{"id":5814,"date":"2026-10-06T04:55:35","date_gmt":"2026-10-06T08:55:35","guid":{"rendered":"https:\/\/www.semiconductorcutting.com\/?post_type=product&#038;p=5814"},"modified":"2026-10-06T04:55:35","modified_gmt":"2026-10-06T08:55:35","slug":"dual-plate-multi-wire-saw-som400","status":"publish","type":"product","link":"https:\/\/www.semiconductorcutting.com\/ko\/product\/dual-plate-multi-wire-saw-som400\/","title":{"rendered":"Dual Plate Multi Wire Saw SOM400"},"content":{"rendered":"<div data-elementor-type=\"wp-post\" data-elementor-id=\"5814\" class=\"elementor elementor-5814 elementor-bc-flex-widget\" data-elementor-post-type=\"product\">\n\t\t\t\t<div class=\"elementor-element elementor-element-som4001 e-con-full e-flex e-con e-parent\" data-id=\"som4001\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-som4002 elementor-widget elementor-widget-html\" data-id=\"som4002\" data-element_type=\"widget\" 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text{font-family:var(--mono);font-size:12px;fill:var(--ink)}\n@media(max-width:860px){.scp .hero .wrap,.scp .grid2,.scp .vids{grid-template-columns:1fr}.scp .stats{grid-template-columns:repeat(2,1fr)}.scp .grid3,.scp .gal{grid-template-columns:1fr}}\n\n.scp.som400-product{width:100%;overflow-wrap:break-word}.scp.som400-product .wrap{width:100%;min-width:0}.scp.som400-product .grid2>*{min-width:0}.scp.som400-product .tw{max-width:100%}.scp.som400-product .hero .photo{background:#fff}.scp.som400-product .hero img{max-height:580px;object-fit:contain}.scp.som400-product .gal{grid-template-columns:repeat(2,minmax(0,1fr))}.scp.som400-product .gal img{aspect-ratio:4\/3;object-fit:contain;background:#fff}.scp.som400-product .cta .kicker{color:var(--lime)}\n@media(max-width:600px){.scp.som400-product .gal{grid-template-columns:1fr}.scp.som400-product .wrap{padding-inline:20px}.scp.som400-product .hero .btn{display:block;margin-bottom:12px;text-align:center}.scp.som400-product .stat .v{font-size:20px}}\n@media(max-width:600px){.scp.som400-product table.spec{min-width:0;table-layout:fixed;font-size:13px}.scp.som400-product table.spec td{padding:10px 8px;white-space:normal;overflow-wrap:anywhere}}\n.scp.som400-product .diagram text{font-size:17px}.scp.som400-product .hero .photo{background:#fff}.scp.som400-product .hero img{height:auto;max-height:600px;object-fit:contain}.scp.som400-product .model-note{margin-top:18px;font-size:14px;color:var(--ink-soft)}<\/style><div class=\"scp som400-product\"><section class=\"hero\"><div class=\"wrap\"><div><p class=\"model\">Vimfun SOM400 \u00b7 Single station \/ Dual work plates<\/p><h1>Dual Plate Multi Wire Saw SOM400<\/h1><p class=\"lede\">A dual plate multi wire saw for large-section hard and brittle blocks. SOM400 combines two work plates in one station, a listed charge capacity of <strong>400 \u00d7 400 \u00d7 830 mm<\/strong> and a <strong>1\u201335 mm<\/strong> slice range.<\/p><div class=\"stats\"><div class=\"stat\"><div class=\"v\">400 mm<\/div><div class=\"l\">Max. width &amp; height<\/div><\/div><div class=\"stat\"><div class=\"v\">1\u201335 mm<\/div><div class=\"l\">\uc2ac\ub77c\uc774\uc2a4 \ub450\uaed8<\/div><\/div><div class=\"stat\"><div class=\"v\">2 plates<\/div><div class=\"l\">One work station<\/div><\/div><div class=\"stat\"><div class=\"v\">1,200<\/div><div class=\"l\">Max. wire speed, m\/min<\/div><\/div><\/div><a class=\"btn\" href=\"https:\/\/www.semiconductorcutting.com\/ko\/%ec%83%a4%ec%9d%b8-%ec%99%80%ec%9d%b4%ec%96%b4-%ec%bb%b7\/\">\ubb34\ub8cc \uc0d8\ud50c \uc808\ub2e8 \uc694\uccad<\/a><a class=\"btn alt\" href=\"#specs\">View specifications<\/a><p class=\"model-note\">The charge dimensions describe the loading arrangement, not a separate 400 \u00d7 400 \u00d7 830 mm allowance for each plate.