SVI50-40 Ultra-Hard Semiconductor Material Cutter
The SVI50-40 is a vertical diamond wire saw designed for precision slicing and profiling of large, ultra-hard materials. With a spacious worktable, high load capacity, and closed-loop wire system, it is ideal for cutting materials like silicon carbide, sapphire, piezoelectric ceramics, and magnetic materials.
KEY FEATURES
Large Cutting Capacity: Supports materials up to 500 × 400 × 400 mm
Dual-Mode Cutting: Switch between slicing and contour profiling
Heavy Load Capability: Handles workpieces up to 1000 kg
High Precision: Positioning accuracy within ±0.01 mm
Optimized for Hard & Brittle Materials: Ideal for SiC, sapphire, ceramics, etc.
Dual-System Control: Simple mode for slicing, advanced mode for profile cutting
Remote Maintenance Ready: Easy integration and online support capabilities
| Parameter | Value |
|---|---|
| Machine Dimensions (L × W × H) | 2500 × 2000 × 2400 mm |
| Max Workpiece Size (L × W × H) | 500 × 500 × 400 mm |
| X/Y Axis Positioning Accuracy | ±0.015 mm |
| Verticality & Flatness Accuracy | ≤ 0.03 – 0.10 mm |
| Overall Precision | ≤ 0.1 mm |
| Main Motor Power | 2.2 kW, 2840 rpm |
| Power Supply | 380V, 50Hz |
| Wire Saw Type | Endless diamond wire |
| Cutting Mode | Slicing / Shaping |
| Wire Wheel Diameter | Ø 250 mm |
| Wire Length | 0.8 – 4.8 m (loop) |
| Drive Configuration | 4-Wheel Drive |
| Motor Type | Stepper Motor |
| Linear Speed | 64 m/s |
| Air Pressure Requirement | 0.8 MPa |
| Cutting Materials | Sapphire, magnetic ceramics, alumina, silicon carbide, others |
| Installed Power | 3.5 kW |
| Machine Weight | Approx. 2200 kg |
| Control System | PLC |
SVI50-40 vs. Traditional Wire Saw and Blade-Based Systems
When cutting large blocks of hard semiconductor materials, traditional blade-based or spool wire systems often face limitations:
Blades struggle with large thickness and may overheat or crack brittle materials
Spool-type wire saws produce vibration and uneven cutting under heavy load
Manual setups reduce repeatability and throughput
In contrast, the SVI50-40 vertical endless wire saw offers:
Continuous closed-loop wire motion for smooth cutting
Uniform tensioning and stable wire tracking for heavy-duty slicing
Support for both ultra-hard and non-conductive materials
High dimensional accuracy across large workpieces
Silicon Carbide Blocks
Slicing large SiC slabs for power device substrates and thermal spreaders
Sapphire Ingots and Bricks
Cutting oversized sapphire materials into wafers or structural components
PZT and Ferroelectric Ceramics
Profiling large piezoelectric ceramics for sonar, actuator, and energy harvesting devices
Magnetic Material Blocks
Processing hard ferrite or rare-earth magnetic blocks used in precision motors
The equipment models listed on this website represent only a selection of our full product range. For each type of diamond wire slicing machine or semiconductor cutting equipment, we offer larger sizes, custom configurations, and application-specific designs based on customer needs.
If your material, size, or process requirements are not covered by the listed products, please contact us directly. Our engineering team will recommend or customize the most suitable solution for your application.
What is the maximum thickness the machine can handle for cutting?
What is the difference between this wire saw and BAND SAW?
The cutting speed would be similar, but wire saw’s cut surface quality is far more better. and the kerf loss is smaller.