{"id":5823,"date":"2026-10-06T05:25:14","date_gmt":"2026-10-06T09:25:14","guid":{"rendered":"https:\/\/www.semiconductorcutting.com\/?post_type=product&#038;p=5823"},"modified":"2026-10-06T05:33:06","modified_gmt":"2026-10-06T09:33:06","slug":"inverted-multi-wire-saw-somi-430","status":"publish","type":"product","link":"https:\/\/www.semiconductorcutting.com\/ru\/product\/inverted-multi-wire-saw-somi-430\/","title":{"rendered":"\u041f\u0435\u0440\u0435\u0432\u0435\u0440\u043d\u0443\u0442\u0430\u044f \u043c\u043d\u043e\u0433\u043e\u043f\u0440\u043e\u0432\u043e\u043b\u043e\u0447\u043d\u0430\u044f \u043f\u0438\u043b\u0430 SOMI-430"},"content":{"rendered":"<div data-elementor-type=\"wp-post\" data-elementor-id=\"5823\" class=\"elementor elementor-5823 elementor-bc-flex-widget\" data-elementor-post-type=\"product\">\n\t\t\t\t<div class=\"elementor-element elementor-element-somi4301 e-con-full e-flex e-con e-parent\" data-id=\"somi4301\" data-element_type=\"container\" 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text{font-family:var(--mono);font-size:12px;fill:var(--ink)}\n@media(max-width:860px){.scp .hero .wrap,.scp .grid2,.scp .vids{grid-template-columns:1fr}.scp .stats{grid-template-columns:repeat(2,1fr)}.scp .grid3,.scp .gal{grid-template-columns:1fr}}\n\n.scp.somi430-product{width:100%;overflow-wrap:break-word}.scp.somi430-product .wrap{width:100%;min-width:0}.scp.somi430-product .grid2>*{min-width:0}.scp.somi430-product .tw{max-width:100%}.scp.somi430-product .hero .photo{background:#fff}.scp.somi430-product .hero img{max-height:580px;object-fit:contain}.scp.somi430-product .gal{grid-template-columns:repeat(2,minmax(0,1fr))}.scp.somi430-product .gal img{aspect-ratio:4\/3;object-fit:contain;background:#fff}.scp.somi430-product .cta .kicker{color:var(--lime)}\n@media(max-width:600px){.scp.somi430-product .gal{grid-template-columns:1fr}.scp.somi430-product .wrap{padding-inline:20px}.scp.somi430-product .hero .btn{display:block;margin-bottom:12px;text-align:center}.scp.somi430-product .stat .v{font-size:20px}}\n@media(max-width:600px){.scp.somi430-product table.spec{min-width:0;table-layout:fixed;font-size:13px}.scp.somi430-product table.spec td{padding:10px 8px;white-space:normal;overflow-wrap:anywhere}}.scp.somi430-product .hero{padding:80px 0 40px}.scp.somi430-product .hero h1{font-size:clamp(30px,3.4vw,46px)}.scp.somi430-product .hero img{height:360px;object-fit:contain}.scp.somi430-product .photo{background:white}.scp.somi430-product .detail img{height:260px;object-fit:contain}.scp.somi430-product .diagram text{font-size:17px}@media(max-width:860px){.scp.somi430-product .hero{padding:32px 0}.scp.somi430-product .hero img{height:260px}}<\/style><div class=\"scp somi430-product\"><section class=\"hero\"><div class=\"wrap\"><div><p class=\"model\">Vimfun SOMI-430 \u00b7 Two-axis inverted cutting<\/p><h1>\u041f\u0435\u0440\u0435\u0432\u0435\u0440\u043d\u0443\u0442\u0430\u044f \u043c\u043d\u043e\u0433\u043e\u043f\u0440\u043e\u0432\u043e\u043b\u043e\u0447\u043d\u0430\u044f \u043f\u0438\u043b\u0430 SOMI-430<\/h1><p class=\"lede\">An inverted multi wire saw for thin slices of silicon, sapphire, ceramics, optical glass and silicon carbide. The workpiece feeds upward into the wire web.