sections long enough for production-scale wafer slicing, with the oxygen control needed to hit modern wafer specs. The KX360MCZ as a 12-дюймовая установка для выращивания кристаллов MCZ is engineered specifically for this challenge.

±0.05мм
Diameter Control Accuracy
Vision-based diameter measurement combined with closed-loop pull rate and heater power control. Tighter than what a thermocouple-only feedback loop can achieve, and the difference shows up directly in usable wafer yield after grinding.
Φ1400мм
Chamber Inner Diameter
Sized to accommodate hot zones from 32″ to 36″, with field-configurable geometry for different oxygen and resistivity targets.
H-MCZ
Horizontal Superconducting Magnet
Standard configuration. Software and hardware interfaces are compatible with both domestic and imported magnet platforms — relevant if you have a preferred magnet supplier or an existing service contract you want to keep.
[ 03 ] / ENGINEERING DETAILS
Decisions That Matter on Long Pulls

Engineered for the things that break yield in production.

01 / FRAME

FEA-Validated Frame Structure

The full-system frame is FEA-modeled for resonance modes during meltdown and growth. Vibration leakage into the seed shaft is the silent killer of crystal yield — the structural mass and damping geometry here is engineered to keep low-frequency vibration out of the melt.

02 / CHAMBER

316L Mirror-Polished Growth Chamber

316L stainless inner walls, 360° mirror polished. The polish isn't cosmetic — particle adhesion drops sharply on a Ra <0.4μm surface, which makes between-batch chamber cleanup faster and reduces particulate inclusions in the next pull.

03 / CONTROL

±0.05 mm Diameter Control

Vision algorithm plus control loop hold the crystal body diameter within ±0.05mm of recipe target. Loose diameter control means more grind-down loss when the ingot hits the cropper. ±0.05mm preserves usable diameter for downstream slicing.

04 / SOFTWARE

One-Click Growth Recipes

Dip, neck, shoulder, body, and tail run as a single recipe. Operator intervention is reserved for exception handling — alarm response, recovery, recipe modification — not routine phase transitions. Reduces operator-induced variation across shifts.

05 / MAGNET I/F

Magnet-Platform Agnostic

Software and hardware interfaces are pre-configured to accept domestic Chinese, Japanese, and European superconducting magnet platforms. If you have an existing magnet service relationship, the puller integrates rather than forcing a vendor change.

06 / PRESSURE

Wide-Range Pressure Control

High-resolution butterfly valve plus mass flow controller plus active self-cleaning exhaust filter. The active filter matters: a passive filter clogs with SiO smoke during a long pull and chamber pressure drifts. Self-cleaning keeps argon flow stable for 100+ hour pulls.

07 / OPTION

Adjustable Heater Lift [OPT]

Optional heater lift mechanism gives the recipe an additional axis to tune. Useful when optimizing oxygen profile or thermal gradient at the solid-liquid interface — particularly for non-standard hot zones or new crystal recipes.

— SUMMARY

"The features that actually move yield are the ones nobody puts on a spec sheet — vibration damping, chamber finish, filter self-cleaning."

