Crystal Ingot Cropper – Precision Silicon Boule Cropping for Wafer Production
The Crystal Ingot Cropper (单晶截断机) is a specialized endless-wire cropping machine for cutting monocrystalline silicon rods into sections. Using a unidirectional endless diamond wire loop, it performs ingot cropping, head/tail removal, and slice sampling — with automation-ready design that reduces manual handling time. Standard length capacity is 500–2500mm, extendable to 6000mm.
主な特徴
- 🔹 Long Ingot Capacity: Standard 500–2500mm; extendable up to 6000mm for the longest industrial silicon rods
- 🔹 Large Diameter Range: Processes ingots from Φ230–Φ330mm — covering 8-inch and 12-inch crystal growth products
- 🔹 Automation-Ready: Designed for integration with automated loading/unloading systems — reduces operator labor intensity
- 🔹 Unidirectional Wire Cutting: Endless loop wire runs in one direction for consistent cutting force and minimal wire vibration
- 🔹 Fast Cycle Time: 8.5 minutes average cutting time per M10 section (excluding loading time)
- 🔹 Flexible Crop Length: Sample slices 1–5mm; production sections 200–950mm
- 🔹 Fine Wire: Uses Φ0.38–0.5mm cutting wire for minimal kerf loss and clean crop faces
CRYSTAL INGOT CROPPER TECHNICAL SPECIFICATION
| いや。 | パラメータ | 仕様 |
| 1 | Ingot Diameter Range (mm) | Φ230 – Φ330 |
| 2 | Round Rod Length Range (mm) | 500 – 2500 (extendable to 6000) |
| 3 | Sample Slice Length (mm) | 1 – 5 (manual handling) |
| 4 | Production Section Length (mm) | 200 – 950 |
| 5 | Cutting Wire Diameter (mm) | Φ0.38 – Φ0.5 |
| 6 | Average Cutting Time (M10, excl. auxiliary) | 8.5 minutes |
| 7 | Machine Dimensions L×W×H (mm) | 5950 × 2100 × 2700 |
| 8 | カッティング・モード | Unidirectional endless wire loop |
| 9 | Automation Compatibility | Yes — automation-ready (except sample slices and head/tail) |
代表的な用途
- Silicon ingot sectioning — cutting full-length CZ or FZ silicon rods into sections for multi-wire saw feeding
- Head and tail removal — removing seed-end and tang-end material before slicing
- Quality sampling — cutting 1–5mm sample slices for resistivity and crystal quality measurement
- Sapphire boule cropping — sectioning sapphire growth boules before c-plane slicing
- SiC crystal cropping — preparing SiC boules for wafer slicing steps
- Germanium and quartz ingot sectioning for specialty semiconductor applications
HOW THE CRYSTAL INGOT CROPPER FITS YOUR PRODUCTION LINE
- 🔵 Crystal Growth — CZ/FZ puller produces full-length silicon rod (up to 6000mm)
- 🔴 Crystal Ingot Cropper (This Machine) — Crops rod into sections, removes head/tail, cuts quality samples
- 🟡 Loop Wire Saw Machine — Additional sampling, squaring bar reverse cutting
- 🟢 SOM4-630D / SOM4-1000D Multi-Wire Saw — Mass wafer production from cropped sections
AUTOMATION INTEGRATION
- ✅ Automated cropping sections (200–950mm) — fully robot-compatible loading and unloading
- ✅ Reduced operator labor — operator only handles sample slices and head/tail material
- ✅ Programmable crop plans — CNC-controlled crop length sequences per ingot specification
- ✅ Integration-ready I/O — compatible with factory automation and MES systems
FREQUENTLY ASKED QUESTIONS
Q: Can the 6000mm extension handle very long FZ silicon ingots?
Yes. With the 6000mm extension option, the machine processes the longest FZ silicon rods currently produced commercially. Specify at time of order.
Q: How does crop face quality compare to band saw cropping?
Band saws have 1.5–3mm kerf loss. The Crystal Ingot Cropper uses Φ0.38–0.5mm diamond wire — 3–5× lower kerf loss, preserving more valuable ingot material per crop cycle.
Q: Can it handle 300mm diameter ingots?
Standard range is Φ230–330mm. For 300mm ingots, contact us to discuss custom workpiece holder configurations.
Q: What is the after-sales support arrangement?
Vimfun provides remote technical support and spare parts globally. On-site service available in major semiconductor manufacturing regions.
RELATED PRODUCTS
Downstream processing: Loop Wire Saw Machine | SOM4-630D Multi-Wire Saw | SOM4-1000D Multi-Wire Saw
Diamond wire consumables: Diamond Wire for Semiconductor Cutting