22BF-5LY/P Double Sided Polishing Machine
그만큼 22BF-5LY/P double sided polishing machine is Vimfun's most powerful lapping and polishing system. With Φ1492 mm plates, a 5-carrier planetary drive, and processing force up to 9000 N (expandable to 12000 N), it handles workpieces up to Φ480 mm and 45 mm thick — the right choice for high-throughput ceramics, large-format wafer production, and industrial components.
그만큼 22BF-5LY/P double sided polishing machine represents the top of Vimfun's grinding and polishing line. When workpiece size, processing force, or production volume requirements exceed what the 16B-5LY/P can provide, the 22BF is the answer. Its gear ring version (Z184/PCD552, module 3) provides exceptional meshing rigidity under heavy load. A 36 kW total power allocation and Φ1492 mm plate diameter make this machine capable of tackling the most demanding double-sided surface conditioning applications — from large ceramic components to next-generation 12-inch semiconductor wafers — while maintaining flatness ≤0.02 mm across the entire working surface.
22BF-5LY/P Double Sided Polishing — 6 Powerful Features
Standard processing force range is 150–9000 N, expandable to 12,000 N. This makes the 22BF double sided polishing machine capable of aggressive stock removal on thick ceramic blocks, composites, and large-format industrial components beyond the reach of lighter machines.
The 22BF uses a full gear ring (Z184 / PCD552) with module 3 gears, providing exceptional meshing rigidity under heavy load. All 5 carriers maintain positional stability even at maximum force settings, ensuring consistent contact pressure across all workpieces simultaneously.
Optional dual-drive configuration on the sun gear (0–30 rpm) delivers higher torque capacity for the largest and hardest workpieces. Maintains uniform material removal across the full Φ480 mm working zone without speed instability under peak load.
15 kW lower plate + 11 kW upper plate + 5.5 kW ring gear + 2.2 kW sun gear = 36 kW total. This power margin ensures stable operation at maximum load, with no speed drop or process interruption during heavy ceramic grinding cycles.
The 22BF's optional in-process thickness measurement achieves ±0.01 mm accuracy — 200× tighter than a standard dial indicator. Enables micron-level closed-loop control for high-value thick components where over-removal is costly and unacceptable.
Lower plate (0–60 rpm), upper plate (0–25 rpm), outer gear (0–30 rpm), sun gear (0–30 rpm) — all independently VFD-adjustable. Smooth startup and shutdown at all load conditions prevents workpiece cracking and surface damage during heavy-force operations.
Technical Specifications — 22BF-5LY/P-4M
| 매개변수 | 가치 | Note |
|---|---|---|
| External Dimensions (excl. cabinet & hydraulic station) | 2300 × 1900 × 2900 mm | |
| Plate Size I – Polishing (stainless steel) | Φ1492 × Φ452 × 60 mm | |
| Plate Size II – Lapping (segmented ring groove) | Φ1456 × Φ488 × 60 mm | |
| Max Workpiece Diameter / Thickness | Φ480 mm / 45 mm | |
| Processing Force Range | 150 ~ 9000 N | Expandable to 12000 N |
| Sun Gear Model | Z184 / PCD552 | Gear ring version |
| Number of Carriers | 5 pcs | |
| Gear Module | Module 3 | |
| 총 전력 | 36 kW | AC380V |
| 기계 무게 | ~ 9000 kg | Approximate |
| Lower Plate Drive | 15 kW | Worm gear reducer motor |
| Upper Plate Drive | 11 kW | Worm gear reducer motor |
| Outer Ring Gear Drive | 5.5 kW | Worm gear reducer motor |
| Sun Gear Drive | 2.2 kW | Dual drive optional |
| Lower Plate Speed | 0 ~ 60 rpm | Frequency adjustable |
| Upper Plate Speed | 0 ~ 25 rpm | Frequency adjustable |
| Outer Gear Speed | 0 ~ 30 rpm | Frequency adjustable |
| Sun Gear Speed | 0 ~ 30 rpm | Dual drive optional |
| Lower Plate Runout | ≤ 0.03 mm | |
| Lower Plate Flatness | ≤ 0.02 mm | Field repairable |
| Center Gear Runout | ≤ 0.35 mm | |
| Pressure Control Accuracy | ±20 N | |
| Thickness Measurement Range | 0 ~ 25 mm | 선택 사항 |
| Thickness Measurement Accuracy | ±0.01 mm | 선택 사항 |
| Sun Gear Rotation | Software-controlled | Forward / Reverse |
| Main Bearing Type | High-precision crossed roller bearing |
What Materials Can the 22BF-5LY/P Process?