<\/p><\/div><figure class=\"photo\"><img fetchpriority=\"high\" decoding=\"async\" src=\"https:\/\/www.semiconductorcutting.com\/wp-content\/uploads\/2026\/10\/som400-dual-plate-multi-wire-saw.png\" width=\"1254\" height=\"1254\" alt=\"SOM400 dual plate multi wire saw appearance illustration\"><figcaption>SOM400 appearance illustration based on the product reference photograph. Confirm the final configuration with your order.<\/figcaption><\/figure><\/div><\/section><section><div class=\"wrap\"><span class=\"kicker\">Where it fits<\/span><h2>Where does SOM400 fit in a block-to-slice process?<\/h2><p>Start with an ingot section, sintered block or other prepared workpiece that fits the proposed loading arrangement. The saw creates parallel slices; it does not replace the grinding, lapping or polishing that establishes the finished surfaces. Plan the as-cut thickness together with the allowance required by the next operation.<\/p><div class=\"flow\"><div class=\"s\">Prepare the block<\/div><div class=\"s\">Bond to work plates<\/div><div class=\"s on\">Multi-wire slicing<\/div><div class=\"s\">Inspect the slices<\/div><div class=\"s\">Grind \/ lap \/ polish<\/div><\/div><p>A large cross-section is the main reason to shortlist this machine. Compare both width and height before choosing by model number: a machine built for a longer, narrower ingot may not accommodate the same section. Fixtures, bonding layers and the unloading method also occupy working space.<\/p><p>For downstream planning, review <a href=\"https:\/\/www.semiconductorcutting.com\/ko\/double-sided-lapping-machine\/\">double-sided lapping<\/a> \uadf8\ub9ac\uace0 <a href=\"https:\/\/www.semiconductorcutting.com\/ko\/grinding-lapping-machine\/\">grinding and lapping equipment<\/a> against your finished-part requirements.<\/p><\/div><\/section><section class=\"band\"><div class=\"wrap\"><span class=\"kicker\">The defining layout<\/span><h2>What does a dual plate multi wire saw change?<\/h2><p>Two work plates are arranged side by side within one station. Both workpieces are presented to the same cutting process, so the loading plan must account for the material, geometry and cutting requirements of the complete charge. This is a dual work-plate arrangement, not two independently specified production machines.<\/p><svg class=\"diagram\" viewbox=\"0 0 900 340\" role=\"img\" aria-label=\"Conceptual plan of two work plates within one SOM400 station\"><rect x=\"70\" y=\"50\" width=\"760\" height=\"215\" rx=\"8\" fill=\"#e6f3ee\" stroke=\"#257259\" stroke-width=\"2\"\/><text x=\"105\" y=\"88\">ONE WORK STATION<\/text><rect x=\"125\" y=\"115\" width=\"285\" height=\"105\" fill=\"#fff\" stroke=\"#2e8b68\" stroke-width=\"2\"\/><rect x=\"490\" y=\"115\" width=\"285\" height=\"105\" fill=\"#fff\" stroke=\"#2e8b68\" stroke-width=\"2\"\/><text x=\"205\" y=\"175\">Work plate A<\/text><text x=\"570\" y=\"175\">Work plate B<\/text><text x=\"115\" y=\"300\">Combined charge: 400 \u00d7 400 \u00d7 830 mm \u00b7 Layout illustration, not to scale<\/text><\/svg><div class=\"grid2\"><div class=\"card\"><h3>Use the charge capacity carefully<\/h3><p>The specification lists a maximum cross-section of 400 \u00d7 400 mm and a charge size of 400 \u00d7 400 \u00d7 830 mm. Send a drawing of the proposed blocks and fixtures so the usable loading arrangement can be confirmed.