[ 04 ] / TECHNICAL SPECIFICATIONS
Datasheet

Технические характеристики

DOC   KX360MCZ-DS-A REV   A DATE   2026.05
● ACTIVE
# Параметр Технические характеристики
01Max Crystal Diameter12 inch (300 mm)
02Приложение12-inch MCZ crystal puller for IC-grade 300mm COP-free silicon
03Chamber Inner DiameterΦ1400 mm
04Pull Chamber Height3500 – 5000 mm (custom)
05Pull Chamber DiameterΦ400 mm
06Hot Zone Size Range32″ – 36″
07Magnetic Field TypeHorizontal superconducting (standard); other types on request
08Diameter Control Accuracy±0.05 mm
09Chamber Material316L stainless steel, 360° mirror polished
10Heater Peak PowerContact us for detailed specifications
11Heater Continuous PowerContact us for detailed specifications
12Max Silicon Charge WeightContact us for detailed specifications
13Crucible DiameterContact us for detailed specifications
14Pull Rate RangeContact us for detailed specifications
15Vacuum Level (base pressure)Contact us for detailed specifications
16Argon Flow RangeContact us for detailed specifications
17Magnetic Field StrengthContact us for detailed specifications
18Heater Power SupplyContact us for detailed specifications
19Cooling Water RequirementsContact us for detailed specifications
20Overall Footprint (L × W × H)Contact us for detailed specifications
21Total WeightContact us for detailed specifications
22СоответствиеContact us for detailed specifications
Detailed spec sheet — including heater power profiles, charge sizing, facility utility requirements, and machine drawings — is shared after a technical qualification call. Reach out via the form below to start that conversation.
[ 05 ] / TARGET CUSTOMER
Who It's Built For

Who the KX360MCZ is built for.

A 12-inch MCZ crystal puller is a multi-million-dollar capital decision. It's not the right tool for every silicon producer. The four customer profiles below are where our 12-inch MCZ crystal puller delivers a clear ROI versus standard CZ alternatives.

🏭

12-inch IC Wafer Fabs

ADVANCED LOGIC · MEMORY · POWER

For new fabs commissioning 300mm capacity, or existing fabs adding MCZ capability to reach the lower oxygen and lower defect crystal grades required for advanced nodes.

"We need 300mm crystals that meet IC-grade defect specs out of the puller, not after extensive screening."
🔬

Crystal Growth R&D Labs

PROCESS DEVELOPMENT · PILOT LINES

Universities and corporate R&D groups developing novel crystal growth recipes who need a production-grade puller for process validation — not a benchtop research unit that won't scale.

"We need a puller that proves recipes at production scale, not just at lab scale."
🌐

IDM Wafer Suppliers Localizing Supply Chains

RESHORING · DOMESTIC SOURCING

Wafer suppliers serving regions where US/Japan/Germany puller imports face restrictions or long lead times. The KX360MCZ provides an alternative with regional service support.

"We need 300mm puller capacity with a supply chain that doesn't depend on a single foreign source."
📈

Capacity Expansion at 12-inch Producers

BROWNFIELD · YIELD IMPROVEMENT

Existing 300mm wafer producers running aging pullers who want a modern unit with one-click automation and updated diameter control to lift yield per furnace.

"We want to add a furnace that produces more usable wafer diameter per pull than our current fleet."
[ 06 ] / TECHNOLOGY COMPARISON
MCZ vs. Standard CZ

Why MCZ for 300mm wafer-grade crystal?

Standard CZ pullers can grow 300mm crystals — but the defect profile rarely meets IC-grade specs without aggressive downstream screening. Adding a horizontal superconducting magnetic field (H-MCZ) changes the economics. The table below summarizes the trade-off at the wafer level.

Метрика Standard CZ Puller KX360MCZ (H-MCZ) ★
Crystal Diameterup to 12″ (yield-limited)12″ optimized
Oxygen ControlLimited by natural convectionActive suppression via H-field
Defect ProfileHigher COP densityCOP-free achievable
Best ApplicationSolar / industrial / non-IC SiIC-grade logic & memory
Capital CostНижеHigher (magnet + cryogenics)
Operating CostНижеHigher (LHe / cryocooler)
Hot Zone LifetimeСтандартEquivalent
Wafer Yield to IC SpecНижеSignificantly higher
[ 07 ] / WHY VIMFUN
Why Customers Choose Us

Why customers choose our 12-inch MCZ crystal puller.

We supply our 12-inch MCZ crystal puller as a complete program — equipment, hot zone customization, commissioning, and consumables — not a transactional sale. Here's what that looks like in practice.

🏭

Production-Validated Platform

The KX360MCZ is built on a hot-zone and control architecture proven at production-scale 300mm wafer fabs. This isn't a research-grade prototype — it's a commercial puller ready for cleanroom installation and continuous-shift operation.

