{"id":5396,"date":"2026-05-20T17:44:06","date_gmt":"2026-05-20T09:44:06","guid":{"rendered":"https:\/\/www.semiconductorcutting.com\/?page_id=5396"},"modified":"2026-10-10T02:52:42","modified_gmt":"2026-10-10T06:52:42","slug":"multi-wire-saw-machine","status":"publish","type":"page","link":"https:\/\/www.semiconductorcutting.com\/ko\/multi-wire-saw-machine\/","title":{"rendered":"Multi Wire Saw Model Selection Guide"},"content":{"rendered":"\t\t<div data-elementor-type=\"wp-page\" data-elementor-id=\"5396\" class=\"elementor elementor-5396\" data-elementor-post-type=\"page\">\n\t\t\t\t<div class=\"elementor-element elementor-element-c260000 e-con-full mw-layout e-flex e-con e-parent\" data-id=\"c260000\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-w260000 elementor-widget elementor-widget-html\" data-id=\"w260000\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"html.default\">\n\t\t\t\t<div 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dt{font-size:12px;color:#52685e;margin-top:13px}.mw26 .mw-model dd{margin:0;font-size:17px;font-weight:700}.mw26 .mw-model p{font-size:15px}.mw26 .mw-scroll{overflow:auto}.mw26 table{border-collapse:collapse;width:100%;min-width:700px;font-size:14px}.mw26 th,.mw26 td{text-align:left;padding:15px 12px;border-bottom:1px solid #d8e4df}.mw26 th{background:#1c4c39;color:#fff}.mw26 tbody tr:nth-child(even){background:#f1f6f3}.mw26 .mw-links{display:flex;flex-wrap:wrap;gap:10px;margin:22px 0}.mw26 .mw-links a{padding:10px 16px;border:1px solid #b7d3c6;text-decoration:none}.mw26 .mw-note{border-left:3px solid #247b5c;padding:10px 20px;background:#edf5f2;margin:22px 0}.mw26 details{border-bottom:1px solid #cedfd6;padding:19px 0}.mw26 summary{cursor:pointer;font-weight:700;color:#183e31}.mw26 .mw-cta{background:#e8f2ed}.mw26 .mw-checklist{display:grid;grid-template-columns:1fr 1fr;gap:18px}.mw26 .mw-checklist p{border-top:1px solid #abcbbb;padding-top:12px;margin:0}.mw-layout{gap:0!important}.mw26 section[id]{scroll-margin-top:170px}@media(max-width:767px){.mw26 .mw-wrap{padding:0 22px}.mw26 .mw-section{padding:40px 0}.mw26 .mw-hero{padding:42px 0 30px}.mw26 .mw-two{grid-template-columns:1fr;gap:26px}.mw26 .mw-hero img{height:255px}.mw26 .mw-flow{grid-template-columns:1fr 1fr;gap:24px}.mw26 .mw-model{grid-template-columns:1fr;gap:16px}.mw26 .mw-model img{height:230px}.mw26 .mw-tabs button{padding:11px 14px}.mw26 .mw-photo{height:240px}.mw26 .mw-lede{font-size:17px}.mw26 .mw-band strong{font-size:23px}.mw26 .mw-checklist{gap:14px}}\n<\/style><div class=\"mw26\"><section class=\"mw-hero\"><div class=\"mw-wrap mw-two\"><div><span class=\"mw-kicker\">Vimfun \u00b7 SOM series<\/span><h1>Multi Wire Saw Machines for Hard and Brittle Materials<\/h1><p class=\"mw-lede\">From blank to a qualified slicing process. Match your material, part geometry and inspection requirements to the right SOM configuration.<\/p><a class=\"mw-btn\" href=\"https:\/\/www.semiconductorcutting.com\/cut-equipment-manufacturer\/\">Discuss your part<\/a><a class=\"mw-btn mw-btn-alt\" href=\"#routes\">Compare models<\/a><p class=\"mw-small\">10 SOM models \u00b7 6 application groups \u00b7 Free sample cutting<\/p><\/div><figure><img fetchpriority=\"high\" decoding=\"async\" fetchpriority=\"high\" src=\"https:\/\/www.semiconductorcutting.com\/wp-content\/uploads\/2026\/10\/som200-small-multi-wire-saw.jpg\" alt=\"SOM200 multi wire saw machine for laboratory and pilot production\" width=\"1345\" height=\"1169\"><figcaption>SOM200 \u00b7 Laboratory and pilot production<\/figcaption><\/figure><\/div><\/section><\/div>\n<style>\n\/* Page 5396: header wrap and Elementor spacing repair *\/\nbody.page-id-5396 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*\/<\/style>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-c260001 e-con-full mw-layout e-flex e-con e-parent\" data-id=\"c260001\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-w260001 elementor-widget elementor-widget-html\" data-id=\"w260001\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"html.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<div class=\"mw26\"><section id=\"principle\" class=\"mw-section mw-tint\"><div class=\"mw-wrap\"><span class=\"mw-kicker\">The cutting principle<\/span><h2>Understand the cut before choosing the machine<\/h2><div class=\"mw-two\"><figure><img loading=\"lazy\" decoding=\"async\" loading=\"lazy\" class=\"mw-photo\" src=\"https:\/\/www.semiconductorcutting.com\/wp-content\/uploads\/2026\/10\/som200-wire-web-detail-scaled.jpg\" alt=\"Parallel diamond wire web and grooved rollers inside a SOM200\" width=\"1600\" height=\"900\"><figcaption>Wire web and roller detail. <a href=\"https:\/\/www.semiconductorcutting.com\/resources\/video\/\">Explore machine videos<\/a><\/figcaption><\/figure><div class=\"mw-points\"><article><h3>Kerf and material use<\/h3><p>A parallel wire web makes multiple cuts in one feed. Actual kerf depends on the wire and cutting conditions; wire diameter alone is not the measured material loss.