{"id":5538,"date":"2026-06-20T21:58:24","date_gmt":"2026-06-20T13:58:24","guid":{"rendered":"https:\/\/www.semiconductorcutting.com\/?p=5538"},"modified":"2026-06-20T21:58:24","modified_gmt":"2026-06-20T13:58:24","slug":"what-is-used-wafer-slicing-wire-saw","status":"publish","type":"post","link":"https:\/\/www.semiconductorcutting.com\/fr\/what-is-used-wafer-slicing-wire-saw\/","title":{"rendered":"Quel liquide de refroidissement est utilis\u00e9 dans une scie \u00e0 fil pour trancher des wafers ? Eau d\u00e9sionis\u00e9e, fluide de coupe, contr\u00f4le du pH"},"content":{"rendered":"<p class=\"wp-block-paragraph\">Why do some wafers break while cutting? I have over 15 years experience in the wafer slicing wire saw industry, and I have seen how the improper coolant can damage a whole batch.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">In this article we will explore what coolant to use, why DI water and cutting fluid matter, and how pH control makes your operation safe and clean.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><strong>What Is a Wafer Slicing Wire Saw and How Does It Work?<\/strong><\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">A <strong><a href=\"https:\/\/www.semiconductorcutting.com\/fr\/categorie-de-produits\/produits\/multi-wire-saw-machines\/\" target=\"_blank\" rel=\"noreferrer noopener\">wafer slicing wire saw <\/a><\/strong>is a kind of cutting machine. It cuts hard materials like silicon, SiC and sapphire into thin wafers. It employs a thin diamond-coated wire. The wire zips swiftly across the fabric. Groove wheels to keep the wire on the track. This means minimal kerf loss \u2013 very little material is lost.\u00a0<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">To slice the silicon wafer you need both speed and precision. Coolant is sprayed onto the cutting zone. It cools the wire and eliminates chopped pieces. Without cooling, wire and wafer might become too hot. This leads to cracks and damages.<\/p>\n\n\n\n<figure class=\"wp-block-image size-full is-resized\"><img fetchpriority=\"high\" decoding=\"async\" width=\"800\" height=\"800\" src=\"https:\/\/www.semiconductorcutting.com\/wp-content\/uploads\/2026\/06\/image-4.png\" alt=\"Scie \u00e0 fil pour trancher des wafers\" class=\"wp-image-5539\" style=\"width:460px\" srcset=\"https:\/\/www.semiconductorcutting.com\/wp-content\/uploads\/2026\/06\/image-4.png 800w, https:\/\/www.semiconductorcutting.com\/wp-content\/uploads\/2026\/06\/image-4-300x300.png 300w, https:\/\/www.semiconductorcutting.com\/wp-content\/uploads\/2026\/06\/image-4-150x150.png 150w, https:\/\/www.semiconductorcutting.com\/wp-content\/uploads\/2026\/06\/image-4-768x768.png 768w, https:\/\/www.semiconductorcutting.com\/wp-content\/uploads\/2026\/06\/image-4-12x12.png 12w, https:\/\/www.semiconductorcutting.com\/wp-content\/uploads\/2026\/06\/image-4-600x600.png 600w, https:\/\/www.semiconductorcutting.com\/wp-content\/uploads\/2026\/06\/image-4-100x100.png 100w\" sizes=\"(max-width: 800px) 100vw, 800px\" \/><\/figure>\n\n\n\n<h3 class=\"wp-block-heading\"><strong>Technical Overview: Wafer Slicing Wire Saw Key Parameters<\/strong><\/h3>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><tbody><tr><td><strong>Param\u00e8tre<\/strong><\/td><td><strong>D\u00e9tails<\/strong><\/td><\/tr><tr><td>Type de fil<\/td><td>Diamond-coated steel wire<\/td><\/tr><tr><td>Vitesse du fil<\/td><td>10\u201330 m\/s<\/td><\/tr><tr><td>Type de liquide de refroidissement<\/td><td>DI water \/ cutting fluid<\/td><\/tr><tr><td>Material Cut<\/td><td>Silicon, SiC, Sapphire<\/td><\/tr><tr><td>Kerf Loss<\/td><td>100\u2013200 \u00b5m<\/td><\/tr><tr><td>\u00c9tat de surface<\/td><td>Ra &lt; 1 \u00b5m<\/td><\/tr><tr><td>Groove Wheel Role<\/td><td>Wire tension and path control<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\"><strong>Why Does Coolant Choice Matter in a High Speed Multi Wire Saw Machine?