<\/p><\/div><div class=\"card\"><h3>Count accepted output<\/h3><p>Two plates can put two workpieces through a cycle. They do not guarantee twice the accepted output of another process. Include bonding, loading, cutting, unloading, inspection and changeover when estimating parts per shift.<\/p><\/div><\/div><\/div><\/section><section><div class=\"wrap\"><span class=\"kicker\">Working principle<\/span><h2>How do four rollers establish the cutting web?<\/h2><p>Diamond wire travels from the pay-off spool around four grooved rollers to form parallel cutting spans, then onto the take-up spool. The work table feeds the bonded workpieces through the running web. Roller grooves establish cut spacing, while the material removed by the actual kerf determines how much of that spacing remains as slice thickness.<\/p><div class=\"grid3\"><div class=\"card\"><h3>Independent servo drives<\/h3><p>Each roller axis has its own servo drive. The specified belt-free arrangement removes belts from the drive transmission. Wire setup, roller condition and maintenance still affect the result.<\/p><\/div><div class=\"card\"><h3>Reciprocating diamond wire<\/h3><p>The specification lists wire speed up to 1,200 m\/min and up to eight direction reversals per minute. These are equipment limits; the working recipe depends on material and part requirements.<\/p><\/div><div class=\"card\"><h3>Controlled wire tension<\/h3><p>The listed tension range is 0\u201332 N. Tension, feed, mounting and wire condition must be considered together. A maximum catalogue setting is not a default production setting.<\/p><\/div><\/div><p class=\"note\">Measure kerf on the actual cut rather than treating wire diameter as the kerf. For small allowances, agree where and how slice thickness and variation will be inspected before the trial.<\/p><\/div><\/section><section class=\"band\"><div class=\"wrap\"><span class=\"kicker\">Materials and output<\/span><h2>Which materials should be considered for this machine?<\/h2><p>The source specification lists semiconductor crystals, optical and infrared materials, advanced ceramics and magnetic materials. The list is a starting point for review; it does not mean that one wire and one cutting recipe apply to every material or grade.<\/p><div class=\"tw\"><table><thead><tr><th>Material family<\/th><th>Examples in the specification<\/th><th>What to define<\/th><\/tr><\/thead><tbody><tr><td>Semiconductor crystals<\/td><td>Silicon, germanium, gallium arsenide, indium phosphide<\/td><td>Crystal orientation, incoming section and finishing allowance<\/td><\/tr><tr><td>\ucca8\ub2e8 \uc138\ub77c\ubbf9<\/td><td>Silicon carbide, sapphire, alumina, zirconia<\/td><td>Grade, edge condition and sample-cut acceptance<\/td><\/tr><tr><td>Optical and infrared materials<\/td><td>Optical glass, quartz, fused silica, ZnSe, ZnS, CaF\u2082<\/td><td>Material identification and the required cut surface<\/td><\/tr><tr><td>\uc790\uae30 \uc7ac\ub8cc<\/td><td>NdFeB, SmCo, ferrite<\/td><td>Material condition, mounting and downstream process<\/td><\/tr><\/tbody><\/table><\/div><p>The listed slice range is 1\u201335 mm. It is not a finished-part tolerance and does not establish suitability for every material at the lower limit. For dedicated straight and arc magnet production, compare the options in our <a href=\"https:\/\/www.semiconductorcutting.com\/ko\/ndfeb-cutting-machine\/\">magnet machining guide<\/a>.