<\/p><\/article><article><h3>Thickness and finishing stock<\/h3><p>Wire pitch and actual kerf determine the as-cut slice thickness. Allow separately for grinding or polishing before specifying the finished dimension.<\/p><\/article><article><h3>Workholding and edge condition<\/h3><p>Review support, fixture clearance and release of the slices. Assess edge chipping and surface condition on your material before fixing the production settings.<\/p><\/article><\/div><\/div><\/div><\/section><\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-c260002 e-con-full mw-layout e-flex e-con e-parent\" data-id=\"c260002\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-w260002 elementor-widget elementor-widget-html\" data-id=\"w260002\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"html.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<style>.mw26 #process .mw-flow{gap:24px}.mw26 #process .mw-flow article{min-width:0}.mw26 #process .mw-flow figure{margin:0 0 18px;background:#edf2ef}.mw26 #process .mw-flow img{display:block;width:100%;height:190px;object-fit:contain}.mw26 #process .mw-flow p{font-size:15px}.mw26 #process .mw-process-note{font-size:13px;color:#52685e;margin-top:26px}@media(max-width:1000px){.mw26 #process .mw-flow{grid-template-columns:repeat(2,minmax(0,1fr))}.mw26 #process .mw-flow img{height:220px}}@media(max-width:520px){.mw26 #process .mw-flow{grid-template-columns:1fr}.mw26 #process .mw-flow img{height:240px}}<\/style><div class=\"mw26\"><section id=\"process\" class=\"mw-section\"><div class=\"mw-wrap\"><span class=\"mw-kicker\">From blank to slices<\/span><h2>A clear process, from material to inspection<\/h2><div class=\"mw-flow\"><article><span class=\"mw-step\">STEP 01<\/span><h3>Blank<\/h3><figure><img loading=\"lazy\" decoding=\"async\" loading=\"lazy\" src=\"https:\/\/www.semiconductorcutting.com\/wp-content\/uploads\/2026\/10\/crystal-ingot-before-slicing.jpg\" alt=\"Crystal ingot before cropping and preparation for slicing\" width=\"600\" height=\"450\"><\/figure><p>Crop and prepare the ingot to suit the machine envelope before loading.<\/p><\/article><article><span class=\"mw-step\">STEP 02<\/span><h3>Fixture<\/h3><figure><img loading=\"lazy\" decoding=\"async\" loading=\"lazy\" src=\"https:\/\/www.semiconductorcutting.com\/wp-content\/uploads\/2026\/10\/som200-workholding-fixture.jpg\" alt=\"Workholding fixture inside the SOM200 multi wire saw\" width=\"600\" height=\"450\"><\/figure><p>SOM200 fixture before loading. Review support and clearance for the prepared blank.<\/p><\/article><article><span class=\"mw-step\">STEP 03<\/span><h3>Slice<\/h3><figure><img loading=\"lazy\" decoding=\"async\" loading=\"lazy\" src=\"https:\/\/www.semiconductorcutting.com\/wp-content\/uploads\/2026\/10\/som200-multi-wire-slicing-wire-web-scaled.jpg\" alt=\"Parallel diamond wire web and guide rollers inside the SOM200 multi wire saw\" width=\"600\" height=\"450\"><\/figure><p>Parallel wire web and guide rollers. Set the cutting conditions for the material and slice requirement.<\/p><\/article><article><span class=\"mw-step\">STEP 04<\/span><h3>Inspect<\/h3><figure><img loading=\"lazy\" decoding=\"async\" loading=\"lazy\" src=\"https:\/\/www.semiconductorcutting.com\/wp-content\/uploads\/2026\/10\/wafer-surface-inspection.jpg\" alt=\"Contact probe inspecting a wafer surface\" width=\"600\" height=\"450\"><\/figure><p>Contact-probe inspection. Agree the measurement method and acceptance criteria for your part.<\/p><\/article><\/div><p class=\"mw-process-note\">Images illustrate the individual stages; they do not document a single workpiece or one continuous production run.