<\/strong><\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Using the improper coolant poses major complications. It may snap a wire. It may harm the wafer surface. It might reduce your yield. In a <strong><a href=\"https:\/\/www.semiconductorcutting.com\/fr\/how-do-multi-wire-saw-machines-work\/\" target=\"_blank\" rel=\"noreferrer noopener\">machine de sciage multi-fils \u00e0 haute vitesse<\/a><\/strong> coolant does more than just cool. It cleans away debris. It reduces drag. If the coolant is excessively acid or alkaline, it will eat the wire.\u00a0<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">It might also fracture the wafer from behind. That\u2019s why we need to adjust the kind of coolant and pH. This is a must for all precision wire saw cutting systems. It is the secret to high precision wafer slicing and longer machine life.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><strong>What Is DI Water and Why Is It Used?<\/strong><\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">DI water stands for de-ionized water. It contains very few minerals. It is the primary coolant for most wafer slicing wire saw systems. It does not deposit on the wire, nor on the wafer.<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>DI water has an extremely low conductivity. Protects the wafer surface.<\/li>\n\n\n\n<li>It cleans the cutting area. No Pollution.<\/li>\n\n\n\n<li>And it can easily be filtered and reused in a closed-loop system.<\/li>\n\n\n\n<li>It is compatible with cutting fluid additives.<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\"><strong>DI Water Properties in Wire Saw Cooling<\/strong><\/h3>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><tbody><tr><td><strong>Propri\u00e9t\u00e9<\/strong><\/td><td><strong>Value \/ Description<\/strong><\/td><\/tr><tr><td>Conductivity<\/td><td>&lt; 1 \u00b5S\/cm<\/td><\/tr><tr><td>pH Range<\/td><td>6.5 \u2013 7.5 (neutral)<\/td><\/tr><tr><td>Particle Filtration<\/td><td>0.2 \u2013 1 \u00b5m filter size<\/td><\/tr><tr><td>Recycling Rate<\/td><td>Up to 90% in closed systems<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<h3 class=\"wp-block-heading\"><strong>How Does Cutting Fluid Help in the Silicon Wafer Slicing Wire Saw Process?<\/strong><\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Cutting fluid mixed with DI water. It enhances lubrication and cooling. It reduces the heat at the wire-wafer contact point. It also helps to remove small chopped particles.<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>It reduces the surface tension. The coolant is distributed more evenly.<\/li>\n\n\n\n<li>Protects the wire coating on extended cuts.<\/li>\n\n\n\n<li>It decreases the danger of small subsurface damage cutting.<\/li>\n\n\n\n<li>It is useful to maintain the groove wheel wire control steady.<\/li>\n<\/ul>\n\n\n\n<h2 class=\"wp-block-heading\"><strong>How Does pH Control Protect Your SiC Wafer Cutting Equipment?<\/strong><\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">pH regulation is commonly forgotten. But that is really crucial.\u00a0 \u201cIf the pH gets too high or too low, bad things will happen.\u201d It may etch on the wafer surface. It may eat through the wire covering. pH changes induce pitting in SiC wafer cutting equipment, sapphire wafer slicing machine configurations. They also result in loss of flatness.