{"id":5657,"date":"2026-07-19T13:47:57","date_gmt":"2026-07-19T05:47:57","guid":{"rendered":"https:\/\/www.semiconductorcutting.com\/?p=5657"},"modified":"2026-07-19T13:48:00","modified_gmt":"2026-07-19T05:48:00","slug":"ndfeb-magnet-grinding-polishing","status":"publish","type":"post","link":"https:\/\/www.semiconductorcutting.com\/ja\/ndfeb-magnet-grinding-polishing\/","title":{"rendered":"NdFeB\u30de\u30b0\u30cd\u30c3\u30c8\u306e\u7814\u524a\u30fb\u7814\u78e8 \u2014 \u30b9\u30e9\u30a4\u30b9\u5f8c\u306e\u5b8c\u5168\u306a\u30ef\u30fc\u30af\u30d5\u30ed\u30fc"},"content":{"rendered":"<p class=\"wp-block-paragraph\">NdFeB magnet grinding and polishing is the finishing stage that converts a sliced magnet block into a dimensionally precise component ready for coating and assembly. Slicing gets the magnet close to final dimensions \u2014 but &#8220;close&#8221; is not close enough for motor lamination stacks, precision sensors, or direct-drive generators where parallelism tolerances of \u00b12 \u03bcm and surface roughness below Ra 0.5 \u03bcm are standard requirements.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">This page covers the complete NdFeB magnet grinding and polishing workflow: the process sequence from sliced blank to finished magnet, surface quality requirements by application, double-sided lapping equipment selection, and key parameters for achieving tight TTV control.<\/p>\n\n\n\n<figure class=\"wp-block-image size-large\"><img fetchpriority=\"high\" decoding=\"async\" width=\"1024\" height=\"576\" src=\"https:\/\/www.semiconductorcutting.com\/wp-content\/uploads\/2026\/07\/ndfeb-magnet-grinding-polishing-workflow-1024x576.jpg\" alt=\"\" class=\"wp-image-5658\" srcset=\"https:\/\/www.semiconductorcutting.com\/wp-content\/uploads\/2026\/07\/ndfeb-magnet-grinding-polishing-workflow-1024x576.jpg 1024w, https:\/\/www.semiconductorcutting.com\/wp-content\/uploads\/2026\/07\/ndfeb-magnet-grinding-polishing-workflow-300x169.jpg 300w, https:\/\/www.semiconductorcutting.com\/wp-content\/uploads\/2026\/07\/ndfeb-magnet-grinding-polishing-workflow-768x432.jpg 768w, https:\/\/www.semiconductorcutting.com\/wp-content\/uploads\/2026\/07\/ndfeb-magnet-grinding-polishing-workflow-1536x864.jpg 1536w, https:\/\/www.semiconductorcutting.com\/wp-content\/uploads\/2026\/07\/ndfeb-magnet-grinding-polishing-workflow-18x10.jpg 18w, https:\/\/www.semiconductorcutting.com\/wp-content\/uploads\/2026\/07\/ndfeb-magnet-grinding-polishing-workflow-600x338.jpg 600w, https:\/\/www.semiconductorcutting.com\/wp-content\/uploads\/2026\/07\/ndfeb-magnet-grinding-polishing-workflow.jpg 1600w\" sizes=\"(max-width: 1024px) 100vw, 1024px\" \/><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\">The NdFeB Post-Slicing Workflow Overview<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">NdFeB magnet grinding and polishing follows a fixed sequence. Each stage removes a defined amount of material and delivers a specific surface condition to the next operation.<\/p>\n\n\n\n<pre class=\"wp-block-code\"><code>Sliced blank \u2192 Rough grinding \u2192 Double-sided lapping \u2192 Fine polishing \u2192 Coating\n<\/code><\/pre>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>Sliced blank condition:<\/strong> Wire saw slicing produces Ra 0.5\u20131.5 \u03bcm surface roughness and TTV (total thickness variation) of 5\u201315 \u03bcm across a typical 50 \u00d7 25 mm magnet. For many applications, this is insufficient \u2014 motor magnets require TTV \u2264 5 \u03bcm, and sensor magnets require TTV \u2264 2 \u03bcm.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>Rough grinding:<\/strong> Removes slicing damage and brings the magnet to near-final thickness. Typically 50\u2013150 \u03bcm removed per face using resin-bonded diamond wheels. Output: Ra 0.3\u20130.8 \u03bcm, TTV 3\u20138 \u03bcm.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>Double-sided lapping:<\/strong> Processes both faces simultaneously on rotating lapping plates with abrasive slurry. Achieves tight parallelism (TTV \u2264 1\u20132 \u03bcm) and consistent thickness across a full production batch. This is the step that determines dimensional accuracy for assembly.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>Fine polishing:<\/strong> Optional for applications requiring Ra &lt; 0.1 \u03bcm. Used for sensor magnets, precision assemblies, and magnets going into high-frequency servo applications where surface condition affects eddy current losses.