<\/p><\/div><\/section><\/div><style id=\"mw-equal-process-cards\">\n.mw26 #process .mw-flow{align-items:stretch;grid-auto-rows:1fr;}\n.mw26 #process .mw-flow article{display:flex;flex-direction:column;min-width:0;background:#fff;border:1px solid #d5e2db;border-top:2px solid #247b5c;padding:20px 16px;}\n.mw26 #process .mw-flow h3{margin:0 0 16px;line-height:1.2;}\n.mw26 #process .mw-flow figure{width:100%;height:180px;margin:0 0 16px;flex:0 0 180px;overflow:hidden;background:#edf2ef;}\n.mw26 #process .mw-flow img{width:100%;height:100%;object-fit:cover;object-position:center;}\n.mw26 #process .mw-flow article:nth-child(2) img{object-position:center 65%;}\n.mw26 #process .mw-flow article:nth-child(4) img{object-position:center 48%;}\n.mw26 #process .mw-flow p{margin:0;line-height:1.65;}\n@media(max-width:1000px){.mw26 #process .mw-flow figure{height:220px;flex-basis:220px;}.mw26 #process .mw-flow img{height:100%;}}\n@media(max-width:520px){.mw26 #process .mw-flow figure{height:230px;flex-basis:230px;}.mw26 #process .mw-flow img{height:100%;}}\n<\/style><style id=\"mw-process-effects\">\n.mw26 #process .mw-flow article{transition:transform .25s ease,box-shadow .25s ease,border-color .25s ease;}\n.mw26 #process .mw-flow img{transition:transform .6s ease;}\n@media(hover:hover) and (pointer:fine){\n.mw26 #process .mw-flow article:hover{transform:translateY(-6px);box-shadow:0 12px 26px rgba(24,62,49,.12);border-color:#247b5c;}\n.mw26 #process .mw-flow article:hover img{transform:scale(1.035);}\n.mw26 #process .mw-flow article:hover .mw-step{color:#174d38;}\n}\n@media(prefers-reduced-motion:reduce){.mw26 #process .mw-flow article,.mw26 #process .mw-flow img{transition:none!important;transform:none!important;}}\n<\/style>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-c260003 e-con-full mw-layout e-flex e-con e-parent\" data-id=\"c260003\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-w260003 elementor-widget elementor-widget-html\" data-id=\"w260003\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"html.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<div class=\"mw26\"><div class=\"mw-band\"><div class=\"mw-wrap mw-two\"><strong>Bring a drawing.<br>Agree what to measure.<\/strong><p>Send the material, target thickness, surface requirement and inspection criteria. Use the trial to assess the proposed process before choosing production settings.<\/p><\/div><\/div><\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-c260004 e-con-full mw-layout e-flex e-con e-parent\" data-id=\"c260004\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-w260004 elementor-widget elementor-widget-html\" data-id=\"w260004\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"html.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<div class=\"mw26\"><section id=\"routes\" class=\"mw-section mw-tint\"><div class=\"mw-wrap\"><span class=\"mw-kicker\">SOM series<\/span><h2>Find the right multi wire saw for your application<\/h2><p>Start with the workpiece and cutting route. Then compare the listed envelope and slice range with your fixture and finishing requirements.<\/p><div class=\"mw-tabs\" role=\"tablist\" aria-label=\"Machine application\"><button type=\"button\" role=\"tab\" id=\"mw-tab-lab\" aria-controls=\"lab\" aria-selected=\"false\">Laboratory<\/button><button type=\"button\" role=\"tab\" id=\"mw-tab-production\" aria-controls=\"production\" aria-selected=\"false\">Production<\/button><button type=\"button\" role=\"tab\" id=\"mw-tab-thin\" aria-controls=\"thin\" aria-selected=\"false\">Thin slices<\/button><button type=\"button\" role=\"tab\" id=\"mw-tab-inverted\" aria-controls=\"inverted\" aria-selected=\"false\">Inverted<\/button><button type=\"button\" role=\"tab\" id=\"mw-tab-swing\" aria-controls=\"swing\" aria-selected=\"false\">Swing<\/button><button type=\"button\" role=\"tab\" id=\"mw-tab-magnets\" aria-controls=\"magnets\" aria-selected=\"false\">Magnets<\/button><\/div><div id=\"lab\" role=\"tabpanel\" aria-labelledby=\"mw-tab-lab\"><article class=\"mw-model\" id=\"model-som200\"><figure><img loading=\"lazy\" decoding=\"async\" loading=\"lazy\" src=\"https:\/\/www.semiconductorcutting.com\/wp-content\/uploads\/2026\/10\/som200-small-multi-wire-saw.jpg\" alt=\"Vimfun SOM200 multi wire saw equipment\" width=\"400\" height=\"330\"><\/figure><div><span class=\"mw-kicker\">Laboratory & pilot production<\/span><h3>SOM200<\/h3><dl><dt>Listed workpiece envelope<\/dt><dd>200 \u00d7 200 \u00d7 200 mm<\/dd><dt>Listed slice thickness<\/dt><dd>0.3\u201312 mm<\/dd><\/dl><a class=\"mw-btn mw-btn-alt\" href=\"https:\/\/www.semiconductorcutting.com\/product\/small-multi-wire-saw-som200\/\">View SOM200<\/a><\/div><div><h3 style=\"font-size:18px\">When to consider SOM200<\/h3><p>A compact option for small batches, frequent material changes and process development. Start here when a full production machine would exceed the workpiece and batch requirements.