<\/p><div class=\"stats\"><div class=\"stat\"><div class=\"v\">430 \u043c\u043c<\/div><div class=\"l\">Max. workpiece length<\/div><\/div><div class=\"stat\"><div class=\"v\">0,3\u20133 \u043c\u043c<\/div><div class=\"l\">\u0422\u043e\u043b\u0449\u0438\u043d\u0430 \u0440\u0435\u0437\u043a\u0438<\/div><\/div><div class=\"stat\"><div class=\"v\">2 axes<\/div><div class=\"l\">Spindle arrangement<\/div><\/div><div class=\"stat\"><div class=\"v\">1,200<\/div><div class=\"l\">Max. wire speed, m\/min<\/div><\/div><\/div><a class=\"btn\" href=\"https:\/\/www.semiconductorcutting.com\/ru\/%d0%be%d0%b1%d1%80%d0%b5%d0%b7%d0%ba%d0%b8-%d0%b1%d0%bb%d0%b5%d1%81%d1%82%d1%8f%d1%89%d0%b5%d0%b9-%d0%bf%d1%80%d0%be%d0%b2%d0%be%d0%bb%d0%be%d0%ba%d0%b8\/\">Request free sample cutting<\/a><a class=\"btn alt\" href=\"#specs\">View specifications<\/a><\/div><figure class=\"photo\"><img fetchpriority=\"high\" decoding=\"async\" src=\"https:\/\/www.semiconductorcutting.com\/wp-content\/uploads\/2026\/10\/somi-430-inverted-multi-wire-saw.png\" width=\"547\" height=\"457\" alt=\"\u0418\u043b\u043b\u044e\u0441\u0442\u0440\u0430\u0446\u0438\u044f \u043e\u0431\u043e\u0440\u0443\u0434\u043e\u0432\u0430\u043d\u0438\u044f \u043f\u0435\u0440\u0435\u0432\u0435\u0440\u043d\u0443\u0442\u043e\u0439 \u043c\u043d\u043e\u0433\u043e\u043f\u0440\u043e\u0432\u043e\u043b\u043e\u0447\u043d\u043e\u0439 \u043f\u0438\u043b\u044b SOMI-430\" ><figcaption>Equipment illustration from the SOMI-430 technical presentation; not a machine photograph.<\/figcaption><\/figure><\/div><\/section><section><div class=\"wrap\"><span class=\"kicker\">From ingot to slice<\/span><h2>Where does SOMI-430 fit in your process?<\/h2><p>SOMI-430 accepts a prepared hard and brittle workpiece within a listed 430 \u00d7 160 \u00d7 150 mm envelope. It divides the material into parallel slices before subsequent grinding, lapping or polishing. Define the as-cut thickness together with the allowance needed for those later operations.<\/p><div class=\"flow\"><div class=\"s\">Prepare the ingot<\/div><div class=\"s\">Mount the workpiece<\/div><div class=\"s on\">Inverted slicing<\/div><div class=\"s\">Inspect the slices<\/div><div class=\"s\">Lap \/ polish<\/div><\/div><p>The 0.3\u20133 mm range describes slice thickness, not flatness, total thickness variation or finished-wafer quality. Those acceptance requirements need to be agreed and checked on the actual material. For downstream equipment, see our <a href=\"https:\/\/www.semiconductorcutting.com\/ru\/double-sided-lapping-machine\/\">double-sided lapping machine guide<\/a>.<\/p><\/div><\/section><section class=\"band\"><div class=\"wrap\"><span class=\"kicker\">The defining mechanism<\/span><h2>How does an inverted multi wire saw feed the workpiece?<\/h2><p>In inverted cutting, the workpiece approaches the running wire web from below. In standard downward-feed cutting, it approaches from above. The distinction is the workpiece feed direction; both arrangements can use wire that reverses direction during the cutting cycle.<\/p><svg class=\"diagram\" viewbox=\"0 0 940 350\" role=\"img\" aria-label=\"Conceptual comparison of upward inverted feed and downward standard feed\"><rect x=\"10\" y=\"10\" width=\"450\" height=\"325\" rx=\"6\" fill=\"#e6f3ee\"\/><rect x=\"480\" y=\"10\" width=\"450\" height=\"325\" rx=\"6\" fill=\"#f3f8f6\"\/><text x=\"45\" y=\"48\">SOMI-430: inverted feed<\/text><text x=\"515\" y=\"48\">Standard downward feed<\/text><g stroke=\"#257259\" fill=\"#fff\" stroke-width=\"3\"><circle cx=\"75\" cy=\"130\" r=\"27\"\/><circle