<\/p><\/div><\/section><section id=\"specs\"><div class=\"wrap\"><span class=\"kicker\">\ub370\uc774\ud130\uc2dc\ud2b8<\/span><h2>Technical specifications<\/h2><div class=\"grid2\"><div class=\"tw\"><table class=\"spec\"><thead><tr><th colspan=\"2\">\uc808\ub2e8 \uc6a9\ub7c9<\/th><\/tr><\/thead><tbody><tr><td>Work stations<\/td><td>1, with two work plates<\/td><\/tr><tr><td>Maximum charge \/ loading arrangement<\/td><td>400 \u00d7 400 \u00d7 830 mm<\/td><\/tr><tr><td>Maximum workpiece cross-section<\/td><td>400 \u00d7 400 mm<\/td><\/tr><tr><td>\uc2ac\ub77c\uc774\uc2a4 \ub450\uaed8<\/td><td>1\u201335 mm<\/td><\/tr><tr><td>Listed thickness tolerance<\/td><td>\u00b10.02 mm<\/td><\/tr><tr><td>\uc640\uc774\uc5b4 \uc18d\ub3c4<\/td><td>0\u20131,200 m\/min<\/td><\/tr><tr><td>Direction reversals<\/td><td>Up to 8 per minute<\/td><\/tr><tr><td>\uc640\uc774\uc5b4 \uc7a5\ub825<\/td><td>0\u201332 N<\/td><\/tr><tr><td>Take-up spool capacity<\/td><td>3 km<\/td><\/tr><\/tbody><\/table><\/div><div class=\"tw\"><table class=\"spec\"><thead><tr><th colspan=\"2\">Machine and drives<\/th><\/tr><\/thead><tbody><tr><td>Grooved rollers<\/td><td>4, polyurethane-coated<\/td><\/tr><tr><td>Roller diameter<\/td><td>180 \u00b1 10 mm<\/td><\/tr><tr><td>Roller center distance<\/td><td>610 mm<\/td><\/tr><tr><td>Spindle runout<\/td><td>\u22640.01 mm<\/td><\/tr><tr><td>Drives<\/td><td>Independent servo drives; no belts<\/td><\/tr><tr><td>Full-load power<\/td><td>60 kW<\/td><\/tr><tr><td>Main-body dimensions<\/td><td>1,516 \u00d7 2,885 \u00d7 2,440 mm<\/td><\/tr><tr><td>\uae30\uacc4 \uc911\ub7c9<\/td><td>Approx. 8 t<\/td><\/tr><tr><td>Wire diameter, feed and table stroke<\/td><td>Confirmed in the technical agreement<\/td><\/tr><\/tbody><\/table><\/div><\/div><p class=\"note\">The tolerance is a specification value, not a guarantee for every material and fixture. Validate the required as-cut result through sample cutting. Confirm the final wire configuration, feed settings and delivered dimensions in the technical agreement.<\/p><\/div><\/section><section class=\"band\"><div class=\"wrap\"><span class=\"kicker\">Inside the machine<\/span><h2>Main assemblies and their role in the process<\/h2><ul class=\"list\"><li><strong>One-piece cast frame and wall plate.<\/strong> Provide a rigid support structure for the rollers and cutting area. Frame stiffness is one part of maintaining geometry under the changing loads of reciprocating cutting.<\/li><li><strong>Spindles and grooved rollers.<\/strong> Carry the cutting web and establish the wire positions. The specification lists spindle runout of \u22640.01 mm; roller condition and groove selection remain setup considerations.<\/li><li><strong>Wire pay-off and take-up.<\/strong> Manage the wire supply and collection. The fixed-spool traverse arrangement lays the wire without shuttling the entire reels back and forth.<\/li><li><strong>Work table and dual plates.<\/strong> Carry the bonded workpieces through the web. Review fixture clearances, charge balance and access for unloading the sliced material.<\/li><li><strong>Motorized enclosure.<\/strong> Provides access for loading when raised and encloses the cutting area during operation. Site layout and safe operating requirements are confirmed for the delivered configuration.<\/li><li><strong>Cooling and process control.