<\/p><\/div><\/article><\/div><div id=\"production\" role=\"tabpanel\" aria-labelledby=\"mw-tab-production\"><article class=\"mw-model\" id=\"model-som400\"><figure><img loading=\"lazy\" decoding=\"async\" loading=\"lazy\" src=\"https:\/\/www.semiconductorcutting.com\/wp-content\/uploads\/2026\/10\/som400-dual-plate-multi-wire-saw.png\" alt=\"Vimfun SOM400 multi wire saw equipment\" width=\"400\" height=\"330\"><\/figure><div><span class=\"mw-kicker\">Dual work plates<\/span><h3>SOM400<\/h3><dl><dt>Listed workpiece envelope<\/dt><dd>400 \u00d7 400 \u00d7 830 mm<\/dd><dt>Listed slice thickness<\/dt><dd>1\u201335 mm<\/dd><\/dl><a class=\"mw-btn mw-btn-alt\" href=\"https:\/\/www.semiconductorcutting.com\/product\/dual-plate-multi-wire-saw-som400\/\">View SOM400<\/a><\/div><div><h3 style=\"font-size:18px\">When to consider SOM400<\/h3><p>Prioritize this model when the workpiece cross-section is the constraint. Its dual work-plate arrangement differs from simply extending the length of a narrow billet. Review the two-plate layout with your fixture.<\/p><\/div><\/article><article class=\"mw-model\" id=\"model-som4-630d\"><figure><img loading=\"lazy\" decoding=\"async\" loading=\"lazy\" src=\"https:\/\/www.semiconductorcutting.com\/wp-content\/uploads\/2026\/04\/SOM4-630D-Multiwire-saw.webp\" alt=\"Vimfun SOM4-630D multi wire saw equipment\" width=\"400\" height=\"330\"><\/figure><div><span class=\"mw-kicker\">Four rollers \u00b7 Dual workstation<\/span><h3>SOM4-630D<\/h3><dl><dt>Listed workpiece envelope<\/dt><dd>630 \u00d7 160 \u00d7 150 mm \u00d7 2<\/dd><dt>Listed slice thickness<\/dt><dd>Confirm for your part<\/dd><\/dl><a class=\"mw-btn mw-btn-alt\" href=\"https:\/\/www.semiconductorcutting.com\/product\/multi-wire-saw-som4-630d\/\">View SOM4-630D<\/a><\/div><div><h3 style=\"font-size:18px\">When to consider SOM4-630D<\/h3><p>For silicon-ingot squaring and hard, brittle workpieces within a narrower cross-section. Confirm the proposed slice range against your drawing before selecting a wire-web pitch.<\/p><\/div><\/article><article class=\"mw-model\" id=\"model-som4-1000d\"><figure><img loading=\"lazy\" decoding=\"async\" loading=\"lazy\" src=\"https:\/\/www.semiconductorcutting.com\/wp-content\/uploads\/2026\/04\/SOM4-1000D-Multiwire-saw.webp\" alt=\"Vimfun SOM4-1000D multi wire saw equipment\" width=\"400\" height=\"330\"><\/figure><div><span class=\"mw-kicker\">Dual workstation \u00b7 Long workpieces<\/span><h3>SOM4-1000D<\/h3><dl><dt>Listed workpiece envelope<\/dt><dd>1000 \u00d7 200 \u00d7 150 mm \u00d7 2<\/dd><dt>Listed slice thickness<\/dt><dd>1.5\u201325 mm<\/dd><\/dl><a class=\"mw-btn mw-btn-alt\" href=\"https:\/\/www.semiconductorcutting.com\/product\/large-scale-multi-wire-saw-som4-1000d\/\">View SOM4-1000D<\/a><\/div><div><h3 style=\"font-size:18px\">When to consider SOM4-1000D<\/h3><p>Consider this model for long, repeat-production workpieces. Check width and height as well as length: a longer machine does not automatically accept the larger cross-section handled by SOM400.<\/p><\/div><\/article><\/div><div id=\"thin\" role=\"tabpanel\" aria-labelledby=\"mw-tab-thin\"><article class=\"mw-model\" id=\"model-soms3-430\"><figure><img loading=\"lazy\" decoding=\"async\" loading=\"lazy\" src=\"https:\/\/www.semiconductorcutting.com\/wp-content\/uploads\/2026\/04\/SOMS3-430S-Multiwire-saw.webp\" alt=\"Vimfun SOMS3-430 multi wire saw equipment\" width=\"400\" height=\"330\"><\/figure><div><span class=\"mw-kicker\">Thin-slice production \u00b7 Swing table<\/span><h3>SOMS3-430<\/h3><dl><dt>Listed workpiece envelope<\/dt><dd>430 \u00d7 160 \u00d7 150 mm<\/dd><dt>Listed slice thickness<\/dt><dd>0.5\u20133 mm<\/dd><\/dl><a class=\"mw-btn mw-btn-alt\" href=\"https:\/\/www.semiconductorcutting.com\/product\/multi-wire-saw-soms3-430s\/\">View SOMS3-430<\/a><\/div><div><h3 style=\"font-size:18px\">When to consider SOMS3-430<\/h3><p>For repeat production of thin, hard-material slices. Compare the required thickness range with SOMIS-400, and evaluate surface condition, fixture support and complete cycle time on the actual material.<\/p><\/div><\/article><\/div><div id=\"inverted\" role=\"tabpanel\" aria-labelledby=\"mw-tab-inverted\"><article class=\"mw-model\" id=\"model-somi-430\"><figure><img loading=\"lazy\" decoding=\"async\" loading=\"lazy\" src=\"https:\/\/www.semiconductorcutting.com\/wp-content\/uploads\/2026\/10\/somi-430-inverted-multi-wire-saw.png\" alt=\"Vimfun SOMI-430 multi wire saw equipment\" width=\"400\" height=\"330\"><\/figure><div><span class=\"mw-kicker\">Inverted feed<\/span><h3>SOMI-430<\/h3><dl><dt>Listed workpiece envelope<\/dt><dd>430 \u00d7 160 \u00d7 150 mm<\/dd><dt>Listed slice thickness<\/dt><dd>0.3\u20133 mm<\/dd><\/dl><a class=\"mw-btn mw-btn-alt\" href=\"https:\/\/www.semiconductorcutting.com\/product\/inverted-multi-wire-saw-somi-430\/\">View SOMI-430<\/a><\/div><div><h3 style=\"font-size:18px\">When to consider SOMI-430<\/h3><p>An inverted-cutting option for shorter workpieces and thin slices. Review the mounting arrangement and required finishing allowance together; the listed slice range is not a finished-wafer tolerance.