High-volume double-sided grinding of alumina, silicon nitride, and zirconia ceramic substrates up to Φ480 mm. 9000 N force enables rapid stock removal on thick blanks with uniform surface coverage.
Surface conditioning of 12-inch (300 mm) and larger semiconductor wafers. The Φ480 mm workpiece capacity supports next-generation wafer sizes while maintaining flatness ≤0.02 mm.
Bearing rings, seal faces, and precision mechanical parts up to 45 mm thick. The 12,000 N expandable force capability handles hardened steel and cemented carbide components that lighter machines cannot address.
Large optical glass blanks and filter substrates for telescope mirrors and high-power laser optics systems. Flatness ≤0.02 mm meets precision optics specifications for demanding photonics applications.
AlN (aluminum nitride) and BeO substrates for high-power RF and power electronics packaging. The 22BF handles these high-value, difficult-to-machine materials with consistent yield and surface quality.
High-hardness stone, glass-ceramic composites, and specialty industrial materials requiring heavy-load double-sided stock removal. The 12,000 N capacity extends applications beyond semiconductor and optics industries.
Why Choose the Vimfun 22BF-5LY/P
Φ480 mm workpiece diameter and 45 mm thickness capacity make the 22BF-5LY/P the only Vimfun double sided polishing machine for large-format production. One unit replaces multiple smaller machines for high-volume large-component lines.
The 22BF ships with 60 mm thick plates (vs 50 mm for 13B/16B), manufactured from QT500-7 ductile cast iron with CNC double-sided grinding. Extra plate thickness provides superior thermal mass and dimensional stability under sustained heavy loads.
In heavy-duty double-sided lapping, imported systems from Japan and Germany have traditionally dominated. The 22BF-5LY/P double sided polishing machine delivers comparable precision and capacity at a fraction of the import cost — with local service and support.
Vimfun supplies electroplated and pellet-type diamond conditioning wheels, internal ring gears, sun gears, and polishing pads matched exactly to 22BF specifications. One vendor for equipment and all ongoing consumables.
Frequently Asked Questions — 22BF-5LY/P Double Sided Polishing
Choose the 22BF double sided polishing machine when workpiece diameter exceeds Φ390 mm, workpiece thickness exceeds 25 mm, processing force requirements exceed 3500 N, or production demands the highest throughput with Φ480 mm capacity. The 22BF's 9000 N (expandable to 12000 N) force also opens ceramics and thick component applications not possible on the 16B.
The 22BF achieves lower plate flatness ≤0.02 mm vs ≤0.015 mm on the 16B. This slight difference reflects the larger plate diameter and heavier loads. For semiconductor-grade applications where ≤0.015 mm is required, the 16B is preferred. For large ceramic and thick-component production where ≤0.02 mm suffices, the 22BF delivers higher throughput per cycle. For reference on flatness requirements in precision optics, see ScienceDirect: Optical Flatness Standards.
The optional in-process thickness system monitors workpiece thickness in real time during the polishing and lapping cycle, automatically stopping at the target dimension. At ±0.01 mm accuracy, it is 200× more precise than a standard dial indicator — critical for high-cost components where every micrometer of over-removal means scrapped parts.
The 22BF weighs approximately 9000 kg and requires a reinforced concrete foundation with vibration isolation pads. Power supply is AC380V / 36 kW. Vimfun's engineering team provides full foundation drawings and installation specifications as part of the pre-order technical package. On-site commissioning and operator training are included.
Yes. Two plate sets are included: a stainless steel polishing plate (Φ1492 mm) and a ductile cast iron segmented ring groove lapping plate (Φ1456 mm). Switching between lapping and polishing takes approximately 2 hours with standard tooling. See our lapping accessories page for replacement plates and consumables.
Other Grinding & Lapping Machines
For heavy-duty applications, our engineers review your workpiece specs and production targets before recommending exact process parameters. Contact us for a detailed technical consultation.
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