SGI20 Contour Cutting Machine
The SGI20 is a high-precision diamond wire cutting machine specially designed for contour cutting of complex profiles in hard and brittle semiconductor materials. With full CNC control and support for importing CAD drawings, it enables automatic execution of curved, angled, and irregular shapes with exceptional accuracy.
KEY FEATURES
CAD-Compatible Profile Cutting: Import DXF or other CAD files to execute custom geometries
±0.01 mm Positioning Accuracy: High repeatability for detailed patterns
Multi-Axis Contour Control: Synchronized movement in Y and Z axes
Wide Material Compatibility: Suitable for sapphire, ceramics, quartz, SiC, and more
Automatic Slicing or Shaping: Choose between straight slicing or profile cutting modes
Precision Wire Tensioning System: Ensures consistent cutting performance
Small Footprint, Lab-Ready: Compact design fits well in R&D and cleanroom environments
| Parameter | Value |
|---|---|
| Worktable Dimensions | 200 × 250 mm |
| Worktable Travel (Y/Z) | 250 × 250 mm |
| Max Cutting Thickness | 200 mm |
| Max Product Size | 200 × 200 × 250 mm |
| Load Capacity | 50 kg |
| Positioning Accuracy | ±0.01 mm |
| Surface Roughness | ≤ Ra 60 |
| Wire Diameter | 0.3 – 0.65 mm |
| Drive System | Servo |
| Tensioning Method | Pneumatic Tensioning |
| Control System | CNC |
| Broken Wire Protection | Yes |
| Max Wire Speed | 3000 RPM |
| Power Supply | Single-phase 220V / 50Hz ±10% |
| Installed Power | 4.0 kW |
| Machine Dimensions | 800 × 850 × 1920 mm |
| Machine Weight | 400 kg |
Traditional methods like CNC milling and laser cutting struggle with hard brittle materials due to:
High mechanical stress or thermal damage
Poor surface quality and material loss
Limitations in cutting complex contours cleanly
The SGI20 contour wire saw eliminates these issues by:
Using vibration-free endless diamond wire
Supporting fully automated CAD-profile cutting
Maintaining ultra-smooth finishes with no heat-affected zone
Offering precise, low-loss cutting for non-conductive, high-value materials
It’s the superior solution for engineers working with irregular ceramic or crystal profiles in the semiconductor field.
Alumina Micro Housings
Profile cutting of complex ceramic shells for sensor, IC, and MEMS component encapsulation
PZT Actuator Geometries
Forming asymmetric or contoured piezoelectric elements for motion control and sensing devices
Sapphire Light Guide Structures
Precision shaping of prismatic and arc-shaped sapphire parts for photonics and infrared optics
Silicon Carbide Support Frames
Cutting non-linear support geometries for high-power SiC-based modules and RF substrates
The equipment models listed on this website represent only a selection of our full product range. For each type of diamond wire slicing machine or semiconductor cutting equipment, we offer larger sizes, custom configurations, and application-specific designs based on customer needs.
If your material, size, or process requirements are not covered by the listed products, please contact us directly. Our engineering team will recommend or customize the most suitable solution for your application.
What is the maximum thickness the machine can handle for cutting?
What is the difference between this wire saw and BAND SAW?
The cutting speed would be similar, but wire saw’s cut surface quality is far more better. and the kerf loss is smaller.