cx=\"395\" cy=\"130\" r=\"27\"\/><circle cx=\"545\" cy=\"220\" r=\"27\"\/><circle cx=\"865\" cy=\"220\" r=\"27\"\/><path d=\"M75 103H395M75 157H395M545 193H865M545 247H865\"\/><rect x=\"165\" y=\"230\" width=\"140\" height=\"65\"\/><rect x=\"635\" y=\"85\" width=\"140\" height=\"65\"\/><\/g><g fill=\"#257259\"><path d=\"M225 222V193H214L235 169L256 193H245V222Z\"\/><path d=\"M695 156V169H684L705 188L726 169H715V156Z\"\/><\/g><text x=\"180\" y=\"269\">Workpiece<\/text><text x=\"650\" y=\"125\">Workpiece<\/text><text x=\"142\" y=\"89\">Moving wire web<\/text><text x=\"610\" y=\"295\">Workpiece moves down<\/text><\/svg><p class=\"model\">Feed-direction illustration only. Wire routing, fixturing and machine clearances are schematic, not to scale.<\/p><p>Diamond wire passes from the pay-off spool through the grooved-roller system and onto the take-up spool. The parallel wire spans cut the workpiece as the table advances. Roller groove pitch establishes the spacing between cuts; actual kerf removes material from that spacing. Measure kerf on a trial cut rather than equating it with nominal wire diameter.<\/p><div class=\"grid2\"><div class=\"card\"><h3>Specify the mounting arrangement<\/h3><p>Review how the workpiece is supported during upward feed and how the resulting slices will be handled. Include bonding or fixture dimensions in the usable-capacity check.<\/p><\/div><div class=\"card\"><h3>Verify the thin-slice result<\/h3><p>Feed direction alone does not establish a yield or edge-chipping improvement. The supplied material, wire, feed recipe and holding method must be evaluated together before accepting a production process.<\/p><\/div><\/div><\/div><\/section><section><div class=\"wrap\"><span class=\"kicker\">Materials and applications<\/span><h2>Which workpieces are within the intended application range?<\/h2><p>The technical presentation identifies photovoltaic, semiconductor, optical and electronic-ceramic slicing. Material suitability still depends on the grade, geometry and acceptance criteria.<\/p><div class=\"tw\"><table><thead><tr><th>\u041c\u0430\u0442\u0435\u0440\u0438\u0430\u043b<\/th><th>What to specify before a trial<\/th><\/tr><\/thead><tbody><tr><td>\u041a\u0440\u0435\u043c\u043d\u0438\u0439<\/td><td>Ingot dimensions, orientation and downstream finishing allowance<\/td><\/tr><tr><td>\u0421\u0430\u043f\u0444\u0438\u0440<\/td><td>Crystal orientation, workpiece section and edge-quality requirement<\/td><\/tr><tr><td>Silicon carbide<\/td><td>Material grade, target slice thickness and surface acceptance<\/td><\/tr><tr><td>\u041a\u0435\u0440\u0430\u043c\u0438\u043a\u0430<\/td><td>Composition, incoming condition and support during slicing<\/td><\/tr><tr><td>\u041e\u043f\u0442\u0438\u0447\u0435\u0441\u043a\u043e\u0435 \u0441\u0442\u0435\u043a\u043b\u043e<\/td><td>Glass type, dimensions and permitted edge damage<\/td><\/tr><\/tbody><\/table><\/div><p class=\"note\">The minimum listed thickness is not a promise for every material in this table. Request sample cutting when thin sections, expensive material or limited finishing allowance make the result especially sensitive.