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Sometimes the wiring breaks down. Maintaining pH between 8 and 9.5 is the norm. This guideline applies to most of the modern wafer slicing technology systems. Stable pH signifies stable findings run after run.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><strong>Que se passe-t-il lorsque le pH sort de la plage ?<\/strong><\/h3>\n\n\n\n<h3 class=\"wp-block-heading\"><strong>Tableau comparatif : Effets du pH sur la plaquette et le fil<\/strong><\/h3>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><tbody><tr><td><strong>Niveau de pH<\/strong><\/td><td><strong>Effet sur la plaquette<\/strong><\/td><td><strong>Effet sur le fil<\/strong><\/td><td><strong>Niveau de risque<\/strong><\/td><\/tr><tr><td>En dessous de 6<\/td><td>Gravure de surface<\/td><td>Corrosion du fil<\/td><td>Haut<\/td><\/tr><tr><td>6 \u2013 7,5<\/td><td>Neutre, s\u00fbr<\/td><td>Faible usure<\/td><td>Faible<\/td><\/tr><tr><td>8 \u2013 9,5<\/td><td>Zone optimale<\/td><td>Usure minimale<\/td><td>Tr\u00e8s bas<\/td><\/tr><tr><td>Au-dessus de 10<\/td><td>Dommages alcalins<\/td><td>Coating breakdown<\/td><td>Haut<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<p class=\"wp-block-paragraph\">Keep pH between 6 and 9.5. The optimum zone for most thin wafer fabrication solution settings is approximately pH 8.5. It is slightly alkaline and quite harmless.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><strong>Advantages and Disadvantages of pH-Controlled Coolant Systems<\/strong><\/h3>\n\n\n\n<h4 class=\"wp-block-heading\"><strong>Avantages :<\/strong><\/h4>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Wires last longer. Replacement cost lowers.<\/li>\n\n\n\n<li>Wafer surface improvement Less of the cracking.<\/li>\n\n\n\n<li>Lower risk wire cutting procedures with less kerf loss.<\/li>\n\n\n\n<li>The same quality of output, batch after batch.<\/li>\n<\/ul>\n\n\n\n<h4 class=\"wp-block-heading\"><strong>D\u00e9savantages:<\/strong><\/h4>\n\n\n\n<ul class=\"wp-block-list\">\n<li>You require pH monitoring instruments. It costs money.<\/li>\n\n\n\n<li>Your setup cost is increased by chemical dosing systems.<\/li>\n\n\n\n<li>Operators need to be trained to handle it appropriately.<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\"><strong>Which Industries Use pH-Controlled Coolant in Wire Saws?<\/strong><\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Production of solar cells (mono- and polycrystalline silicon)<\/li>\n\n\n\n<li>Power Electronics (SiC and GaN wafer manufacturing)<\/li>\n\n\n\n<li>LED and optical components (sapphire wafer slicing)<\/li>\n\n\n\n<li>Semiconductor fabs using ultra thin wafer cutting technologies<\/li>\n<\/ul>\n\n\n\n<h2 class=\"wp-block-heading\"><strong>What Are Real-World Examples of Coolant Use in Wire Saw Cutting?<\/strong><\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">L'utilisation du liquide de refroidissement sur une scie \u00e0 fil pour trancheuses de plaquettes varie pour chaque mat\u00e9riau. Chaque entreprise a ses propres exigences en mati\u00e8re de d\u00e9bit, de m\u00e9lange et de pH. Les obtenir correctement augmentera la production et r\u00e9duira les d\u00e9chets.&nbsp;<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Haute pr\u00e9cision <strong><a href=\"https:\/\/www.semiconductorcutting.com\/fr\/produit\/ultra-thin-wafer-slicing-wire-saw\/\" target=\"_blank\" rel=\"noreferrer noopener\">wafer slicing wire saw<\/a><\/strong><a href=\"https:\/\/www.semiconductorcutting.com\/fr\/produit\/ultra-thin-wafer-slicing-wire-saw\/\"> <\/a>Les entreprises emploient couramment des syst\u00e8mes de refroidissement automatique. Cela r\u00e9duit les erreurs humaines. Vous trouverez ci-dessous quelques exemples concrets de divers secteurs.