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>Coating:<\/strong> Ni, Zn, or epoxy coating applied after polishing. Surface condition at the end of lapping directly affects coating adhesion \u2014 rough or contaminated surfaces cause premature coating failure.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">\u306e <a href=\"https:\/\/www.semiconductorcutting.com\/ja\/magnet-slicing-machine\/\" target=\"_blank\" rel=\"noreferrer noopener\">\u30de\u30b0\u30cd\u30c3\u30c8\u30b9\u30e9\u30a4\u30b7\u30f3\u30b0\u30de\u30b7\u30f3<\/a> upstream determines how much material needs to be removed in grinding. Diamond wire slicing produces shallower subsurface damage than ID saw or blade cutting, which reduces the grinding stock required and shortens finishing cycle time.<\/p>\n\n\n\n<figure class=\"wp-block-image size-large\"><img decoding=\"async\" width=\"1024\" height=\"723\" src=\"https:\/\/www.semiconductorcutting.com\/wp-content\/uploads\/2026\/05\/Diamond-Wire-Cut-NdFeB-Magnet-Samples-1024x723.jpg\" alt=\"\" class=\"wp-image-5467\" srcset=\"https:\/\/www.semiconductorcutting.com\/wp-content\/uploads\/2026\/05\/Diamond-Wire-Cut-NdFeB-Magnet-Samples-1024x723.jpg 1024w, https:\/\/www.semiconductorcutting.com\/wp-content\/uploads\/2026\/05\/Diamond-Wire-Cut-NdFeB-Magnet-Samples-300x212.jpg 300w, https:\/\/www.semiconductorcutting.com\/wp-content\/uploads\/2026\/05\/Diamond-Wire-Cut-NdFeB-Magnet-Samples-768x543.jpg 768w, https:\/\/www.semiconductorcutting.com\/wp-content\/uploads\/2026\/05\/Diamond-Wire-Cut-NdFeB-Magnet-Samples-18x12.jpg 18w, https:\/\/www.semiconductorcutting.com\/wp-content\/uploads\/2026\/05\/Diamond-Wire-Cut-NdFeB-Magnet-Samples-600x424.jpg 600w, https:\/\/www.semiconductorcutting.com\/wp-content\/uploads\/2026\/05\/Diamond-Wire-Cut-NdFeB-Magnet-Samples.jpg 1492w\" sizes=\"(max-width: 1024px) 100vw, 1024px\" \/><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\">Surface Quality Requirements by End-Application<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">NdFeB magnet grinding and polishing targets vary significantly by application. Over-specifying surface quality wastes cycle time; under-specifying causes assembly problems downstream.<\/p>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th>\u5fdc\u7528<\/th><th>Ra Target<\/th><th>TTV Target<\/th><th>Parallelism<\/th><\/tr><\/thead><tbody><tr><td>EV traction motor magnets<\/td><td>\u2264 0.8 \u03bcm<\/td><td>\u2264 5 \u03bcm<\/td><td>\u2264 10 \u03bcm<\/td><\/tr><tr><td>Servo motor magnets<\/td><td>\u2264 0.4 \u03bcm<\/td><td>\u2264 3 \u03bcm<\/td><td>\u2264 5 \u03bcm<\/td><\/tr><tr><td>Wind turbine generator magnets<\/td><td>\u2264 1.0 \u03bcm<\/td><td>\u2264 8 \u03bcm<\/td><td>\u2264 15 \u03bcm<\/td><\/tr><tr><td>Precision sensor magnets<\/td><td>\u2264 0.2 \u03bcm<\/td><td>\u2264 2 \u03bcm<\/td><td>\u2264 3 \u03bcm<\/td><\/tr><tr><td>Speaker magnets<\/td><td>\u2264 1.5 \u03bcm<\/td><td>\u2264 10 \u03bcm<\/td><td>\u2264 20 \u03bcm<\/td><\/tr><tr><td>Medical \/ MRI magnets<\/td><td>\u2264 0.1 \u03bcm<\/td><td>\u2264 1 \u03bcm<\/td><td>\u2264 2 \u03bcm<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<p class=\"wp-block-paragraph\">For most motor magnet production, the governing specification is TTV rather than Ra. A magnet that meets Ra but has 8 \u03bcm TTV will create uneven stack height in a laminated assembly, producing air gap variation that reduces motor efficiency and generates vibration.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">NdFeB Magnet Grinding and Polishing: Double-Sided Lapping Equipment<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Double-sided lapping is the core equipment in NdFeB magnet grinding and polishing. The workpieces are loaded into carrier plates between two horizontal lapping plates rotating in opposite directions, with abrasive slurry flowing between plate and workpiece. Both faces are lapped simultaneously, producing matched parallelism that single-sided grinding cannot achieve.