<\/p><\/div><\/section><section class=\"band\" id=\"specs\"><div class=\"wrap\"><span class=\"kicker\">\u0422\u0435\u0445\u043d\u0438\u0447\u0435\u0441\u043a\u0438\u0439 \u043f\u0430\u0441\u043f\u043e\u0440\u0442<\/span><h2>Technical specifications<\/h2><div class=\"tw\"><table class=\"spec\"><thead><tr><th>\u0410\u0440\u0442\u0438\u043a\u0443\u043b<\/th><th>SOMI-430<\/th><\/tr><\/thead><tbody><tr><td>\u041c\u0435\u0442\u043e\u0434 \u0440\u0435\u0437\u043a\u0438<\/td><td>Inverted feed; reciprocating wire<\/td><\/tr><tr><td>Maximum workpiece dimensions<\/td><td>430 \u00d7 160 \u00d7 150 \u043c\u043c<\/td><\/tr><tr><td>\u0422\u043e\u043b\u0449\u0438\u043d\u0430 \u0440\u0435\u0437\u043a\u0438<\/td><td>0,3\u20133 \u043c\u043c<\/td><\/tr><tr><td>Spindles<\/td><td>2 axes<\/td><\/tr><tr><td>Grooved roller material<\/td><td>Polyurethane<\/td><\/tr><tr><td>Roller diameter<\/td><td>140\u2013160 \u043c\u043c<\/td><\/tr><tr><td>\u0414\u0438\u0430\u043c\u0435\u0442\u0440 \u043f\u0440\u043e\u0432\u043e\u043b\u043e\u043a\u0438<\/td><td>0.13\u20130.25 mm<\/td><\/tr><tr><td>Wire spool capacity<\/td><td>Up to 30,000 m<\/td><\/tr><tr><td>Reciprocating wire speed<\/td><td>Up to 1,200 m\/min<\/td><\/tr><tr><td>Direction reversals<\/td><td>Up to 10 per minute<\/td><\/tr><tr><td>Worktable lift stroke<\/td><td>Up to 180 mm<\/td><\/tr><tr><td>Traverse stroke<\/td><td>80 mm<\/td><\/tr><tr><td>Main-unit power (listed)<\/td><td>20 \u043a\u0412\u0442<\/td><\/tr><tr><td>Overall dimensions<\/td><td>2,450 \u00d7 2,000 \u00d7 2,000 mm<\/td><\/tr><tr><td>\u0412\u0435\u0441 \u0441\u0442\u0430\u043d\u043a\u0430<\/td><td>3,000 kg<\/td><\/tr><\/tbody><\/table><\/div><p class=\"note\">These are listed equipment specifications, not the recommended settings for every cut. Cutting-feed settings and electrical load calculations are confirmed in the technical agreement. No numerical thickness-tolerance claim is supplied for this model.<\/p><\/div><\/section><section><div class=\"wrap\"><span class=\"kicker\">Machine assemblies<\/span><h2>What controls the wire web and cutting motion?<\/h2><div class=\"grid2 detail\"><div><figure class=\"photo\"><img loading=\"lazy\" decoding=\"async\" src=\"https:\/\/www.semiconductorcutting.com\/wp-content\/uploads\/2026\/10\/somi-430-spindle-roller.png\" width=\"647\" height=\"386\" alt=\"SOMI-430 spindle and grooved roller illustration\"><figcaption>Spindle and roller illustration from the technical presentation.<\/figcaption><\/figure><h3>Clamped spindle and roller support<\/h3><p>The specification describes clamped spindles with synchronized control. The roller bearings use an oil-cooled bushing arrangement to manage their operating conditions during high-speed running. Roller condition and groove selection remain part of the cutting setup.<\/p><\/div><div><figure class=\"photo\"><img loading=\"lazy\" decoding=\"async\" src=\"https:\/\/www.semiconductorcutting.com\/wp-content\/uploads\/2026\/10\/somi-430-machine-layout.png\" width=\"557\" height=\"448\" alt=\"SOMI-430 machine layout illustration\"><figcaption>Machine layout illustration from the technical presentation.<\/figcaption><\/figure><h3>Servo-driven feed and wire handling<\/h3><p>Spindle rotation, wire pay-off, take-up, traverse, tension and worktable feed use servo drives and an EtherCAT control system. The axes perform different tasks: moving wire, laying it onto the spool, controlling tension and advancing the workpiece.<\/p><\/div><\/div><h3>Process monitoring and wire-break protection<\/h3><p>Process data such as cutting tension are monitored during operation. Depending on alarm severity, the controller warns or stops the machine; operation can resume after user confirmation. The documented wire-break protection stops the machine when a break is detected. This protective function does not replace correct setup and inspection.