<\/p>\n\n\n\n<iframe width=\"1011\" height=\"572\" src=\"https:\/\/www.youtube.com\/embed\/H71HnGQuqsc\" title=\"Scie \u00e0 fil diamant\u00e9e Vimfun pour la d\u00e9coupe de contours en carbure de silicium et en quartz.\" frameborder=\"0\" allow=\"accelerometer; autoplay; clipboard-write; encrypted-media; gyroscope; picture-in-picture; web-share\" referrerpolicy=\"strict-origin-when-cross-origin\" allowfullscreen><\/iframe>\n\n\n\n<h3 class=\"wp-block-heading\"><strong>\u00c9tudes de cas : Utilisation du liquide de refroidissement par secteur industriel<\/strong><\/h3>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><tbody><tr><td><strong>Industrie<\/strong><\/td><td><strong>Mat\u00e9riau<\/strong><\/td><td><strong>Type de liquide de refroidissement<\/strong><\/td><td><strong>pH Range<\/strong><\/td><td><strong>B\u00e9n\u00e9fice cl\u00e9<\/strong><\/td><\/tr><tr><td>Solaire PV<\/td><td>Si monocristallin<\/td><td>Eau d\u00e9sionis\u00e9e + fluide PEG<\/td><td>8,0 \u2013 9,0<\/td><td>Perte de mati\u00e8re r\u00e9duite<\/td><\/tr><tr><td>\u00c9lectronique de puissance<\/td><td>SiC<\/td><td>Fil diamant\u00e9 + eau d\u00e9sionis\u00e9e<\/td><td>8,5 \u2013 9,5<\/td><td>Moins de dommages sous-jacents<\/td><\/tr><tr><td>Fabrication de LED<\/td><td>Saphir<\/td><td>Eau d\u00e9sionis\u00e9e + tensioactif<\/td><td>7,5 \u2013 8,5<\/td><td>Finition de surface propre<\/td><\/tr><tr><td>Usine de semi-conducteurs<\/td><td>Silicon<\/td><td>Syst\u00e8me d'eau d\u00e9sionis\u00e9e en boucle ferm\u00e9e<\/td><td>6.5 \u2013 8.0<\/td><td>High purity output<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<h3 class=\"wp-block-heading\"><strong>How Vimfun Supports Advanced Coolant-Ready Wire Saw Systems<\/strong><\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Searching for a quality wire saw cutting system you can rely on? Vimfun is a good pick. Their devices operate with SiC wafer cutting equipment, sapphire wafer slicing machine configurations and more.&nbsp;<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Vimfun systems have included a groove wheel wire control system. They provide coolant flow control as well. Check out Vimfun\u2019s entire line of innovative wafer slice technology machines.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><strong>What Are the Best Practices for Coolant Management in Wire Saw Systems?<\/strong><\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Excellent coolant care keeps your <strong><a href=\"https:\/\/www.semiconductorcutting.com\/fr\/how-effective-wire-saw-wafer-slicing\/\" target=\"_blank\" rel=\"noreferrer noopener\">wafer slicing wire saw <\/a><\/strong>working smoothly. It also cuts down on waste. It protects the machine and the wafer. The following are the main practices employed in current high speed multi wire saw machine operations.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><strong>Key Best Practices<\/strong><\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Test pH daily using a sensor or test kit<\/li>\n\n\n\n<li>0.2-1 \u00b5m filter for particle removal of coolant<\/li>\n\n\n\n<li>\u2013 Use closed-loop system to reduce waste, recycle DI water<\/li>\n\n\n\n<li>Check coolant mix weekly.. Too dilute less protection<\/li>\n\n\n\n<li>Change the cutting fluid according your machine maker\u2019s schedule<\/li>\n\n\n\n<li>Flush system for changing material, such as silicon to SiC.