<\/strong> Support control of the cutting conditions. Coolant compatibility and the operating recipe must be reviewed for the supplied material.<\/li><\/ul><\/div><\/section><section><div class=\"wrap\"><span class=\"kicker\">Choose by the workpiece<\/span><h2>SOM400, SOM4-630D or SOM4-1000D?<\/h2><p>These machines serve production work, but their capacities describe different shapes and loading arrangements. SOM400 emphasizes cross-section; the other two emphasize longer, narrower workpieces. Compare all dimensions and the part drawing before choosing an industrial multi wire saw.<\/p><div class=\"tw\"><table><thead><tr><th>\ubaa8\ub378<\/th><th>Listed workpiece \/ charge<\/th><th>Main selection reason<\/th><\/tr><\/thead><tbody><tr><td>SOM400<\/td><td>400 \u00d7 400 \u00d7 830 mm, dual work plates<\/td><td>Large cross-section and two-plate loading<\/td><\/tr><tr><td><a href=\"https:\/\/www.semiconductorcutting.com\/ko\/%ec%a0%9c%ed%92%88\/multi-wire-saw-som4-630d\/\">SOM4-630D<\/a><\/td><td>630 \u00d7 160 \u00d7 150 mm \u00d7 2<\/td><td>Silicon squaring and narrower production blocks<\/td><\/tr><tr><td><a href=\"https:\/\/www.semiconductorcutting.com\/ko\/%ec%a0%9c%ed%92%88\/large-scale-multi-wire-saw-som4-1000d\/\">SOM4-1000D<\/a><\/td><td>1000 \u00d7 200 \u00d7 150 mm \u00d7 2<\/td><td>Long workpieces and repeat production<\/td><\/tr><\/tbody><\/table><\/div><p>If your workpieces fit within 200 \u00d7 200 \u00d7 200 mm and you mainly run laboratory batches, review <a href=\"https:\/\/www.semiconductorcutting.com\/ko\/%ec%a0%9c%ed%92%88\/small-multi-wire-saw-som200\/\">SOM200<\/a> before selecting a larger machine. For inverted, swing-assisted and dedicated thin-slice options, return to the <a href=\"https:\/\/www.semiconductorcutting.com\/ko\/multi-wire-saw-machine\/\">complete SOM model guide<\/a>.<\/p><\/div><\/section><section class=\"band\"><div class=\"wrap\"><span class=\"kicker\">From specification to trial<\/span><h2>What should be checked before a production order?<\/h2><div class=\"grid2\"><div><h3>Define the incoming charge<\/h3><p>Send the material grade, block dimensions, number of workpieces and proposed holding surfaces. A large format multi wire saw must accommodate the fixture and loading method as well as the nominal block dimensions.<\/p><h3>Agree the acceptance criteria<\/h3><p>Separate the as-cut dimensions from the finished dimensions after grinding or lapping. Include required thickness variation, edge condition, measured kerf and the allowance available for finishing.<\/p><\/div><div><h3>Review the full production cycle<\/h3><p>Evaluate cutting time alongside preparation, bonding, loading, unloading, inspection and changeover. Record the number of accepted pieces per batch so productivity comparisons use the same definition of output.<\/p><h3>Plan installation with the order<\/h3><p>Power supply, coolant, compressed air, foundation, lifting access, service space and site safety requirements are confirmed with your order \u2014 please ask us. Main-body dimensions alone are not an installation plan.<\/p><\/div><\/div><\/div><\/section><section><div class=\"wrap\"><span class=\"kicker\">\ud310\ub9e4 \ud6c4 \uc9c0\uc6d0<\/span><h2>Warranty and service<\/h2><p>CE certified \u00b7 12-month warranty \u00b7 Response within 12 hours \u00b7 Free sample cutting.<\/p><p>Share your intended materials and production requirement so the equipment configuration and trial scope can be discussed before the final technical agreement.