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Three machine sizes cover the production range from R&amp;D to mass production:<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">13B-6LY\/P \u2014 R&amp;D and Small Batch Production<\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Lapping plate diameter:<\/strong> \u03a6210 mm<\/li>\n\n\n\n<li><strong>\u6700\u9069\uff1a<\/strong> Material qualification runs, prototype magnet evaluation, small-volume specialty production<\/li>\n\n\n\n<li><strong>TTV achievable:<\/strong> \u2264 2 \u03bcm with calibrated slurry<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">\u306e <a href=\"https:\/\/www.semiconductorcutting.com\/ja\/%e8%a3%bd%e5%93%81\/13b-lapping-machine\/\" target=\"_blank\" rel=\"noreferrer noopener\">13B Lapping Machine<\/a> is the entry-level machine for NdFeB lapping. Its compact footprint allows installation in existing workshop space without dedicated finishing areas.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">16B-5LY\/P \u2014 Mid-Volume Production<\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Lapping plate diameter:<\/strong> \u03a6390 mm<\/li>\n\n\n\n<li><strong>\u6700\u9069\uff1a<\/strong> Motor magnet production lines at mid-volume<\/li>\n\n\n\n<li><strong>TTV achievable:<\/strong> \u2264 1.5 \u03bcm<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">\u306e <a href=\"https:\/\/www.semiconductorcutting.com\/ja\/%e8%a3%bd%e5%93%81\/16b-5ly-p-lapping-machine\/\" target=\"_blank\" rel=\"noreferrer noopener\">16B-5LY-P Lapping Machine<\/a> is the most common configuration for mid-volume NdFeB production. Its 5-carrier plate design allows larger batches without sacrificing parallelism control. Servo-driven pressure control maintains consistent lapping force as the carrier plates orbit.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">22BF-5LY\/P \u2014 High-Volume Production<\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Lapping plate diameter:<\/strong> \u03a6480 mm<\/li>\n\n\n\n<li><strong>\u6700\u9069\uff1a<\/strong> High-volume EV motor magnet production<\/li>\n\n\n\n<li><strong>TTV achievable:<\/strong> \u2264 1 \u03bcm<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">\u306e <a href=\"https:\/\/www.semiconductorcutting.com\/ja\/%e8%a3%bd%e5%93%81\/double-sided-polishing-22bf\/\" target=\"_blank\" rel=\"noreferrer noopener\">Double Sided Polishing 22BF<\/a> handles both lapping and fine polishing modes \u2014 slurry composition determines the output surface condition. Switching from lapping abrasive to polishing compound in the same machine eliminates a transfer step for applications requiring fine-polished surfaces.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Grinding and Polishing Process Combinations<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Not every NdFeB application requires the full grinding-lapping-polishing sequence. The process combination depends on starting surface quality from slicing and the final specification required.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>Combination A \u2014 Grind + Lap (most common):<\/strong><br>Used for EV motor magnets, servo magnets, and most industrial applications. Rough grind removes slicing damage, lapping achieves final parallelism. Typical stock removal: 80\u2013200 \u03bcm total per face. Achieves Ra 0.3\u20130.8 \u03bcm and TTV \u2264 3 \u03bcm.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>Combination B \u2014 Lap only (high-quality slice input):<\/strong><br>When wire saw slicing produces Ra &lt; 0.8 \u03bcm with consistent kerf width, direct lapping without rough grinding is possible. Saves cycle time versus Combination A, but requires tight process control at the slicing stage.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>Combination C \u2014 Grind + Lap + Polish:<\/strong><br>Required for sensor magnets, medical applications, and high-frequency servo motors. Polish stage uses 0.5\u20131.0 \u03bcm diamond or alumina slurry on a polishing pad. Achieves Ra &lt; 0.1 \u03bcm.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">For arc-segment magnets used in motor rotors, the sequence includes an additional arc grinding step after flat lapping. Vimfun&#8217;s <a href=\"https:\/\/www.semiconductorcutting.com\/ja\/%e8%a3%bd%e5%93%81\/arc-magnet-grinding-machine-vmg4-90\/\" target=\"_blank\" rel=\"noreferrer noopener\">Arc Magnet Grinding Machine VMG4-90<\/a> \u305d\u3057\u3066 <a href=\"https:\/\/www.semiconductorcutting.com\/ja\/%e8%a3%bd%e5%93%81\/inner-and-outer-arc-grinding-machine\/\" target=\"_blank\" rel=\"noreferrer noopener\">\u5185\u5916\u30a2\u30fc\u30af\u7814\u524a\u76e4<\/a> process the curved faces of arc magnets to the required inner and outer radius dimensions and surface finish.