SGR20 3-Axis Diamond Wire Saw
SGR20 is a precision diamond wire cutting machine equipped with three programmable axes, including a rotary axis for angular and multi-surface operations. Building upon the robust platform of the SG20, this upgraded model offers enhanced flexibility for cutting complex geometries, prismatic shapes, and tilted surfaces commonly found in semiconductor components and advanced ceramic structures.
KEY FEATURES
Rotary Axis Added: Enables angular, conical, and multi-faceted cuts
3-Axis CNC Control: Independent X, Y, and rotary axis programming
High-Precision Cutting: ±0.01 mm positioning accuracy
Supports Complex Shapes: Ideal for non-standard parts and inclined surfaces
Versatile Material Compatibility: Suitable for sapphire, SiC, PZT, and advanced ceramics
Customizable Slicing Thickness: Works from 0.1 mm and above
User-Friendly PLC Interface: Simple control and automated workflows
| No. | Name | Specification |
| 1 | Maximum Workpiece Length (mm) | 200 |
| 2 | Maximum Workpiece Width (mm) | 200 |
| 3 | Maximum Workpiece Height (mm) | 220 |
| 4 | Worktable Y-Axis Travel (mm) | 200 |
| 5 | Worktable Z-Axis Travel (mm) | 220 |
| 6 | Maximum Diamond Wire Speed (m/s) | 59 |
| 7 | Minimum Feed Increment Y-Axis (mm) | 0.01 |
| 8 | Minimum Feed Increment Z-Axis (mm) | 0.01 |
| 9 | Repeat Positioning Accuracy Y-Axis (mm) | 0.01 |
| 10 | Repeat Positioning Accuracy Z-Axis (mm) | 0.01 |
| 11 | Total Power Consumption (kW) | 1.5 |
| 12 | Power Supply | 220V 50Hz |
| 13 | Machine Size(mm) | 1044*943*1810 |
| 14 | Machine Weight(kg) | 560 |
For complex shaping of semiconductor materials, conventional tools such as EDM, ID saws, or spool-type diamond wire saws often fall short:
EDM is slow and limited to conductive materials
Spool wire saws suffer from back-and-forth instability
ID saws are restricted by blade size and require frequent tool changes
The SGR20 slicing machine uses a closed-loop endless diamond wire, delivering:
Smooth, uninterrupted motion
Higher surface quality with minimal chipping
Freedom to cut multi-angle and irregular profiles
Compatibility with both brittle and non-conductive materials
Optical Prisms
Cutting angled and multi-surface sapphire components used in laser systems, lenses, and infrared windows
PZT Multi-Faceted Sensors
Shaping piezoelectric ceramics into custom forms for medical ultrasound, MEMS devices, and actuators
Alumina Ceramic Housings
Profiling ceramic enclosures and connector structures used in high-voltage insulation and electronics packaging
Silicon Carbide Structural Parts
Creating complex shapes for power semiconductor cooling bases and aerospace-grade SiC modules
Customized Semiconductor Substrates
Cutting non-standard geometries for wafer carriers, chip packaging, and advanced microelectronic applications
The equipment models listed on this website represent only a selection of our full product range. For each type of diamond wire slicing machine or semiconductor cutting equipment, we offer larger sizes, custom configurations, and application-specific designs based on customer needs.
If your material, size, or process requirements are not covered by the listed products, please contact us directly. Our engineering team will recommend or customize the most suitable solution for your application.
What is the maximum thickness the machine can handle for cutting?
What is the difference between this wire saw and BAND SAW?
The cutting speed would be similar, but wire saw’s cut surface quality is far more better. and the kerf loss is smaller.