<\/p><\/div><\/section><section class=\"cta\"><div class=\"wrap grid2\"><div><span class=\"kicker\">Free sample cutting<\/span><h2>Send your block dimensions and target slice thickness<\/h2><p>Include the material grade, finished-part drawing, proposed batch arrangement and required accepted output.<\/p><a class=\"btn\" href=\"https:\/\/www.semiconductorcutting.com\/ko\/%ec%83%a4%ec%9d%b8-%ec%99%80%ec%9d%b4%ec%96%b4-%ec%bb%b7\/\">\ubb34\ub8cc \uc0d8\ud50c \uc808\ub2e8 \uc694\uccad<\/a><\/div><div><ul class=\"list\"><li>Material and grade<\/li><li>Block and fixture dimensions<\/li><li>As-cut thickness and finishing allowance<\/li><li>Batch size and changeover requirements<\/li><\/ul><p class=\"trust\">CE \uc778\uc99d \u00b7 12\uac1c\uc6d4 \ubcf4\uc99d \u00b7 12\uc2dc\uac04 \uc751\ub2f5 \u00b7 \ubb34\ub8cc \uc0d8\ud50c \uc808\ub2e8<\/p><\/div><\/div><\/section><\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>","protected":false},"excerpt":{"rendered":"<p>Dual work-plate cutting equipment for large-section hard and brittle blocks. 400 \u00d7 400 \u00d7 830 mm charge arrangement; 1\u201335 mm slice range.<\/p>","protected":false},"featured_media":5813,"comment_status":"closed","ping_status":"closed","template":"elementor_header_footer","meta":{"_acf_changed":false,"site-sidebar-layout":"no-sidebar","site-content-layout":"page-builder","ast-site-content-layout":"full-width-container","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"","adv-header-id-meta":"","stick-header-meta":"","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"default","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}}},"product_brand":[],"product_cat":[789,242],"product_tag":[],"class_list":["post-5814","product","type-product","status-publish","has-post-thumbnail","product_cat-multi-wire-saw-machines","product_cat-products","desktop-align-left","tablet-align-left","mobile-align-left","ast-product-gallery-layout-horizontal-slider","ast-product-gallery-with-no-image","first","instock","shipping-taxable","product-type-simple"],"acf":[],"_links":{"self":[{"href":"https:\/\/www.semiconductorcutting.com\/ko\/wp-json\/wp\/v2\/product\/5814","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.semiconductorcutting.com\/ko\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/www.semiconductorcutting.com\/ko\/wp-json\/wp\/v2\/types\/product"}],"replies":[{"embeddable":true,"href":"https:\/\/www.semiconductorcutting.com\/ko\/wp-json\/wp\/v2\/comments?post=5814"}],"version-history":[{"count":1,"href":"https:\/\/www.semiconductorcutting.com\/ko\/wp-json\/wp\/v2\/product\/5814\/revisions"}],"predecessor-version":[{"id":5815,"href":"https:\/\/www.semiconductorcutting.com\/ko\/wp-json\/wp\/v2\/product\/5814\/revisions\/5815"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.semiconductorcutting.com\/ko\/wp-json\/wp\/v2\/media\/5813"}],"wp:attachment":[{"href":"https:\/\/www.semiconductorcutting.com\/ko\/wp-json\/wp\/v2\/media?parent=5814"}],"wp:term":[{"taxonomy":"product_brand","embeddable":true,"href":"https:\/\/www.semiconductorcutting.com\/ko\/wp-json\/wp\/v2\/product_brand?post=5814"},{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/www.semiconductorcutting.com\/ko\/wp-json\/wp\/v2\/product_cat?post=5814"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/www.semiconductorcutting.com\/ko\/wp-json\/wp\/v2\/product_tag?post=5814"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}