3D Semiconductor Profile Cutting is a way to cut hard things like wafers, ceramics, and sapphire very carefully. It is used to make chips, sensors, and other electronic parts. These parts must be very exact and strong. Normal cutting tools cannot do this well. So special machines like 4-axis diamond wire cutting and 3D diamond […]
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An Industrial Rotary Diamond Wire Saw is a smart machine for clean, accurate cutting. It is designed for hard and brittle materials. A thin wire with a diamond on it is used in this machine. The wire cuts carefully and slowly. Because of this, the material does not break or crack. Many factories and labs
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A Semiconductor Material Cutter is a key machine in modern factories. It is used to cut very hard and very weak materials. Electronic parts and chips are made from these materials. Ceramics, sapphire, silicon, and silicon carbide are examples of common materials. These materials are very brittle. Because of this, cutting must be slow and
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