<\/p><\/div><\/section><section class=\"band\"><div class=\"wrap\"><span class=\"kicker\">Model selection<\/span><h2>SOMI-430 or SOMI2-600S?<\/h2><p>Start with workpiece length, then review the required process window. Both are inverted-cutting models with a listed 0.3\u20133 mm slice range. The larger model accommodates a longer workpiece and has a higher maximum wire speed; that does not automatically mean a shorter accepted-part cycle for your material.<\/p><div class=\"tw\"><table><thead><tr><th>\u041c\u043e\u0434\u0435\u043b\u044c<\/th><th>Workpiece capacity<\/th><th>Maximum wire speed<\/th><\/tr><\/thead><tbody><tr><td>SOMI-430<\/td><td>430 \u00d7 160 \u00d7 150 \u043c\u043c<\/td><td>1,200 m\/min<\/td><\/tr><tr><td><a href=\"https:\/\/www.semiconductorcutting.com\/ru\/%d0%bf%d1%80%d0%be%d0%b4%d1%83%d0%ba%d1%82\/ultra-thin-wafer-slicing-wire-saw\/\">SOMI2-600S<\/a><\/td><td>660 \u00d7 160 \u00d7 150 mm<\/td><td>2,200 m\/min<\/td><\/tr><\/tbody><\/table><\/div><p>For workpieces up to 430 mm long, assess SOMI-430 first. When the same width and height must accommodate a longer charge, compare SOMI2-600S. For small laboratory batches within 200 \u00d7 200 \u00d7 200 mm, consider <a href=\"https:\/\/www.semiconductorcutting.com\/ru\/%d0%bf%d1%80%d0%be%d0%b4%d1%83%d0%ba%d1%82\/small-multi-wire-saw-som200\/\">SOM200<\/a>. For swing-assisted cutting of SiC, alumina or sapphire, compare the <a href=\"https:\/\/www.semiconductorcutting.com\/ru\/%d0%bf%d1%80%d0%be%d0%b4%d1%83%d0%ba%d1%82\/oscillating-multi-wire-saw-somis-400\/\">SOMIS-400 oscillating multi wire saw<\/a>. If you need a different loading arrangement, use the <a href=\"https:\/\/www.semiconductorcutting.com\/ru\/multi-wire-saw-machine\/\">complete multi wire saw model guide<\/a>.<\/p><p>When a specification uses the term reverse cutting wire saw, confirm whether it describes upward workpiece feed or simply reciprocating wire travel. On SOMI-430, inverted cutting refers to upward workpiece feed.<\/p><\/div><\/section><section><div class=\"wrap\"><span class=\"kicker\">Before ordering<\/span><h2>Utilities, installation and sample cutting<\/h2><p>Power supply, coolant, compressed air, foundation, lifting access, service space and site safety requirements are confirmed with your order \u2014 please ask us. Overall machine dimensions alone do not define the complete installation area.<\/p><p>For a useful trial, provide the material grade, incoming dimensions, finished-part drawing, target as-cut thickness and finishing allowance. Agree the inspection method and acceptance criteria before comparing results. Include loading, unloading and changeover when estimating production capacity.<\/p><h2>Warranty and after-sales support<\/h2><p>CE certified \u00b7 12-month warranty \u00b7 Response within 12 hours \u00b7 Free sample cutting.<\/p><\/div><\/section><section class=\"cta\"><div class=\"wrap grid2\"><div><span class=\"kicker\">Discuss your application<\/span><h2>Send your material and target slice thickness<\/h2><p>Share the workpiece dimensions and required result so we can review the inverted cutting multi wire saw configuration with you.