Precision slicing.
Practical engineering.
Multi-wire and single-wire diamond wire saws for crystals, ceramics and magnetic materials.
Discuss your material
A practical partner
for material slicing
Vimfun provides diamond wire cutting equipment for semiconductor crystals, technical ceramics and magnetic materials. Our focus is the cutting task: the material you start with, the blanks you need, and the next step in your process.
From individual research samples to repeated production slices, we help review equipment configurations against your workpiece, target thickness and handling requirements.
From material to a cutting solution
A clear starting point, a representative sample and a configuration built around the requirement.
Application review
Share your material, workpiece dimensions, target slice thickness and finishing requirements. We review the cutting task before recommending a setup.
Sample cutting
Confirm the sample arrangement with our team. Review the returned blanks against the agreed dimensions and receiving requirements.
Equipment configuration
Use the application requirements and trial feedback to discuss the machine, workholding and options suitable for your process.
Details that matter
beyond the cut
Workpiece support, retained thickness and release conditions affect whether a blank is useful to the next operation. They belong in the equipment discussion alongside the cutting method.
Explore our multi-wire saw range for repeated slicing, or the SVO-40単線ソー for individual sample work. Material-specific capability should be confirmed against the actual requirement.
Supporting your next step
Send the material, dimensions and target slice thickness.
We will discuss a suitable cutting setup and sample arrangement.