SOMI2-600S Ultra-Thin Wafer Slicing Wire Saw
The SOM2-600S is a 2-roller, single-station, high-speed multi-wire saw designed for ultra-thin wafer slicing. With wire speeds reaching 2200 m/min and slice thickness capability down to 0,3 mm, it excels at precision thin-wafer applications where surface quality and dimensional accuracy are critical.
KEY FEATURES
- Ultradünnes Schneiden: Slice thickness range 0.3–3 mm — ideal for precision thin wafer production
- High Wire Speed: Maximum wire speed 2200 m/min for fast, stable cuts with minimal surface stress
- Reverse-Cut Design: Single-station reverse cutting achieves tighter center-to-center spacing between slices
- Precision Groove Wheels: 160–180 mm diameter groove wheels for fine wire pitch control
- High Surface Quality: Minimal subsurface damage — reduces post-processing lapping requirements
- Wide Material Compatibility: Silicon, SiC, sapphire, GaAs, germanium, piezoelectric ceramics
- Compact Footprint: 2450 × 2000 × 2000 mm — fits in standard cleanroom bays
Nein. | Parameter | Spezifikation |
1 | Max. Workpiece Size (L×W×H mm) | 660 × 160 × 150 |
2 | Slice Thickness Range (mm) | 0.3 – 3 |
3 | Groove Wheel Diameter (mm) | 160 – 180 |
4 | Max. Wire Speed (m/min) | 2200 |
5 | Machine Dimensions L×W×H (mm) | 2450 × 2000 × 2000 |
6 | Number of Stations | 1 (Single-Station) |
7 | Schneidemodus | Inverted cut , 2-rollers |
8 | Compatible Materials | Silicon, SiC, Sapphire, GaAs, Germanium, Ceramics |
Criteria | SOMI2-600S | SOM4-630D |
Minimum Slice Thickness | 0,3 mm | 1.5 mm |
Max. Wire Speed | 2200 m/min | Standard |
Number of Stations | 1 (Single) | 2 (Dual) |
Best For | Thin wafers, high precision | High throughput, batch production |
Typical Application | Semiconductor R&D, thin wafer fab | Magnet, large-batch production |
GaAs and InP
High-precision GaAs and InPwafer slicing for RF/photonic devices
Piezoelectric ceramic
Piezoelectric ceramic thin slabs for acoustic and sensor applications
Saphir
Präzision sapphire substrateslicing for LED and optical applications
Siliziumkarbid
Thin SiC waferproduction for power device substrates
Germanium
Research-grade germanium waferproduction
Silicon
Ultra-thin Silizium-Waferproduction for semiconductor devices (0.3–1 mm)
The equipment models listed on this website represent only a selection of our full product range. For each type of diamond wire slicing machine or semiconductor cutting equipment, we offer larger sizes, custom configurationsund application-specific designs based on customer needs.
If your material, size, or process requirements are not covered by the listed products, please contact us directly. Our engineering team will recommend or customize the most suitable solution for your application.
RELATED PRODUCTS
See also: SG20 Precision Slicing Machine (single-piece ultra-thin slicing) | SOM4-630D (dual-station batch production) | Diamond Wire for Semiconductor Cutting
Welche maximale Dicke kann die Maschine beim Schneiden verarbeiten?
Was ist der Unterschied zwischen dieser Seilsäge und der BANDSÄGE?
Die Schnittgeschwindigkeit wäre ähnlich, aber die Schnittflächenqualität der Seilsäge ist viel besser und der Schnittfugenverlust ist geringer.