16B-5LY/P Lapping Machine
Le 16B-5LY/P lapping machine is a mid-size 5-carrier planetary system built for manufacturers who need better precision on larger workpieces up to Φ390 mm. Equipped with a P5-grade crossed roller bearing — one grade above the 13B — it achieves flatness ≤0.015 mm and is the recommended choice for 8-inch SiC wafers, large optical filters, and sapphire substrates.
Le 16B-5LY/P lapping machine sits between the compact 13B-6LY/P and the heavy-duty 22BF-5LY/P — and represents the best balance of capacity and precision for most semiconductor wafer, optical filter, and advanced ceramics production scenarios. The Φ1154 mm plate diameter and P5-grade crossed roller bearing make it the preferred choice when workpiece diameters exceed Φ210 mm or when longer production runs demand sustained high-precision performance. It is the most widely deployed model in Vimfun's double-sided grinding and polishing line.
16B-5LY/P Lapping Machine — 6 Superior Features
The main spindle uses a P5-grade crossed roller bearing (ISO 492 Grade 5) — one grade above the 13B — providing tighter runout tolerances and sustained rotational accuracy under heavy load, preserving flatness ≤0.015 mm across long production cycles.
All four drives (upper plate, lower plate, sun gear, outer ring) use high-precision worm gear shaft motors, delivering smooth torque transmission and excellent repeatability. Ideal for extended production runs requiring consistent material removal rates.
Upper plate (0–20 rpm), lower plate (0–50 rpm), sun gear (0–22 rpm), and outer ring gear (0–16 rpm) are all independently frequency-adjustable. This enables optimized process recipes for each material — SiC, sapphire, glass, or ceramics — without mechanical changes.
Forward and reverse sun gear rotation is software-controlled, enabling process optimization without mechanical adjustments. Enhances uniformity of material removal across all 5 carrier positions simultaneously, reducing within-batch variation.
Upper and lower lapping plates rotate in opposite directions, driving the planetary gear through the sun gear and internal ring gear at an ideal speed ratio — ensuring uniform simultaneous grinding and polishing on both workpiece surfaces.
The lower plate achieves runout ≤0.04 mm and flatness ≤0.015 mm — and this can be reconditioned on-site by trained technicians. A standard reconditioning cycle restores performance in 2–4 hours without factory intervention or plate shipping.
Technical Specifications — 16B-5LY/P-4M
| Paramètre | Valeur | Note |
|---|---|---|
| Total Footprint (incl. main & auxiliary cylinders) | 1860 × 1450 × 2650 mm | |
| Plate Size – Polishing (SUS 410) | Φ1154 × Φ364 × 50 mm | |
| Plate Size – Lapping (ductile cast iron) | Φ1154 × Φ364 × 50 mm | Ring groove type |
| Max Workpiece Diameter | Φ390 mm | |
| Sun Gear Model | Back circle Φ423.34 / Module DP12 | |
| Number of Carriers | 5 pcs | |
| Gear Module | DP12 | |
| Puissance totale | 20 kW | AC380V |
| Poids de la machine | ~ 4800 kg | Approximate |
| Lower Plate Drive | 7.5 kW | High-precision worm gear shaft |
| Upper Plate Drive | 7.5 kW | High-precision worm gear shaft |
| Sun Gear Drive | 1.5 kW | High-precision worm gear shaft |
| Outer Ring Gear Drive | 2.2 kW | High-precision worm gear shaft |
| Upper Plate Speed | 0 ~ 20 rpm | Frequency adjustable |
| Lower Plate Speed | 0 ~ 50 rpm | Frequency adjustable |
| Sun Gear Speed | 0 ~ 22 rpm | Frequency adjustable |
| Outer Ring Gear Speed | 0 ~ 16 rpm | Frequency adjustable |
| Lower Plate Runout | ≤ 0.04 mm | |
| Lower Plate Flatness | ≤ 0.015 mm | Field repairable |
| Outer Ring Gear End Face Runout | ≤ 0.35 mm | |
| Center Gear Runout | ≤ 0.20 mm | |
| Inner/Outer Gear Runout | ≤ 0.40 mm | |
| Pressure Control Accuracy | ±10 N | |
| Thickness Control Accuracy | ±2 μm | En option |
| Sun Gear Direction Control | Software-controlled forward/reverse | |
| Main Bearing Type | P5-grade crossed roller bearing |
What Materials Can the 16B-5LY/P Process?