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Achieving \u00b12 \u03bcm Tolerance and TTV \u2264 1 \u03bcm<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Hitting \u00b12 \u03bcm thickness tolerance and TTV \u2264 1 \u03bcm consistently across a production batch requires control of four variables:<\/p>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>Carrier plate flatness.<\/strong> The lapping carrier plates must be flat to within \u00b10.5 \u03bcm. Worn or warped carriers are the most common cause of TTV drift in production. Inspect and dress carriers every 500\u20131,000 cycles.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>Slurry concentration and temperature.<\/strong> Abrasive concentration affects removal rate and surface finish. Temperature changes alter slurry viscosity and removal rate. Maintain slurry at 20\u201325\u00b0C with closed-loop temperature control for consistent batch-to-batch results.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>Lapping pressure.<\/strong> Vimfun lapping machines use servo-controlled pressure, not fixed weight. This allows pressure profiling \u2014 higher pressure at the start of the cycle for fast stock removal, lower pressure at the end for surface quality. Typical pressure: 0.5\u20132.0 N\/cm\u00b2 depending on magnet size and slurry.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>Conditioning rings.<\/strong> Conditioning rings running at the inner and outer edges of the lapping plate maintain plate flatness during production. Without conditioning, lapping plates develop a convex or concave profile that transfers to the workpiece. See our <a href=\"https:\/\/www.semiconductorcutting.com\/ja\/double-sided-lapping-machine\/\" target=\"_blank\" rel=\"noreferrer noopener\">double-sided lapping machine<\/a> overview for conditioning ring specifications.<\/p>\n\n\n\n<figure class=\"wp-block-embed is-type-video is-provider-youtube wp-block-embed-youtube wp-embed-aspect-16-9 wp-has-aspect-ratio\"><div class=\"wp-block-embed__wrapper\">\n<iframe  id=\"_ytid_24306\"  width=\"640\" height=\"360\"  data-origwidth=\"640\" data-origheight=\"360\" src=\"https:\/\/www.youtube.com\/embed\/QqobzOQw8MU?enablejsapi=1&#038;autoplay=0&#038;cc_load_policy=0&#038;cc_lang_pref=&#038;iv_load_policy=1&#038;loop=0&#038;rel=1&#038;fs=1&#038;playsinline=0&#038;autohide=2&#038;theme=dark&#038;color=red&#038;controls=1&#038;disablekb=0&#038;\" class=\"__youtube_prefs__  epyt-is-override  no-lazyload\" title=\"YouTube \u30d7\u30ec\u30fc\u30e4\u30fc\"  allow=\"fullscreen; accelerometer; autoplay; clipboard-write; encrypted-media; gyroscope; picture-in-picture; web-share\" referrerpolicy=\"strict-origin-when-cross-origin\" allowfullscreen data-no-lazy=\"1\" data-skipgform_ajax_framebjll=\"\"><\/iframe>\n<\/div><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\">Coating Compatibility After NdFeB Magnet Grinding and Polishing<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">NdFeB magnets require protective coating before assembly \u2014 bare NdFeB corrodes rapidly in humid environments. The surface condition after lapping affects coating quality and adhesion.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>Ni\/Cu\/Ni (triple-layer nickel):<\/strong> The most common coating. Requires Ra \u2264 0.8 \u03bcm and a clean surface free of embedded abrasive. Electroless or electrolytic plating, 15\u201325 \u03bcm total thickness.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>Zinc coating:<\/strong> Lower cost than Ni, used for less-demanding applications. Tolerates Ra up to 1.2 \u03bcm. Salt spray resistance 48\u201396 hours.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>Epoxy coating:<\/strong> Applied by spray or dip, 15\u201330 \u03bcm. Requires the smoothest substrate \u2014 Ra \u2264 0.5 \u03bcm \u2014 for uniform coverage. Preferred for high-temperature motor applications where metallic coatings may delaminate.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>Phosphate + epoxy:<\/strong> Two-step process used for magnets with complex geometries. The phosphate conversion layer provides adhesion base; epoxy top coat provides corrosion resistance.