SOMI2-600S Ultra-Thin Wafer Slicing Wire Saw
The SOM2-600S is a 2-roller, single-station, high-speed multi-wire saw designed for ultra-thin wafer slicing. With wire speeds reaching 2200 m/min and slice thickness capability down to 0,3 мм, it excels at precision thin-wafer applications where surface quality and dimensional accuracy are critical.
ОСНОВНЫЕ ХАРАКТЕРИСТИКИ
- Ультратонкая нарезка: Slice thickness range 0.3–3 mm — ideal for precision thin wafer production
- High Wire Speed: Maximum wire speed 2200 m/min for fast, stable cuts with minimal surface stress
- Reverse-Cut Design: Single-station reverse cutting achieves tighter center-to-center spacing between slices
- Precision Groove Wheels: 160–180 mm diameter groove wheels for fine wire pitch control
- High Surface Quality: Minimal subsurface damage — reduces post-processing lapping requirements
- Wide Material Compatibility: Silicon, SiC, sapphire, GaAs, germanium, piezoelectric ceramics
- Compact Footprint: 2450 × 2000 × 2000 mm — fits in standard cleanroom bays
Нет. | Параметр | Технические характеристики |
1 | Max. Workpiece Size (L×W×H mm) | 660 × 160 × 150 |
2 | Slice Thickness Range (mm) | 0.3 – 3 |
3 | Groove Wheel Diameter (mm) | 160 – 180 |
4 | Max. Wire Speed (m/min) | 2200 |
5 | Machine Dimensions L×W×H (mm) | 2450 × 2000 × 2000 |
6 | Number of Stations | 1 (Single-Station) |
7 | Режим резки | Inverted cut , 2-rollers |
8 | Compatible Materials | Silicon, SiC, Sapphire, GaAs, Germanium, Ceramics |
Criteria | SOMI2-600S | SOM4-630D |
Minimum Slice Thickness | 0,3 мм | 1.5 mm |
Max. Wire Speed | 2200 m/min | Стандарт |
Number of Stations | 1 (Single) | 2 (Dual) |
Best For | Thin wafers, high precision | High throughput, batch production |
Typical Application | Semiconductor R&D, thin wafer fab | Magnet, large-batch production |
GaAs and InP
High-precision GaAs and InPwafer slicing for RF/photonic devices
Piezoelectric ceramic
Piezoelectric ceramic thin slabs for acoustic and sensor applications
Сапфир
Точность sapphire substrateslicing for LED and optical applications
Карбид кремния
Thin SiC waferproduction for power device substrates
Germanium
Research-grade germanium waferproduction
Silicon
Ultra-thin кремниевая пластинаproduction for semiconductor devices (0.3–1 mm)
The equipment models listed on this website represent only a selection of our full product range. For each type of diamond wire slicing machine or semiconductor cutting equipment, we offer larger sizes, custom configurations, и application-specific designs based on customer needs.
If your material, size, or process requirements are not covered by the listed products, please contact us directly. Our engineering team will recommend or customize the most suitable solution for your application.
RELATED PRODUCTS
See also: SG20 Precision Slicing Machine (single-piece ultra-thin slicing) | SOM4-630D (dual-station batch production) | Diamond Wire for Semiconductor Cutting
Какую максимальную толщину может выдержать машина для резки?
В чем разница между этой проволочной пилой и BAND SAW?
Скорость резания будет одинаковой, но качество поверхности реза проволочной пилы намного лучше, а потери пропила меньше.