<\/li>\n\n\n\n<li>Log coolant data to detect issues early<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\"><strong>Coolant Flow Rate Guidelines<\/strong><\/h3>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><tbody><tr><td><strong>Type de machine<\/strong><\/td><td><strong>Flow Rate<\/strong><\/td><td><strong>Coolant Mix Ratio<\/strong><\/td><\/tr><tr><td>Single wire saw<\/td><td>5 \u2013 10 L\/min<\/td><td>3\u20135% fluid in DI water<\/td><\/tr><tr><td>Multi wire saw (small)<\/td><td>15 \u2013 30 L\/min<\/td><td>3\u20135% fluid in DI water<\/td><\/tr><tr><td>High speed multi wire saw<\/td><td>40 \u2013 80 L\/min<\/td><td>5\u20138% fluid in DI water<\/td><\/tr><tr><td>SiC \/ Sapphire wire saw<\/td><td>20 \u2013 50 L\/min<\/td><td>5\u201310% fluid in DI water<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\"><strong>FAQ<\/strong><\/h2>\n\n\n\n<h4 class=\"wp-block-heading\"><strong>What is the best coolant for a wafer slicing wire saw?<\/strong><\/h4>\n\n\n\n<p class=\"wp-block-paragraph\">The finest coolant is DI water with a cutting fluid added in. Surface cleaned with DI water. It leaves no mineral build-up. The cutting fluid acts as a lubricant and to manage heat. They function well together for the silicon wafer slicing process and ultra thin wafer cutting technology.<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>La qualit\u00e9 de l'eau d\u00e9sionis\u00e9e doit \u00eatre inf\u00e9rieure \u00e0 1 microS\/cm<\/li>\n\n\n\n<li>La quantit\u00e9 de liquide de coupe doit \u00eatre de 3 \u00e0 8 % du volume total de<\/li>\n\n\n\n<li>Assurez-vous que le fluide est compatible avec votre type de fil<\/li>\n<\/ul>\n\n\n\n<h4 class=\"wp-block-heading\"><strong>Pourquoi le contr\u00f4le du pH est-il important dans la coupe de plaquettes de SiC ?<\/strong><\/h4>\n\n\n\n<p class=\"wp-block-paragraph\">La r\u00e9gulation du pH maintient la surface de la plaquette et le rev\u00eatement du fil dans un \u00e9tat s\u00fbr. Le SiC est assez dur. Sa coupe cr\u00e9e de la chaleur et des contraintes chimiques. Un mauvais pH cr\u00e9e des micro-fissures. Il attaque \u00e9galement la surface. Cela r\u00e9duit la qualit\u00e9 de la plaquette.<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Un pH de 8,5 \u00e0 9,5 est le meilleur pH pour la coupe de SiC<\/li>\n\n\n\n<li>Capteur de pH en ligne pour une surveillance en temps r\u00e9el<\/li>\n\n\n\n<li>Ajustez le pH pour l'augmenter avec du NaOH dilu\u00e9, ou le diminuer avec de l'acide citrique<\/li>\n<\/ul>\n\n\n\n<h4 class=\"wp-block-heading\"><strong>Puis-je r\u00e9utiliser le liquide de refroidissement dans une machine de sciage \u00e0 fil ?<\/strong><\/h4>\n\n\n\n<p class=\"wp-block-paragraph\">Oui. Le recyclage du liquide de refroidissement est pris en charge par la plupart des \u00e9quipements actuels de syst\u00e8mes de coupe de sciage de pr\u00e9cision \u00e0 fil. Le liquide de refroidissement usag\u00e9 est filtr\u00e9 et son pH est corrig\u00e9. Et ensuite \u00e0 nouveau dans le r\u00e9servoir. Cela peut r\u00e9duire l'utilisation d'eau d\u00e9sionis\u00e9e jusqu'\u00e0 90 %. Cela r\u00e9duit \u00e9galement les d\u00e9penses de fonctionnement.<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Les filtres multi-\u00e9tapes fournissent des r\u00e9sultats optimaux<\/li>\n\n\n\n<li>Surveillez la conductivit\u00e9 pour savoir quand changer l'eau d\u00e9sionis\u00e9e<\/li>\n\n\n\n<li>Changez le liquide de coupe \u00e0 intervalles r\u00e9guliers, pas seulement quand il a l'air horrible<\/li>\n<\/ul>\n\n\n\n<h4 class=\"wp-block-heading\"><strong>Comment le liquide de refroidissement affecte-t-il la perte de mati\u00e8re (kerf loss) dans la coupe \u00e0 fil ?<\/strong><\/h4>\n\n\n\n<p class=\"wp-block-paragraph\">Un bon liquide de refroidissement r\u00e9duit la friction et la chaleur. Le fil fait une coupe plus nette. Moins de chaleur = moins d'\u00e9caillage sur le bord de la coupe. Cela permet une coupe \u00e0 fil avec une faible perte de mati\u00e8re et des plaquettes plus fines et plus uniformes.