Endless Loop Wire Saw Machine – Silicon Ingot Cropping & Fast 8-Minute Cut Cycles
The Loop Wire Saw Machine (环线反切机) is a dedicated endless-loop diamond wire saw for silicon ingot head/tail removal, slice sampling, and squaring-bar reverse cutting. Using a continuously circulating endless diamond wire loop, it delivers average pure cutting time of just 8 minutes per 182mm silicon squaring bar — with zero wire changeover time between cuts.
主な特徴
- 🔹 8-Minute Average Cut Cycle: ≤8 min average pure cutting time for 182mm silicon squaring bars (0.5mm wire)
- 🔹 Endless Loop Wire: Continuous wire circulation eliminates reciprocating wire changeover — higher net productivity
- 🔹 Multi-Function Silicon Processing: Head removal, tail removal, slice sampling, and squaring-bar reverse cutting in one machine
- 🔹 Wide Squaring Bar Range: Processes squaring bars from 200–900mm in length
- 🔹 Thin Slice Capability: Slice thickness range 1.5–25mm
- 🔹 Low Power Operation: Peak 8kW, average only 2kW — extremely energy-efficient
- 🔹 Compact Footprint: 1950×1750×2160mm — easy factory integration
- 🔹 Fine Wire: Φ0.5–0.65mm endless diamond wire loops for minimal kerf loss
LOOP WIRE SAW TECHNICAL SPECIFICATION
| いや。 | パラメータ | 仕様 |
| 1 | Processable Length – Squaring Bar (mm) | 200 – 900 |
| 2 | Slice Thickness Range (mm) | 1.5 – 25 |
| 3 | Wire Loop Diameter (mm) | Φ0.5 – Φ0.65 |
| 4 | Average Pure Cutting Time (0.5mm wire, 182mm bar) | 8 minutes |
| 5 | Peak Operating Power (kW) | 8 |
| 6 | Average Operating Power (kW) | 2 |
| 7 | Machine Dimensions L×W×H (mm) | 1950 × 1750 × 2160 |
| 8 | カッティング・モード | Reverse-cut, single-wire endless loop |
代表的な用途
- Head/tail removal from silicon CZ or FZ ingots before multi-wire saw slicing
- Slice sampling — cutting individual test wafers for quality inspection
- Squaring-bar reverse cutting — processing already-squared silicon bars into slices
- Ingot defect section removal — isolating and removing void or contamination zones
- Small-batch wafer production from short ingot segments
- Pilot production for new crystal growth processes
ENDLESS LOOP vs. SPOOL-TYPE WIRE SAWS
- ⚠️ Spool Wire Saws: Wire travels from supply to take-up spool. Direction reversal creates temporary velocity variation. Wire changeover interrupts production.
- ✅ Endless Loop Wire Saw: Wire circulates continuously in one direction. No spool change, no velocity variation from reversal. Consistent speed cut after cut.
WHERE THIS MACHINE FITS IN YOUR SILICON PROCESSING LINE
- Crystal growing — CZ or FZ ingot growth
- Crystal Ingot Cropper — crop ingot into sections
- Loop Wire Saw Machine (this machine) — remove head/tail, cut sample slices
- SOM4-630D / SOM4-1000D — mass wafer production from qualified ingot sections
FREQUENTLY ASKED QUESTIONS
Q: Is 8 minutes for all ingot sizes?
The 8-minute figure is for a 182mm squaring bar with 0.5mm wire diameter. Larger cross-sections will take longer. Contact us for your specific ingot cycle time estimates.
Q: Can this machine process sapphire or other materials?
Yes. The Loop Wire Saw processes monocrystalline sapphire, quartz, and germanium with appropriate wire selection.
Q: How often does the endless wire loop need replacing?
Wire loop life depends on material type and total cutting hours. Vimfun supplies compatible endless diamond wire loops.
RELATED PRODUCTS
Upstream: Crystal Ingot Cropper (ingot cropping before loop wire saw use)
Downstream: SOM4-630D Multi-Wire Saw | SOM4-1000D Multi-Wire Saw
Consumables: Spiral-Coated Endless Diamond Wire | Alumina Cutting Wire