About Vimfun: Experts in Precision Cutting for the Semiconductor Materials

Who We Are
What We Specialize In
Our machines are engineered to handle the most challenging materials, including:
-
Cacbua silic, ngọc bích, Alumina, and Quartz
-
Piezoelectric Ceramics Và Magnetic Materials
-
Advanced Composites Và Single Crystals (Si/Ge)
We offer:
-
Ultra-thin slicing (≥ 0.1 mm)
-
Contour and multi-face profile cutting
-
Dry and wet cutting options
-
CNC programmable multi-axis systems
Whether you’re slicing sapphire rods or dicing alumina ceramics, Vimfun delivers precise and consistent results.
Technology & Quality You Can Trust
Focused on Semiconductors
We engineer machines specifically for semiconductor material's physical and thermal properties.
Integrated Design & Manufacturing
CNC Automation
Proprietary Diamond Wire System
Application-Centric Development
Proven Experience in Equipment Manufacturing
What We Offer
-
Diamond wire cutting machines for slicing, profiling, angle, and rotary cutting
-
One-stop custom solutions: mechanical design, software functions, sample testing, and delivery
-
Remote support and export-ready packaging for global customers
Customization at Every Level
No two materials are the same. That’s why we offer:
-
Customized equipment size and cutting stroke
-
Custom jigs and fixtures based on your workpiece
-
Software features tailored to slicing, shaping, or contour control
-
Integration with your workflow, from R&D to mass production
About Endless Diamond Wire Cutting
Why It’s Perfect for Semiconductor Materials
Semiconductor materials like silicon carbide, sapphire, alumina, and piezoelectric ceramics are extremely hard and brittle, requiring cutting solutions that deliver both precision and surface integrity. Vimfun’s endless diamond wire saws offer key advantages over traditional cutting methods:
Ultra-Fine and Clean Cutting
The closed-loop diamond wire creates low vibration, resulting in:
-
Minimal edge chipping and material loss
-
No micro-cracks or thermal damage
-
Mirror-like cutting surfaces suitable for downstream polishing or bonding
Superior Stability in Thin Slicing
Capable of cutting ultra-thin wafers as low as 0.1 mm, while maintaining:
-
Consistent thickness
-
High repeatability
-
Smooth surface finish ideal for optical and electronic components
Flexible Geometry and Automation
-
Supports straight cuts, angled cuts, and complex profiles
-
Optional multi-axis CNC programming for multi-faceted or custom shapes
-
Allows dry or wet cutting, adapting to different material requirements
Cleaner Process, Less Debris
Compared to blade or ID saws, the cutting process produces:
-
-
Less particulate dust
-
Easier integration into cleanroom environments
-
Compatibility with water/oil-based cooling systems
-
Our Commitment to You
-
1-year full warranty Và lifetime technical support
-
Free sample testing and customized equipment recommendations
-
Fast delivery with DDP/CIF shipping options
-
Detailed English manuals, online training, and operation videos
At Vimfun, we are not just a machine supplier—we are your long-term partner in advanced materials processing.
Global Presence
Our cutting systems are trusted by leading companies and institutions across the world, including:
-
Edmund Optics
-
SGL Carbon
-
Coherent
-
Gavish
-
Kingsview
We’ve delivered equipment to customers in the United States, Germany, Japan, South Korea, Italy, Singapore, and India, among others.