Sapphire wafer lapping up to Φ390 mm for LED, optical, and laser applications. P5 bearing precision ensures consistent flatness on large-area substrates.
Precision surface conditioning of 8-inch SiC wafers. Independent speed control optimizes removal rates for hard SiC while maintaining TTV under 1 μm.
Bandpass and interference filters in larger formats. Flatness ≤0.015 mm and precision parallelism are critical for optical coating adhesion and spectral performance.
Display cover glass and microcrystalline glass substrates for 3C industry applications. Smooth VFD startup prevents edge chipping on large-format glass panels.
Large-format alumina, silicon nitride, and zirconia components for structural and electronic applications requiring tight thickness uniformity and surface finish.
Hard metal components, bearing rings, and mechanical seal faces requiring double-sided flatness and parallelism to sub-micron tolerances for demanding industrial applications.
Why Choose the Vimfun 16B-5LY/P
The 16B-5LY/P lapping machine is the sweet spot between the compact 13B and the heavy-duty 22BF. Its Φ1154 mm plates and 5-carrier configuration cover the widest range of semiconductor and optics production requirements.
P5-grade crossed roller bearings (ISO 492 Grade 5) maintain tighter runout tolerances and better performance over extended production cycles than standard bearings — protecting your flatness specifications long-term.
Vimfun manufactures the 16B lapping plates in-house. The 1154×364×50 mm plates arrive with runout ≤0.04 mm and flatness ≤0.015 mm — fully verified, no break-in dressing required.
Timer-based programmable process control allows a single operator to supervise multiple 16B-5LY/P lapping machines simultaneously — significantly reducing labor costs without compromising process consistency.
Frequently Asked Questions — 16B-5LY/P Lapping Machine
The 16B handles larger workpieces (Φ390 mm vs Φ210 mm), uses P5-grade crossed roller bearings for higher precision, has more powerful drives (7.5+7.5 kW vs 7.5+5.5 kW), and a larger plate (Φ1154 mm vs Φ933 mm). Choose the 16B when workpiece diameter exceeds Φ210 mm or when sustained long-run precision is the priority.
Yes. With a max workpiece diameter of Φ390 mm, the 16B-5LY/P comfortably processes 8-inch (200 mm) wafers. The 5-carrier configuration can also batch multiple smaller wafers simultaneously to maximize throughput per cycle. For reference data on SiC wafer surface preparation, see MDPI: SiC Wafer Processing Research.
Independent control of upper plate, lower plate, sun gear, and ring gear speeds allows engineers to tune exact kinematics for each material. SiC requires slow, high-pressure passes; glass needs fast, light-pressure cycles. This flexibility is not available on simpler 2-axis machines and directly improves surface finish quality and yield.
With appropriate slurry and polishing pad selection, the 16B-5LY/P achieves sub-nanometer Ra on sapphire. Combined with flatness ≤0.015 mm and TTV under 1 μm, this meets epi-ready and optical-grade wafer specifications for LED substrate production.
Move to the 22BF-5LY/P when workpiece diameter exceeds Φ390 mm, workpiece thickness exceeds 25 mm, processing force requirements exceed 3500 N, or production targets demand the highest throughput with Φ480 mm plate capacity.
Other Grinding & Lapping Machines
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Email: daria@endlesswiresaw.com | Tel: +86 130 2773 8908