<\/p><\/div><\/article><article class=\"mw-model\" id=\"model-somi2-600s\"><figure><img loading=\"lazy\" decoding=\"async\" loading=\"lazy\" src=\"https:\/\/www.semiconductorcutting.com\/wp-content\/uploads\/2026\/04\/SOM2-600S-Multiwire-saw.webp\" alt=\"Vimfun SOMI2-600S multi wire saw equipment\" width=\"400\" height=\"330\"><\/figure><div><span class=\"mw-kicker\">High-speed inverted feed<\/span><h3>SOMI2-600S<\/h3><dl><dt>Listed workpiece envelope<\/dt><dd>660 \u00d7 160 \u00d7 150 mm<\/dd><dt>Listed slice thickness<\/dt><dd>0.3\u20133 mm<\/dd><\/dl><a class=\"mw-btn mw-btn-alt\" href=\"https:\/\/www.semiconductorcutting.com\/product\/ultra-thin-wafer-slicing-wire-saw\/\">View SOMI2-600S<\/a><\/div><div><h3 style=\"font-size:18px\">When to consider SOMI2-600S<\/h3><p>For longer workpieces than SOMI-430 within the same listed width and height. The specified maximum reciprocating wire speed is 2,200 m\/min; the working speed must be selected for the material and trial result.<\/p><\/div><\/article><\/div><div id=\"swing\" role=\"tabpanel\" aria-labelledby=\"mw-tab-swing\"><article class=\"mw-model\" id=\"model-somis-400\"><figure><img loading=\"lazy\" decoding=\"async\" loading=\"lazy\" src=\"https:\/\/www.semiconductorcutting.com\/wp-content\/uploads\/2026\/10\/somis-400-oscillating-multi-wire-saw.png\" alt=\"Vimfun SOMIS-400 multi wire saw equipment\" width=\"400\" height=\"330\"><\/figure><div><span class=\"mw-kicker\">Inverted feed + Swing<\/span><h3>SOMIS-400<\/h3><dl><dt>Listed workpiece envelope<\/dt><dd>400 \u00d7 160 \u00d7 160 mm<\/dd><dt>Listed slice thickness<\/dt><dd>0.3\u201315 mm<\/dd><\/dl><a class=\"mw-btn mw-btn-alt\" href=\"https:\/\/www.semiconductorcutting.com\/product\/oscillating-multi-wire-saw-somis-400\/\">View SOMIS-400<\/a><\/div><div><h3 style=\"font-size:18px\">When to consider SOMIS-400<\/h3><p>The planned route for silicon carbide and alumina, with sapphire also within the application scope. Compare this wider thickness range with SOMS3-430 when both a swing mechanism and thin slices are under consideration.<\/p><\/div><\/article><\/div><div id=\"magnets\" role=\"tabpanel\" aria-labelledby=\"mw-tab-magnets\"><article class=\"mw-model\" id=\"model-som-220d\"><figure><img loading=\"lazy\" decoding=\"async\" loading=\"lazy\" src=\"https:\/\/www.semiconductorcutting.com\/wp-content\/uploads\/2026\/10\/som-220d-magnet-multi-wire-saw.png\" alt=\"Vimfun SOM-220D multi wire saw equipment\" width=\"400\" height=\"330\"><\/figure><div><span class=\"mw-kicker\">Dual workstation \u00b7 Straight magnet slices<\/span><h3>SOM-220D<\/h3><dl><dt>Listed workpiece envelope<\/dt><dd>220 \u00d7 220 \u00d7 150 mm \u00d7 2<\/dd><dt>Listed slice thickness<\/dt><dd>2\u20138 mm<\/dd><\/dl><a class=\"mw-btn mw-btn-alt\" href=\"https:\/\/www.semiconductorcutting.com\/product\/magnet-multi-wire-saw-som-220d\/\">View SOM-220D<\/a><\/div><div><h3 style=\"font-size:18px\">When to consider SOM-220D<\/h3><p>For smaller magnet blocks and straight-slice production. Define the as-cut thickness separately from the final ground thickness, and include holding space and edge support in the loading review.<\/p><\/div><\/article><article class=\"mw-model\" id=\"model-som4-750d\"><figure><img loading=\"lazy\" decoding=\"async\" loading=\"lazy\" src=\"https:\/\/www.semiconductorcutting.com\/wp-content\/uploads\/2026\/04\/SMO4-750D-Multiwire-saw-.webp\" alt=\"Vimfun SOM4-750D multi wire saw equipment\" width=\"400\" height=\"330\"><\/figure><div><span class=\"mw-kicker\">Dual workstation \u00b7 Straight + Arc<\/span><h3>SOM4-750D<\/h3><dl><dt>Listed workpiece envelope<\/dt><dd>750 \u00d7 120 \u00d7 150 mm \u00d7 2<\/dd><dt>Listed slice thickness<\/dt><dd>1.5\u201320 mm<\/dd><\/dl><a class=\"mw-btn mw-btn-alt\" href=\"https:\/\/www.semiconductorcutting.com\/product\/multi-wire-saw-som4-750d\/\">View SOM4-750D<\/a><\/div><div><h3 style=\"font-size:18px\">When to consider SOM4-750D<\/h3><p>For longer magnet workpieces and a mix of straight slices and arc segments. Send the inner radius, outer radius and thickness of curved parts so the cutting and subsequent grinding route can be assessed.<\/p><\/div><\/article><\/div><p class=\"mw-small\">Dimensions marked \u00d7 2 refer to two workstations. Listed slice ranges are not finished-part tolerances. Product images show equipment configurations; confirm the ordered arrangement.