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Surface contamination from lapping slurry is the most common cause of coating adhesion failure. Thorough ultrasonic cleaning after lapping, followed by DI water rinse and drying before coating, eliminates this failure mode.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Vimfun NdFeB Lapping and Grinding Equipment Lineup<\/h2>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th>\u6a5f\u68b0<\/th><th>\u30bf\u30a4\u30d7<\/th><th>Work Area<\/th><th>\u6700\u9069<\/th><\/tr><\/thead><tbody><tr><td>13B-6LY\/P<\/td><td>Double-sided lapper<\/td><td>\u03a6210 mm<\/td><td>R&amp;D, small batch<\/td><\/tr><tr><td>16B-5LY\/P<\/td><td>Double-sided lapper<\/td><td>\u03a6390 mm<\/td><td>Mid-volume production<\/td><\/tr><tr><td>22BF-5LY\/P<\/td><td>Double-sided lapper + polisher<\/td><td>\u03a6480 mm<\/td><td>\u5927\u91cf\u751f\u7523<\/td><\/tr><tr><td>VMG4-90<\/td><td>Arc magnet grinder<\/td><td>90\u00b0 arc range<\/td><td>Motor arc segments<\/td><\/tr><tr><td>Inner\/Outer Arc Grinder<\/td><td>Arc magnet grinder<\/td><td>Custom arc radius<\/td><td>Complex arc geometries<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<p class=\"wp-block-paragraph\">For specifications, pricing, and sample lapping trials on your NdFeB material, contact our engineering team through the <a href=\"https:\/\/www.semiconductorcutting.com\/ja\/magnetic-materials\/\" target=\"_blank\" rel=\"noreferrer noopener\">\u78c1\u6027\u6750\u6599<\/a> solution page.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">\u306b\u3088\u308b\u3068 <a href=\"https:\/\/www.arnoldmagnetics.com\/resources\/\" target=\"_blank\" rel=\"noreferrer noopener nofollow\">Arnold Magnetic Technologies NdFeB processing guide<\/a>, surface finish after lapping directly correlates with assembly yield in precision motor stacks \u2014 operations achieving TTV \u2264 2 \u03bcm consistently report 8\u201312% lower assembly rejection rates compared to those relying on single-sided grinding alone. The <a href=\"https:\/\/www.magnet-apps.com\/\" target=\"_blank\" rel=\"noreferrer noopener nofollow\">Magnetics Business &amp; Technology journal<\/a> documents similar findings across servo motor and sensor magnet applications.<\/p>","protected":false},"excerpt":{"rendered":"<p>NdFeB magnet grinding and polishing is the finishing stage that converts a sliced magnet block into a dimensionally precise component ready for coating and assembly. Slicing gets the magnet close to final dimensions \u2014 but &#8220;close&#8221; is not close enough for motor lamination stacks, precision sensors, or direct-drive generators where parallelism tolerances of \u00b12 \u03bcm [&hellip;]<\/p>\n","protected":false},"author":6,"featured_media":5658,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"","adv-header-id-meta":"","stick-header-meta":"","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"footnotes":""},"categories":[384],"tags":[1056,1051,1050,1054,1037],"class_list":["post-5657","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-cutting-technology-methods","tag-double-sided-lapping","tag-lapping-machine","tag-magnet-grinding","tag-magnet-polishing","tag-ndfeb-magnets"],"acf":[],"_links":{"self":[{"href":"https:\/\/www.semiconductorcutting.com\/ja\/wp-json\/wp\/v2\/posts\/5657","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.semiconductorcutting.com\/ja\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.semiconductorcutting.com\/ja\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.semiconductorcutting.com\/ja\/wp-json\/wp\/v2\/users\/6"}],"replies":[{"embeddable":true,"href":"https:\/\/www.semiconductorcutting.com\/ja\/wp-json\/wp\/v2\/comments?post=5657"}],"version-history":[{"count":1,"href":"https:\/\/www.semiconductorcutting.com\/ja\/wp-json\/wp\/v2\/posts\/5657\/revisions"}],"predecessor-version":[{"id":5659,"href":"https:\/\/www.semiconductorcutting.com\/ja\/wp-json\/wp\/v2\/posts\/5657\/revisions\/5659"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.semiconductorcutting.com\/ja\/wp-json\/wp\/v2\/media\/5658"}],"wp:attachment":[{"href":"https:\/\/www.semiconductorcutting.com\/ja\/wp-json\/wp\/v2\/media?parent=5657"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.semiconductorcutting.com\/ja\/wp-json\/wp\/v2\/categories?post=5657"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.semiconductorcutting.com\/ja\/wp-json\/wp\/v2\/tags?post=5657"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}