SOM4-1000D Large-Scale Multi-Wire Saw – Industrial 1000mm Ingot Slicing Machine
The SOM4-1000D is Vimfun’s largest and most powerful multi-wire saw, designed for maximum-throughput ingot slicing at industrial scale. With a 4-axis dual-station design, 1000×200mm per-station workpiece capacity, and an 85kW main drive, it is the definitive choice for high-volume silicon wafer production and large-format semiconductor material processing.
主な特徴
- 🔹 1000mm Maximum Ingot Length: Our largest workpiece capacity — handles full-length silicon ingots and oversized crystal blocks
- 🔹 85kW Main Drive Motor: The most powerful in the SOM series — maintains constant wire speed through the densest materials
- 🔹 Dual-Board Design: Two 1000×200mm stations process ingots simultaneously for maximum throughput per floor space
- 🔹 Widest Slice Range: 1.5–25mm covers wafer production, thick slab cutting, and squaring operations
- 🔹 Best for High-Volume Single Product: Optimized for mass production of a single wafer specification
- 🔹 Precision Rigid Frame: Large cast structure provides vibration damping even at maximum load
- 🔹 Fully CNC Programmable: Complete parameter control — wire speed, tension, feed rate, slicing program management
SOM4-1000D TECHNICAL SPECIFICATION
| いや。 | パラメータ | 仕様 |
| 1 | Max. Workpiece Size (L×W mm) | 1000 × 200 (×2 stations / dual-board) |
| 2 | Slice Thickness Range (mm) | 1.5 – 25 |
| 3 | Groove Wheel Diameter (mm) | 140 – 160 |
| 4 | Main Motor Power (kW) | 85 |
| 5 | Average Power Consumption (kW) | ≤ 30 |
| 6 | Machine Dimensions L×W×H (mm) | 2900 × 2300 × 2600 |
| 7 | Number of Stations | 2 (Dual-Board) |
| 8 | カッティング・モード | Forward-cut (正切), 4-axis |
| 9 | Compatible Materials | Silicon, SiC, Sapphire, GaAs, NdFeB, Technical Ceramics |
代表的な用途
- Mass polysilicon and monocrystalline silicon wafer production for solar panels and semiconductor devices
- High-throughput SiC boule slicing for power electronics (EV inverters, industrial drives)
- Large-scale サファイア ingot slicing for LED, optical, and consumer electronics
- Full-length silicon ingot processing — entire ingot sliced in one programming cycle
- Industrial NdFeB permanent magnet block slicing for wind turbine and EV motor supply chains
- Thick technical ceramic slab production from large alumina, zirconia, and silicon nitride blocks
SOM SERIES COMPARISON: CHOOSE THE RIGHT SCALE
| Model | Max. Length | Power | Stations | Best For |
| SOMS3-430S | 430mm | ≤15 kW avg | Single | R&D, SiC precision |
| SOM4-630D | 630mm | 38kW | Dual | Mid-volume production |
| SOM4-750D | 750mm | 42kW | Dual | Large workpiece, ID replacement |
| SOM4-1000D | 1000mm | 85kW | Dual | Maximum throughput, mass production |
ROI ADVANTAGE OF SOM4-1000D AT SCALE
- More wafers per cycle: 1000mm ingot length means more wafers per cutting cycle than any other SOM model
- Dual-board operation: Two ingots cut simultaneously — effectively doubles production capacity
- Low energy per wafer: Despite 85kW peak power, average ≤30kW — energy cost per wafer is highly competitive at scale
- Minimal changeover: Long ingots reduce the number of load/unload cycles per production shift
FREQUENTLY ASKED QUESTIONS
Q: What is the maximum ingot diameter the SOM4-1000D can process?
The 1000mm refers to workpiece length; the maximum width is 200mm per station. Contact us with your ingot diameter specifications for a custom fixturing assessment.
Q: How does the SOM4-1000D compare to imported large-format wire saws?
The SOM4-1000D provides comparable technical specifications to European and Japanese large-format multi-wire saws at significantly lower cost, with full local support and shorter lead times.
Q: What is the delivery lead time?
90–120 days. We recommend contacting us early in your production planning process.
RELATED PRODUCTS
See the full SOM lineup: SOM4-750D (750mm) | SOM4-630D (630mm) | Crystal Ingot Cropper (upstream cropping)
Essential consumables: Diamond Wire for Semiconductor Cutting | Spiral-Coated Endless Diamond Wire