<\/p><script>(function(){const root=document.getElementById('routes');if(!root)return;const tabs=Array.from(root.querySelectorAll('[role=tab]'));function show(t){tabs.forEach(b=>{let yes=b===t;b.setAttribute('aria-selected',yes);b.tabIndex=yes?0:-1;document.getElementById(b.getAttribute('aria-controls')).hidden=!yes;});}tabs.forEach((t,i)=>{t.addEventListener('click',()=>show(t));t.addEventListener('keydown',e=>{let j;if(e.key==='ArrowRight')j=(i+1)%tabs.length;else if(e.key==='ArrowLeft')j=(i+tabs.length-1)%tabs.length;else if(e.key==='Home')j=0;else if(e.key==='End')j=tabs.length-1;else return;e.preventDefault();show(tabs[j]);tabs[j].focus();});});function hash(){let id=location.hash.slice(1),el=document.getElementById(id);let panel=el&&el.closest('[role=tabpanel]');if(panel){show(tabs.find(t=>t.getAttribute('aria-controls')===panel.id));}}show(tabs[0]);hash();window.addEventListener('hashchange',hash);})();<\/script><\/div><\/section><\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-c260005 e-con-full mw-layout e-flex e-con e-parent\" data-id=\"c260005\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-w260005 elementor-widget elementor-widget-html\" data-id=\"w260005\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"html.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<div class=\"mw26\"><section id=\"comparison\" class=\"mw-section \"><div class=\"mw-wrap\"><span class=\"mw-kicker\">Specifications at a glance<\/span><h2>Compare all 10 SOM models<\/h2><div class=\"mw-scroll\" tabindex=\"0\" aria-label=\"Machine comparison table; scroll horizontally on smaller screens\"><table><thead><tr><th>Model<\/th><th>Workpiece envelope<\/th><th>Slice range<\/th><th>Configuration<\/th><\/tr><\/thead><tbody><tr><td><a href=\"https:\/\/www.semiconductorcutting.com\/product\/small-multi-wire-saw-som200\/\">SOM200<\/a><\/td><td>200 \u00d7 200 \u00d7 200 mm<\/td><td>0.3\u201312 mm<\/td><td>Laboratory & pilot production<\/td><\/tr><tr><td><a href=\"https:\/\/www.semiconductorcutting.com\/product\/dual-plate-multi-wire-saw-som400\/\">SOM400<\/a><\/td><td>400 \u00d7 400 \u00d7 830 mm<\/td><td>1\u201335 mm<\/td><td>Dual work plates<\/td><\/tr><tr><td><a href=\"https:\/\/www.semiconductorcutting.com\/product\/multi-wire-saw-som4-630d\/\">SOM4-630D<\/a><\/td><td>630 \u00d7 160 \u00d7 150 mm \u00d7 2<\/td><td>Confirm for your part<\/td><td>Four rollers \u00b7 Dual workstation<\/td><\/tr><tr><td><a href=\"https:\/\/www.semiconductorcutting.com\/product\/large-scale-multi-wire-saw-som4-1000d\/\">SOM4-1000D<\/a><\/td><td>1000 \u00d7 200 \u00d7 150 mm \u00d7 2<\/td><td>1.5\u201325 mm<\/td><td>Dual workstation \u00b7 Long workpieces<\/td><\/tr><tr><td><a href=\"https:\/\/www.semiconductorcutting.com\/product\/multi-wire-saw-soms3-430s\/\">SOMS3-430<\/a><\/td><td>430 \u00d7 160 \u00d7 150 mm<\/td><td>0.5\u20133 mm<\/td><td>Thin-slice production \u00b7 Swing table<\/td><\/tr><tr><td><a href=\"https:\/\/www.semiconductorcutting.com\/product\/inverted-multi-wire-saw-somi-430\/\">SOMI-430<\/a><\/td><td>430 \u00d7 160 \u00d7 150 mm<\/td><td>0.3\u20133 mm<\/td><td>Inverted feed<\/td><\/tr><tr><td><a href=\"https:\/\/www.semiconductorcutting.com\/product\/ultra-thin-wafer-slicing-wire-saw\/\">SOMI2-600S<\/a><\/td><td>660 \u00d7 160 \u00d7 150 mm<\/td><td>0.3\u20133 mm<\/td><td>High-speed inverted feed<\/td><\/tr><tr><td><a href=\"https:\/\/www.semiconductorcutting.com\/product\/oscillating-multi-wire-saw-somis-400\/\">SOMIS-400<\/a><\/td><td>400 \u00d7 160 \u00d7 160 mm<\/td><td>0.3\u201315 mm<\/td><td>Inverted feed + Swing<\/td><\/tr><tr><td><a href=\"https:\/\/www.semiconductorcutting.com\/product\/magnet-multi-wire-saw-som-220d\/\">SOM-220D<\/a><\/td><td>220 \u00d7 220 \u00d7 150 mm \u00d7 2<\/td><td>2\u20138 mm<\/td><td>Dual workstation \u00b7 Straight magnet slices<\/td><\/tr><tr><td><a href=\"https:\/\/www.semiconductorcutting.com\/product\/multi-wire-saw-som4-750d\/\">SOM4-750D<\/a><\/td><td>750 \u00d7 120 \u00d7 150 mm \u00d7 2<\/td><td>1.5\u201320 mm<\/td><td>Dual workstation \u00b7 Straight + Arc<\/td><\/tr><\/tbody><\/table><\/div><p class=\"mw-note\">Compare the full loading cycle, including fixturing, unloading and inspection. Dual workstations do not by themselves guarantee twice the output. Confirm fixture clearance, utilities and trial conditions with the proposed configuration.<\/p><\/div><\/section><\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-c260006 e-con-full mw-layout e-flex e-con e-parent\" data-id=\"c260006\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-w260006 elementor-widget elementor-widget-html\" data-id=\"w260006\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"html.