Precision Cutting for Advanced Ceramic & Semiconductor Materials
Diamond wire technology optimized for silicon, SiC, sapphire, and ceramic wafers.
N . A . Office
Winnipeg, MB, Canada
Call Us
(1)408-571-8651
7:30 AM - 7:30 PM
7 days
WHAT WE DO
Advanced Cutting Solutions for Hard & Brittle Semiconductor Materials
We specialize in designing and manufacturing precision diamond wire cutting machines for ultra-hard, brittle, and high-value materials used in semiconductor and advanced electronics industries. From wafer slicing and rod segmentation to contour and inner-hole cutting, our equipment delivers clean, low-kerf results with programmable automation and full process control.
Free Sample Cut
We provide free sample cut if you send workpiece and drawing
Machine Design
Design machines for your specific Cutting needs
Consumables
Offer all essential consumables for a smooth machine operation
CUTTING MACHIES WE OFFER
Explore Our Glass Cutting Machines
From thin wafer slicing to complex contour cutting, our product range covers a wide spectrum of cutting tasks in the semiconductor industry. Whether you're working with alumina, silicon carbide, sapphire, or piezoelectric ceramics, we offer reliable and customizable solutions designed for high-precision results and efficient operation.

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- Max Workpiece Length (mm): 200
- Max Workpiece Width (mm): 200
- Max Workpiece Height (mm): 200

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- Max Workpiece Dia (mm): 600
- Max Workpiece Height (mm): 500

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- Max Workpiece Length (mm): 400
- Max Workpiece Width (mm): 400
- Max Workpiece Height (mm): 350

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- Max Workpiece Length (mm): 200
- Max Workpiece Width (mm): 200
- Max Workpiece Height (mm): 200

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- Max Workpiece Length (mm): 200
- Max Workpiece Width (mm): 200
- Max Workpiece Height (mm): 200

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- Max Workpiece Length (mm): 200
- Max Workpiece Width (mm): 200
- Max Workpiece Height (mm): 200

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- Wire Diameter (mm): 0.3 – 3.5
- Wire Length (mm): 700 – 10000

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- Wire Diameter (mm): 0.55-1.0 mm
- Wire Length (m): 1-10

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- Wire Diameter (mm): 0.65-3.5 mm
- Wire Length (m): 1-10

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- Wire Diameter (mm): 2.0 mm
- Wire Length (mm): 4500 mm
MATERIALS WE CUT
Cutting Solutions Tailored for Semiconductor-Grade Materials
Our machines are trusted by semiconductor material manufacturers, ceramic processors, and photonics companies worldwide. Typical applications include slicing sapphire rods, segmenting silicon carbide ingots, contour-cutting alumina substrates, and producing ultrathin piezoelectric wafers—delivering clean edges, minimal chipping, and stable throughput.
Lens Windows Cut
Ideal for lens windows and high-precision components.
Cutting 0.3mm blue optical filter glass with clean edges and no chipping
Check Machine
Astronomical Optics Pre-Cut
Cutting thick glass substrates used in telescope and observatory optics.
Check Machine
Infrared Night Vision Goggles
Ultra-precise Cut of germanium glass used in infrared lenses for night vision goggles, thermal scopes, and IR optical sensors.
Check Machine
Sapphire Cut
Stress-free cutting of large synthetic ruby crystals used in laser cavities, infrared windows, and mechanical components.
Check Machine
Quartz Rod Cut
Precisely slice quartz blocks into smooth, chip-free cylindrical rods, ideal for light guides, fiber optic preforms, and infrared transmission components.
Check Machine
Ultra-Thin Sapphire Wafer Cutting
Slices sapphire into ultra-thin wafers as thin as 0.2mm, enabling high-precision applications in IR optics, laser protection, and sensor covers.
Check Machine
Precision Prism Block Cutting
Manufacturing prisms, beam splitters, and retroreflectors, especially from BK7, fused silica, and other optical-grade materials.
Check Machine
Glass Angle Cut
Custom angle or bevel cutting for shielding windows used in aerospace and medical equipment.
Check Machine
ABOUT US
Why Our Cutting Machine Is Better
With years of experience in cutting hard and brittle materials, we deliver more than just machines—we provide complete cutting solutions. Our equipment features ultra-low kerf loss, programmable motion control, clean slicing surfaces, and flexible configuration options. Backed by global support and real-world success, we help our clients cut smarter, faster, and cleaner.
🔹 Chip-Free Edge Quality
🔹 Ultra-Smooth Surface Finish
🔹 Minimal Kerf Loss
🔹 Low Cutting Stress
🔹 Supports Thin and Hard Materials
🔹 Cleanroom-Compatible Operation
NEWS & INSIGHTS
Stay ahead with expert
Explore in-depth articles on optical material processing, cutting techniques, and application-specific challenges.