<\/p><a class=\"btn\" href=\"https:\/\/www.semiconductorcutting.com\/ru\/%d0%be%d0%b1%d1%80%d0%b5%d0%b7%d0%ba%d0%b8-%d0%b1%d0%bb%d0%b5%d1%81%d1%82%d1%8f%d1%89%d0%b5%d0%b9-%d0%bf%d1%80%d0%be%d0%b2%d0%be%d0%bb%d0%be%d0%ba%d0%b8\/\">Request free sample cutting<\/a><\/div><div><h3>Include with your enquiry<\/h3><ul class=\"list\"><li>Material grade and incoming condition<\/li><li>Workpiece and fixture dimensions<\/li><li>Target thickness and finishing allowance<\/li><li>Batch size and inspection requirements<\/li><\/ul><\/div><\/div><\/section><\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>","protected":false},"excerpt":{"rendered":"<p>\u0414\u0432\u0443\u0445\u043e\u0441\u0435\u0432\u0430\u044f \u043f\u0435\u0440\u0435\u0432\u0435\u0440\u043d\u0443\u0442\u0430\u044f \u0440\u0435\u0437\u043a\u0430 \u043a\u0440\u0435\u043c\u043d\u0438\u044f, \u0441\u0430\u043f\u0444\u0438\u0440\u0430 \u0438 \u043a\u0435\u0440\u0430\u043c\u0438\u043a\u0438. \u0417\u0430\u0433\u043e\u0442\u043e\u0432\u043a\u0438 \u0440\u0430\u0437\u043c\u0435\u0440\u043e\u043c 430 \u00d7 160 \u00d7 150 \u043c\u043c; \u0434\u0438\u0430\u043f\u0430\u0437\u043e\u043d \u043d\u0430\u0440\u0435\u0437\u043a\u0438 0,3\u20133 \u043c\u043c.<\/p>","protected":false},"featured_media":5820,"comment_status":"closed","ping_status":"closed","template":"elementor_header_footer","meta":{"_acf_changed":false,"site-sidebar-layout":"no-sidebar","site-content-layout":"page-builder","ast-site-content-layout":"full-width-container","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"","adv-header-id-meta":"","stick-header-meta":"","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"default","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}}},"product_brand":[],"product_cat":[789,242],"product_tag":[],"class_list":["post-5823","product","type-product","status-publish","has-post-thumbnail","product_cat-multi-wire-saw-machines","product_cat-products","desktop-align-left","tablet-align-left","mobile-align-left","ast-product-gallery-layout-horizontal-slider","ast-product-gallery-with-no-image","first","instock","shipping-taxable","product-type-simple"],"acf":[],"_links":{"self":[{"href":"https:\/\/www.semiconductorcutting.com\/ru\/wp-json\/wp\/v2\/product\/5823","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.semiconductorcutting.com\/ru\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/www.semiconductorcutting.com\/ru\/wp-json\/wp\/v2\/types\/product"}],"replies":[{"embeddable":true,"href":"https:\/\/www.semiconductorcutting.com\/ru\/wp-json\/wp\/v2\/comments?post=5823"}],"version-history":[{"count":2,"href":"https:\/\/www.semiconductorcutting.com\/ru\/wp-json\/wp\/v2\/product\/5823\/revisions"}],"predecessor-version":[{"id":5834,"href":"https:\/\/www.semiconductorcutting.com\/ru\/wp-json\/wp\/v2\/product\/5823\/revisions\/5834"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.semiconductorcutting.com\/ru\/wp-json\/wp\/v2\/media\/5820"}],"wp:attachment":[{"href":"https:\/\/www.semiconductorcutting.com\/ru\/wp-json\/wp\/v2\/media?parent=5823"}],"wp:term":[{"taxonomy":"product_brand","embeddable":true,"href":"https:\/\/www.semiconductorcutting.com\/ru\/wp-json\/wp\/v2\/product_brand?post=5823"},{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/www.semiconductorcutting.com\/ru\/wp-json\/wp\/v2\/product_cat?post=5823"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/www.semiconductorcutting.com\/ru\/wp-json\/wp\/v2\/product_tag?post=5823"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}