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<style>.mw26 .mw-material-grid{display:grid;grid-template-columns:repeat(5,minmax(0,1fr));gap:20px;margin:28px 0}.mw26 .mw-material-card{display:flex;flex-direction:column;background:#fff;border:1px solid #cddfd6;text-decoration:none;color:#253a33;overflow:hidden}.mw26 .mw-material-card:hover{border-color:#247b5c;box-shadow:0 5px 18px #173c3114}.mw26 .mw-material-card img{display:block;width:100%;height:165px;object-fit:cover}.mw26 .mw-material-copy{padding:16px;display:flex;flex-direction:column;flex:1}.mw26 .mw-material-card h3{font-size:20px;margin-bottom:8px}.mw26 .mw-material-card p{font-size:14px;margin:0 0 18px}.mw26 .mw-material-more{color:#216b52;font-size:14px;font-weight:bold;margin-top:auto;text-decoration:underline;text-underline-offset:4px}@media(max-width:1000px){.mw26 .mw-material-grid{grid-template-columns:repeat(2,minmax(0,1fr))}}@media(max-width:520px){.mw26 .mw-material-grid{grid-template-columns:1fr}.mw26 .mw-material-card img{height:205px}}<\/style><div class=\"mw26\"><section id=\"materials\" class=\"mw-section mw-tint\"><div class=\"mw-wrap\"><span class=\"mw-kicker\">Start with your material<\/span><h2>Different materials need different process checks<\/h2><p>Explore the material guides to narrow the cutting route, machine configuration and sample requirements.<\/p><div class=\"mw-material-grid\"><a class=\"mw-material-card\" href=\"https:\/\/www.semiconductorcutting.com\/semiconductor-wafer-manufacturing\/\"><img loading=\"lazy\" decoding=\"async\" loading=\"lazy\" src=\"https:\/\/www.semiconductorcutting.com\/wp-content\/uploads\/2026\/04\/Silicon-Si.jpg\" alt=\"Silicon ingots and wafers\" width=\"600\" height=\"400\"><div class=\"mw-material-copy\"><h3>Silicon ingots<\/h3><p>Thin slices, finishing stock and thickness inspection.<\/p><span class=\"mw-material-more\">Explore application<\/span><\/div><\/a><a class=\"mw-material-card\" href=\"https:\/\/www.semiconductorcutting.com\/sic-ingot-slicing\/\"><img loading=\"lazy\" decoding=\"async\" loading=\"lazy\" src=\"https:\/\/www.semiconductorcutting.com\/wp-content\/uploads\/2026\/10\/sic-ingot-slicing-banner.jpg\" alt=\"Ingots and wafer on a workbench\" width=\"600\" height=\"400\"><div class=\"mw-material-copy\"><h3>Silicon carbide<\/h3><p>Review the cutting route and surface condition on a trial.<\/p><span class=\"mw-material-more\">Explore application<\/span><\/div><\/a><a class=\"mw-material-card\" href=\"https:\/\/www.semiconductorcutting.com\/quartz-wafer-slicing\/\"><img loading=\"lazy\" decoding=\"async\" loading=\"lazy\" src=\"https:\/\/www.semiconductorcutting.com\/wp-content\/uploads\/2025\/05\/quartz-rod-cut.png\" alt=\"Clear quartz rods\" width=\"600\" height=\"400\"><div class=\"mw-material-copy\"><h3>Quartz wafers<\/h3><p>Define crystal orientation, cut geometry and edge criteria.<\/p><span class=\"mw-material-more\">Explore application<\/span><\/div><\/a><a class=\"mw-material-card\" href=\"https:\/\/www.semiconductorcutting.com\/sapphire-cutting\/\"><img loading=\"lazy\" decoding=\"async\" loading=\"lazy\" src=\"https:\/\/www.semiconductorcutting.com\/wp-content\/uploads\/2026\/10\/wafer-handling-banner-20261007.jpg\" alt=\"Wafer handling and storage cassette\" width=\"600\" height=\"400\"><div class=\"mw-material-copy\"><h3>Sapphire<\/h3><p>Review wafer support, slice thickness and finishing allowance.<\/p><span class=\"mw-material-more\">Explore application<\/span><\/div><\/a><a class=\"mw-material-card\" href=\"https:\/\/www.semiconductorcutting.com\/ndfeb-cutting-machine\/\"><img loading=\"lazy\" decoding=\"async\" loading=\"lazy\" src=\"https:\/\/www.semiconductorcutting.com\/wp-content\/uploads\/2026\/05\/Diamond-Wire-Cut-NdFeB-Magnet-Samples.jpg\" alt=\"NdFeB magnet slice samples\" width=\"600\" height=\"400\"><div class=\"mw-material-copy\"><h3>NdFeB magnets<\/h3><p>Define magnetized state, slice geometry and grinding allowance.<\/p><span class=\"mw-material-more\">Explore application<\/span><\/div><\/a><\/div><p>Need individual sections rather than parallel batches? <a href=\"https:\/\/www.semiconductorcutting.com\/wire-saw-vs-sectioning-saw\/\">Compare wire sawing and sectioning methods.<\/a><\/p><\/div><\/section><\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-c260007 e-con-full mw-layout e-flex e-con e-parent\" data-id=\"c260007\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-w260007 elementor-widget elementor-widget-html\" data-id=\"w260007\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"html.