13B-6LY/P Lapping Machine
그만큼 13B-6LY/P lapping machine is a compact 6-carrier planetary system engineered for precision double-sided grinding and polishing of sapphire wafers, SiC substrates, optical filters, and glass. Achieves flatness ≤0.015 mm and sub-nanometer surface roughness on workpieces up to Φ210 mm — with pressure control accuracy of ±10 N.
그만큼 13B-6LY/P lapping machine is designed for manufacturers who need compact, precise double-sided surface conditioning of hard and brittle materials. With a Φ933 mm plate diameter and 6-carrier planetary drive, this machine supports production of semiconductor wafers, optical filters, and advanced ceramic components that require strict flatness and sub-micron surface roughness. It is the entry point in Vimfun's double-sided grinding and polishing line, and the preferred choice when workpiece diameters are within Φ210 mm. For larger workpieces, see the 16B-5LY/P 또는 22BF-5LY/P.
13B-6LY/P Lapping Machine — 6 Key Features
The sun gear uses pin gear transmission, increasing meshing strength and contact rigidity of the planetary gear. This reduces maintenance difficulty and lowers the long-term servicing cost of ring gear and sun gear components.
New gantry-style machine structure significantly enhances overall rigidity and precision, ensuring stable, uniform pressure distribution throughout the grinding and polishing process — even under varying load conditions.
Four-motor configuration with VFD speed control enables smooth startup and shutdown without mechanical impact, preventing workpiece damage. Each motor can be tuned for optimal speed based on material type and process stage.
Upper and lower limits of the ring gears are electrically adjustable. The meshing position shifts along the workpiece thickness direction, ensuring stable and consistent engagement between ring gears and planetary carriers throughout the process cycle.
The main spindle uses high-precision crossed roller bearings, delivering exceptional rotational accuracy and load capacity. This is the mechanical foundation behind the 13B's ability to hold flatness ≤0.015 mm across extended production runs.
The optional thickness measurement system provides ±2 μm accuracy over a 0–25 mm range. Real-time closed-loop thickness control stops the machine precisely at the target dimension — no manual measurement interruptions needed.
Technical Specifications — 13B-6LY/P-4M
| 매개변수 | 가치 | Note |
|---|---|---|
| External Dimensions (incl. spindle cylinder) | 1830 × 1350 × 2610 mm | |
| Polishing Plate Size (SUS 410) | Φ933 × Φ350 × 50 mm | |
| Lapping Plate Size (ductile cast iron) | Φ933 × Φ350 × 50 mm | Ring groove type |
| Max Workpiece Diameter | Φ210 mm | |
| Pressure Range | 120 ~ 3500 N | Expandable |
| Pressure Control Accuracy | ±10 N | |
| Carrier Quantity | 6 pcs | Z147 sun gear |
| Gear Module | DP12 | |
| Lower Plate Runout | ≤ 0.04 mm | |
| Lower Plate Flatness | ≤ 0.015 mm | Field repairable |
| Outer Gear Circular Runout | ≤ 0.30 mm | |
| Central Gear Circular Runout | ≤ 0.10 mm | |
| Thickness Measurement Range | 0 ~ 25 mm | 선택 사항 |
| Thickness Measurement Accuracy | ±2 μm | 선택 사항 |
| Lower Plate Drive | 7.5 kW | Worm gear reducer motor |
| Upper Plate Drive | 5.5 kW | Worm gear reducer motor |
| Outer Ring Gear Drive | 1.5 kW | Worm gear reducer motor |
| Central Wheel Drive | 1.5 kW | Worm gear reducer motor |
| 총 전력 | 18 kW | AC380V |
| 기계 무게 | ~ 4300 kg | Approximate |
| Sun Gear Rotation | Software-controlled | Forward / Reverse |
| Main Bearing Type | High-precision crossed roller bearing |
What Materials Can the 13B-6LY/P Process?
Double-sided lapping and polishing of sapphire wafer lapping substrates up to Φ210 mm for LED and optical applications. Achieves sub-nanometer Ra and TTV under 1 μm.
Precision surface preparation of SiC substrates for power electronics. Independent speed control optimizes material removal while maintaining TTV below 1 μm.
Precision double-sided lapping of interference filters and bandpass filters. Parallelism critical for optical performance — achieved reliably at ≤0.015 mm flatness.
Ultra-thin glass substrates for display and semiconductor packaging. The 120 N minimum pressure capability prevents breakage on fragile workpieces as thin as 0.1 mm.
Alumina, zirconia, and silicon nitride components for structural and electronic applications. Mohs 7–9 hardness is handled efficiently by the planetary lapping action.
Quartz crystals and blue glass for frequency control and optical components. Optional ±2 μm measurement system ensures precise target thickness control.
Why Choose the Vimfun 13B-6LY/P
Vimfun inherits all technical expertise from the former Jiangxi AVIC Optics, backed by 17 utility model patents, 14 software copyrights, and 4 invention patents in precision grinding and polishing.
Previously a qualified supplier for Biel Crystal, Foxconn, Lens Technology, and BYD. The 13B-6LY/P lapping machine technology has been validated in the most demanding high-volume production environments.
Vimfun manufactures its own QT500-7 ductile cast iron lapping plates with CNC double-sided grinding to flatness ≤0.015 mm. Plates are ready to use on delivery — no break-in dressing required.
Full solution including equipment, process support, and consumables: slotted lapping plates, diamond conditioning wheels, ring gears, and polishing pads. One supplier for equipment and all ongoing consumables.
Frequently Asked Questions — 13B-6LY/P Lapping Machine
The 13B-6LY/P handles sapphire, optical filters, silicon carbide (SiC), blue glass, glass wafers, sapphire wafers, ceramics, crystals, semiconductors, and metals. Any hard and brittle material with workpiece diameter up to Φ210 mm is within specification.
The 13B-6LY/P supports ultra-light pressure mode. The minimum pressure of 120 N, combined with the planetary carrier system, enables processing of workpieces as thin as 0.1 mm — as demonstrated with glass wafer samples in our product catalog.
Under appropriate slurry and polishing pad conditions, the 13B-6LY/P achieves sub-nanometer surface roughness. Combined with flatness ≤0.015 mm and TTV under 1 μm, this meets semiconductor-grade and optical-grade wafer surface quality requirements. For independent data on achievable Ra for sapphire, see ScienceDirect: Sapphire Wafer Processing.
Yes. Two interchangeable plate sets are included: a ductile cast iron slotted plate for lapping and a SUS 410 stainless steel plate for polishing. Both are Φ933 × Φ350 × 50 mm and can be swapped to convert between lapping and polishing operations.
Choose the 13B-6LY/P when your workpieces are within Φ210 mm in diameter, you need 6 carriers for higher per-batch piece count, or you are working in a space-constrained production environment. For workpieces between Φ210–390 mm or when P5-grade bearing precision is required, the 16B-5LY/P is the better choice.
Standard lead time is 60–90 days from order confirmation. On-site installation, machine commissioning, and operator training are included with every purchase. Contact us for project-specific scheduling.
Other Grinding & Lapping Machines
Tell us your material, workpiece diameter, and flatness requirement — our engineers respond within 24 hours with a tailored technical proposal.
Email: daria@endlesswiresaw.com | Tel: +86 130 2773 8908