High-throughput dual-station wire saw engineered for silicon ingot, SiC, and sapphire slicing. Two workpiece stations run simultaneously — doubles output in the same footprint, with industry-leading arc-out time under 10 minutes.
Industry-leading arc-out speed minimizes production downtime. Faster wire replacement means higher throughput per shift — critical for high-volume manufacturing environments.
Two independent workstations allow simultaneous cutting of two 630mm workpieces — effectively doubling output without increasing machine footprint or operator headcount.
Compact, low-profile frame design improves mechanical rigidity and vibration dampening, delivering superior surface finish (Ra) and tight dimensional tolerance on every slice.
Straight-cut mechanism ensures consistent wire tension and minimal bow on slices. Ideal for silicon block, NdFeB brick, and sapphire boule cutting with predictable surface quality.
Cuts silicon, SiC, sapphire, GaAs, germanium, NdFeB, industrial ceramics, and quartz crystal. Slice thickness 1.5–20mm covers both wafer production and block squaring applications.
Fully programmable cutting parameters with intuitive touchscreen interface. Each station supports independent parameter settings — different materials or slice specs per cycle.
| Нет. | Параметр | Технические характеристики | Notes |
|---|---|---|---|
| 1 | Max. Workpiece Size (L×W×H) | 630 × 160 × 150 mm × 2 | Dual-station configuration |
| 2 | Slice Thickness Range | 1.5 – 20 mm | Adjustable per material |
| 3 | Groove Wheel Diameter | 140 – 160 mm | Interchangeable configuration |
| 4 | Main Motor Power | 38 kW | — |
| 5 | Average Power Consumption | ≤ 15 kW | Energy-efficient operation |
| 6 | Overall Dimensions (L×W×H) | 2450 × 2000 × 2000 mm | Compact footprint |
| 7 | Number of Stations | 2 (Dual-Station) | Simultaneous dual-block cutting |
| 8 | Режим резки | Straight-cut (正切), 4-axis | — |
| 9 | Average Arc-Out Time | < 10 minutes | Industry-leading performance |
| 10 | Compatible Materials | Si, SiC, Sapphire, GaAs, NdFeB, Ceramics | — |
Slicing polysilicon ingots for solar cell wafer production (PV). High-volume silicon brick squaring for semiconductor substrates.
Cutting SiC blocks into power semiconductor substrates. Low kerf loss critical for expensive SiC boules.
Batch slicing sapphire boules into LED substrates and optical-grade wafers. Mohs 9 hardness handled with precision.
High-volume slicing of NdFeB blocks for EV motor and consumer electronics magnet manufacturing.
Precise slicing of GaAs and InP ingots for high-frequency RF device and photonic component wafers.
Alumina, zirconia, and silicon nitride ceramic slab production for structural and electronic applications.
Built in-house at our Shanghai facility. No intermediary markup — you get factory pricing with direct engineering access.
Installed at leading silicon and SiC manufacturers across 18+ provinces. Validated in high-volume production environments.
On-site commissioning, cutting parameter optimization, and operator training are included with every purchase.
Vimfun supplies endless diamond wire loops precision-matched to SOM4-630D groove wheel specs for optimal cutting performance.
Silicon, polysilicon, SiC, sapphire, GaAs, germanium, NdFeB magnets, alumina ceramics, and quartz crystal. For extremely thin slices (0.3–3mm), see the SOM2-600S model.
Yes. Each station can be programmed with independent slice thickness, feed rate, and material type parameters — enabling flexible production scheduling.
1.5 mm. For thinner slices (0.3–3mm), the SOM2-600S high-speed single-station model is recommended.
Standard lead time is 60–90 days from order confirmation. On-site installation, commissioning, and operator training are included. Contact us for expedited delivery options.
ID saws cut one wafer at a time; the SOM4-630D cuts a full ingot into all wafers in a single pass across two stations simultaneously. This delivers dramatically higher throughput, lower kerf loss, and better surface quality.
Our engineers respond within 24 hours with a customized technical proposal and pricing.
Email: daria@endlesswiresaw.com | Tel: +86 130 2773 8908