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<div class=\"mw26\"><section id=\"faq\" class=\"mw-section \"><div class=\"mw-wrap\"><span class=\"mw-kicker\">Selection questions<\/span><h2>Before you specify the machine<\/h2><details><summary>Which model should I consider for laboratory work?<\/summary><p>SOM200 covers a listed 200 \u00d7 200 \u00d7 200 mm workpiece envelope and a 0.3\u201312 mm slice range. Confirm the required fixture and material before specifying the setup.<\/p><\/details><details><summary>What is the difference between inverted feed and swing cutting?<\/summary><p>Inverted feed describes the feed arrangement. Swing changes the contact conditions during the cut. SOMIS-400 combines both; selection still depends on material, geometry and trial results.<\/p><\/details><details><summary>Does a longer machine accept a larger cross-section?<\/summary><p>No. Compare width and height as well as length. SOM400 and SOM4-1000D have different workpiece envelopes and loading arrangements.<\/p><\/details><details><summary>Which models cover magnet slicing?<\/summary><p>SOM-220D is a route for smaller blocks and straight slices. SOM4-750D covers longer workpieces and straight or arc magnet parts. Send the radii and final grinding requirements for arc parts.<\/p><\/details><details><summary>Is the minimum slice thickness a finished-wafer guarantee?<\/summary><p>No. The listed slice range does not specify finished-part tolerance or surface quality. Agree the inspection criteria and finishing allowance, then assess a representative trial.<\/p><\/details><\/div><\/section><\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-c260008 e-con-full mw-layout e-flex e-con e-parent\" data-id=\"c260008\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-w260008 elementor-widget elementor-widget-html\" data-id=\"w260008\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"html.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<div class=\"mw26\"><section id=\"requirements\" class=\"mw-section mw-cta\"><div class=\"mw-wrap\"><div class=\"mw-two\"><div><span class=\"mw-kicker\">Free sample cutting<\/span><h2>Start with your part<\/h2><p>Send a drawing and the acceptance criteria. We can review the cutting route and the scope of a representative sample trial.<\/p><a class=\"mw-btn\" href=\"https:\/\/www.semiconductorcutting.com\/cut-equipment-manufacturer\/\">Request free sample cutting<\/a><\/div><div class=\"mw-checklist\"><p><strong>Material<\/strong><br>Grade, form and blank dimensions<\/p><p><strong>Target thickness<\/strong><br>As-cut and finished dimensions<\/p><p><strong>Surface requirement<\/strong><br>Finishing stock and edge criteria<\/p><p><strong>Drawing<\/strong><br>Geometry and inspection method<\/p><\/div><\/div><\/div><\/section><\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t","protected":false},"excerpt":{"rendered":"<p>High-efficiency Vimfun multi-wire saw machines for NdFeB magnets, sapphire, semiconductor materials, ceramics, crystal and precision thin-sheet cutting.<\/p>","protected":false},"author":6,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"elementor_header_footer","meta":{"_acf_changed":false,"site-sidebar-layout":"no-sidebar","site-content-layout":"page-builder","ast-site-content-layout":"full-width-container","site-content-style":"unboxed","site-sidebar-style":"unboxed","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"disabled","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"disabled","adv-header-id-meta":"","stick-header-meta":"","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"footnotes":""},"class_list":["post-5396","page","type-page","status-publish","hentry"],"acf":[],"_links":{"self":[{"href":"https:\/\/www.semiconductorcutting.com\/ko\/wp-json\/wp\/v2\/pages\/5396","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.semiconductorcutting.com\/ko\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.semiconductorcutting.com\/ko\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.semiconductorcutting.com\/ko\/wp-json\/wp\/v2\/users\/6"}],"replies":[{"embeddable":true,"href":"https:\/\/www.semiconductorcutting.com\/ko\/wp-json\/wp\/v2\/comments?post=5396"}],"version-history":[{"count":27,"href":"https:\/\/www.semiconductorcutting.com\/ko\/wp-json\/wp\/v2\/pages\/5396\/revisions"}],"predecessor-version":[{"id":5917,"href":"https:\/\/www.semiconductorcutting.com\/ko\/wp-json\/wp\/v2\/pages\/5396\/revisions\/5917"}],"wp:attachment":[{"href":"https:\/\/www.semiconductorcutting.com\/ko\/wp-json\/wp\/v2\/media?parent=5396"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}