SOM4-750D Multi-Wire Saw – Dual-Station 750mm Ingot Slicing Machine
The SOM4-750D is a 4-axis dual-station multi-wire saw designed for large-workpiece ingot slicing, with a maximum workpiece size of 750×180×150mm per station and a 42kW main drive motor. It is the recommended replacement for traditional ID saws in high-volume silicon ingot and SiC crystal processing.
Key Features
- 🔹 Large 750mm Capacity: Processes 750×180×150mm workpieces — handles larger ingots than the SOM4-630D
- 🔹 Dual-Station Efficiency: Two independent workpiece stations run simultaneously for maximum production throughput
- 🔹 42kW Main Drive: Powerful constant-speed cutting through dense SiC and sapphire ingots
- 🔹 ID Saw Replacement: Specifically designed to replace legacy inner-diameter (ID) saw lines
- 🔹 Precision Low-CG Frame: Low center-of-gravity structure reduces vibration at high wire speeds
- 🔹 Compact Footprint: 2450×2000×2000mm — same footprint as SOM4-630D despite larger capacity
- 🔹 Wide Wire Pitch Flexibility: 160–180mm groove wheels support customized slice thickness programs
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SOM4-750D TECHNICAL SPECIFICATION
| No. | Tham số | Specification |
| 1 | Max. Workpiece Size (L×W×H mm) | 750 × 180 × 150 (×2 stations) |
| 2 | Slice Thickness Range (mm) | 1.5 – 20 |
| 3 | Groove Wheel Diameter (mm) | 160 – 180 |
| 4 | Main Motor Power (kW) | 42 |
| 5 | Average Power Consumption (kW) | ≤ 30 |
| 6 | Machine Dimensions L×W×H (mm) | 2450 × 2000 × 2000 |
| 7 | Number of Stations | 2 (Dual-Station) |
| 8 | Cutting Mode | Forward-cut (正切), 4-axis |
| 9 | Compatible Materials | Silicon, SiC, Sapphire, NdFeB, Ceramics, Metal alloys |
TYPICAL APPLICATIONS
- High-volume silicon ingot slicing for solar cell wafer production
- Industrial-scale SiC crystal block processing into power device substrates
- Large sapphire boule batch slicing for LED and optical wafer production
- Replacing ID saw production lines — compatible with standard 6-inch ingot dimensions
- Thick-slab cutting of technical ceramics for industrial substrate applications
- Large NdFeB magnet block slicing for EV motor and wind turbine applications
REPLACING YOUR ID SAW LINE WITH SOM4-750D
| Factor | ID Saw | SOM4-750D |
| Wafers per ingot pass | 1 (single slice) | Multiple (full ingot in one pass) |
| Kerf loss | ~0.3mm per slice | ~0.15–0.18mm wire kerf |
| Tool cost | High (blade replacement) | Lower (diamond wire replacement) |
| Throughput | Thấp | 5–10× higher for same ingot size |
| Max. ingot diameter | Limited by blade ID | Up to 750mm length ingots |
| Automation potential | Thấp | High — CNC programmable |
FREQUENTLY ASKED QUESTIONS
Q: Is the SOM4-750D suitable for 24/7 continuous operation?
Yes. The SOM4-750D is designed for continuous industrial operation with automatic lubrication and modular maintenance architecture.
Q: How does the dual-station design work in practice?
Each station has its own workpiece holder and can be loaded/unloaded independently while the other station is cutting, eliminating machine idle time between ingot changes.
Q: What is typical kerf loss vs. ID saw?
Diamond wire kerf is approximately 0.15–0.18mm vs. ~0.3mm for ID saw blades — 60% less material waste per slice.
RELATED PRODUCTS
See full SOM series: SOM4-630D (630mm) | SOM4-1000D (1000mm flagship) | SOMS3-430S (430mm compact)
Also: Diamond Wire for Semiconductor Cutting | 4-Axis CNC Diamond Wire Saw