SOM2-600S Wire Saw – Ultra-Thin Wafer Slicing from 0.3mm at 2200m/min
The SOM2-600S is a 2-axis single-station reverse-cut high-speed multi-wire saw designed for ultra-thin wafer production. With wire speeds reaching 2200 m/min and slice thickness capability down to 0.3 mm, it excels at precision thin-wafer applications where surface quality and dimensional accuracy are critical.
Key Features
- 🔹 Ultra-Thin Slicing: Slice thickness range 0.3–3 mm — ideal for precision thin wafer production
- 🔹 High Wire Speed: Maximum wire speed 2200 m/min for fast, stable cuts with minimal surface stress
- 🔹 Reverse-Cut Design: Single-station reverse cutting achieves tighter center-to-center spacing between slices
- 🔹 Precision Groove Wheels: 160–180 mm diameter groove wheels for fine wire pitch control
- 🔹 High Surface Quality: Minimal subsurface damage — reduces post-processing lapping requirements
- 🔹 Wide Material Compatibility: Silicon, SiC, sapphire, GaAs, germanium, piezoelectric ceramics
- 🔹 Compact Footprint: 2450 × 2000 × 2000 mm — fits in standard cleanroom bays
Parameters Application Advantage FAQ
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SOM2-600S TECHNICAL SPECIFICATION
| No. | Parameter | Specification |
| 1 | Max. Workpiece Size (L×W×H mm) | 660 × 160 × 150 |
| 2 | Slice Thickness Range (mm) | 0.3 – 3 |
| 3 | Groove Wheel Diameter (mm) | 160 – 180 |
| 4 | Max. Wire Speed (m/min) | 2200 |
| 5 | Machine Dimensions L×W×H (mm) | 2450 × 2000 × 2000 |
| 6 | Number of Stations | 1 (Single-Station) |
| 7 | Cutting Mode | Reverse-cut (倒切), 2-axis |
| 8 | Compatible Materials | Silicon, SiC, Sapphire, GaAs, Germanium, Ceramics |
TYPICAL APPLICATIONS
- Ultra-thin silicon wafer production for semiconductor devices (0.3–1 mm)
- Precision sapphire substrate slicing for LED and optical applications
- Thin SiC wafer production for power device substrates
- High-precision GaAs and InP wafer slicing for RF/photonic devices
- Research-grade germanium wafer production
- Piezoelectric ceramic thin slabs for acoustic and sensor applications
SOM2-600S vs. SOM4-630D: WHICH IS RIGHT FOR YOU?
| Criteria | SOM2-600S | SOM4-630D |
| Minimum Slice Thickness | 0.3 mm | 1.5 mm |
| Max. Wire Speed | 2200 m/min | Standard |
| Number of Stations | 1 (Single) | 2 (Dual) |
| Best For | Thin wafers, high precision | High throughput, batch production |
| Typical Application | Semiconductor R&D, thin wafer fab | Solar, SiC, large-batch production |
FREQUENTLY ASKED QUESTIONS
Q: Is 0.3mm slice thickness achievable in production conditions?
Yes. The reverse-cut mechanism and precise groove wheel design maintain dimensional stability at 0.3mm across full production batches.
Q: How does surface roughness compare to ID saws?
Diamond wire achieves Ra 0.5–2 μm — comparable to or better than ID saw, with significantly lower kerf loss.
Q: Can this machine handle sapphire (Mohs 9)?
Yes. The SOM2-600S is rated for materials up to Mohs 9.5 with appropriate diamond wire selection.
Q: What wire diameter is recommended?
Typical Φ0.12–0.18 mm for thin wafer applications. Vimfun recommends specific wire specs based on your material requirements.
RELATED PRODUCTS
See also: SG20 Precision Slicing Machine (single-piece ultra-thin slicing) | SOM4-630D (dual-station batch production) | Diamond Wire for Semiconductor Cutting