🛠️

Site Survey & Commissioning Included

12-inch puller installation requires precise foundation work, utility integration (LHe supply for the magnet, cryocooler power, fringe field clearance), and ramp-up. Our engineers conduct pre-delivery site survey and on-site commissioning end-to-end, and stay on site through first crystal qualification.

🔧

Hot Zone Co-Engineering

Hot zone configurations from 32″ to 36″ allow recipe tuning for specific oxygen, carbon, and resistivity targets. We co-engineer the hot zone with you based on your target wafer specification — not a one-size-fits-all configuration shipped from a catalog.

📦

Long-Term Consumables Supply

Crucibles, graphite parts, and heater elements drive operating cost over the puller's 10+ year lifetime. We hold long-term supply agreements for KX-series consumables — relevant for production planning and OPEX forecasting.

[ 08 ] / FAQ
Frequently Asked

Questions we get on 12-inch MCZ.

At 300mm, melt convection in standard CZ creates oxygen striations and increases COP density to levels that don't meet IC-grade specs. A horizontal magnetic field suppresses convection, which lets you grow longer COP-free body sections and gives you direct control over interstitial oxygen concentration through field strength tuning. For solar or non-IC silicon, standard CZ is fine. For 300mm IC-grade wafers, MCZ is the production-proven approach — which is exactly what the KX360MCZ as a 12-inch MCZ crystal puller is engineered for.
Three things beyond a standard CZ install: liquid helium supply (or a cryocooler reducing LHe consumption to near-zero), additional electrical capacity for the magnet power supply during ramp-up and quench recovery, and fringe-field clearance — typically a 5-Gauss exclusion zone around the puller that affects equipment placement. We provide a full facility specification document during the site survey.
Yes, but it's a multi-day procedure that requires shutting down the puller, replacing the hot zone components, and re-qualifying the recipe. Most production sites configure once and stay there. R&D and pilot-line customers reconfigure more frequently — we provide hot-zone change kits and procedures for those use cases.
Lead time depends on hot zone customization and magnet platform selection — typical range is 6 to 9 months from order confirmation to ship. On-site installation and commissioning runs 6 to 10 weeks, including utility hookup, vacuum and leak test, magnet ramp-up, and first-crystal qualification.
Detailed specifications — full heater power profiles, charge sizing, facility utility load, machine drawings — are shared with qualified buyers after a technical discussion. This isn't gatekeeping; it's so we can match the spec sheet to your specific application (wafer grade, recipe, magnet platform) instead of sending a generic document. Submit a quote request and we'll schedule a call.
[ 09 ] / FULL LINEUP
Other Crystal Pullers

Other crystal pullers in our lineup.

The KX360MCZ is our flagship 12-inch model. We also supply pullers for smaller wafer diameters used in legacy logic, MEMS, sensors, and discrete power devices. If your project sits between standard wafer sizes, or you need a research-grade puller for crystal growth R&D, talk to us about custom configurations.

[ MODEL · 6-INCH ]
6

6-inch Crystal Puller

For 150mm semiconductor and specialty silicon applications. CZ and MCZ configurations both available.

CONTACT FOR DETAILS →
[ MODEL · 8-INCH ]
8

8-inch Crystal Puller

For 200mm IC and power device wafer production. Most common workhorse size for power semiconductor and analog IC fabs.

CONTACT FOR DETAILS →
[ MODEL · 12-INCH · CURRENT ]
12

KX360MCZ ★

For 300mm COP-free IC-grade wafer production. You're here.

▶ VIEWING NOW
[ 10 ] / DOWNSTREAM LINE
[ 11 ] / GET IN TOUCH

Sourcing a
12-inch MCZ crystal puller?

Whether you're buying your first 12-inch MCZ crystal puller or expanding existing capacity, share your wafer specification, target volume, and facility timeline. We'll respond within 24 hours with a technical fit assessment, lead time estimate, and a path to detailed specification sharing.

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