<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Un bon liquide de refroidissement r\u00e9duit la perte de mati\u00e8re (kerf loss) de 5 \u00e0 15 %<\/li>\n\n\n\n<li>Constant flow rate ensures a consistent cut zone<\/li>\n\n\n\n<li>Dirty coolant increases kerf loss greater and damages the wire quicker\u00a0<\/li>\n<\/ul>\n\n\n\n<h4 class=\"wp-block-heading\"><strong>What coolant is used for sapphire wafer slicing?<\/strong><\/h4>\n\n\n\n<p class=\"wp-block-paragraph\">Sapphire Wafer Slicing Machine Uses Low Foam Surfactant in DI Water. Sapphire is exceedingly hard \u2013 9 on the Mohs scale. The abrasive particles must be immediately washed away by the coolant. For optimal results keep pH between 7.5 \u2013 8.5.<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Do not use high foam fluids. They stop the clearance of debris.<\/li>\n\n\n\n<li>Sapphire particle elimination using 0.2um filters<\/li>\n\n\n\n<li>Increased flow rates assist to cleanse the cut zone quicker<\/li>\n<\/ul>\n\n\n\n<h2 class=\"wp-block-heading\"><strong>Conclusion<\/strong><\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Proper coolant is the most important factor in an effective wafer slicing wire saw operation. DI water, cutting fluid, and pH control work together to safeguard your wire, your wafer and your yield. Bad coolant costs you money.\u00a0 A good coolant will preserve it.&nbsp;<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">If you want a machine designed for advanced wafer slicing technology and with complete coolant support, Vimfun is your best option. Their machines meet the slicing requirements of silicon, SiC and sapphire. Come to <strong><a href=\"https:\/\/www.semiconductorcutting.com\/fr\/\" target=\"_blank\" rel=\"noreferrer noopener\">Vimfun<\/a><\/strong> now and find out which wire saw is appropriate for your production.<\/p>","protected":false},"excerpt":{"rendered":"<p>Why do some wafers break while cutting? I have over 15 years experience in the wafer slicing wire saw industry, and I have seen how the improper coolant can damage a whole batch. In this article we will explore what coolant to use, why DI water and cutting fluid matter, and how pH control makes [&hellip;]<\/p>\n","protected":false},"author":5,"featured_media":4946,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"","adv-header-id-meta":"","stick-header-meta":"","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"footnotes":""},"categories":[8],"tags":[983,984,979,980,978],"class_list":["post-5538","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news-insights","tag-groove-wheel-wire-control-system","tag-high-precision-wafer-slicing-wire-saw","tag-high-speed-multi-wire-saw-machine","tag-ultra-thin-wafer-cutting-technology","tag-wafer-slicing-wire-saw"],"acf":[],"_links":{"self":[{"href":"https:\/\/www.semiconductorcutting.com\/fr\/wp-json\/wp\/v2\/posts\/5538","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.semiconductorcutting.com\/fr\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.semiconductorcutting.com\/fr\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.semiconductorcutting.com\/fr\/wp-json\/wp\/v2\/users\/5"}],"replies":[{"embeddable":true,"href":"https:\/\/www.semiconductorcutting.com\/fr\/wp-json\/wp\/v2\/comments?post=5538"}],"version-history":[{"count":1,"href":"https:\/\/www.semiconductorcutting.com\/fr\/wp-json\/wp\/v2\/posts\/5538\/revisions"}],"predecessor-version":[{"id":5540,"href":"https:\/\/www.semiconductorcutting.com\/fr\/wp-json\/wp\/v2\/posts\/5538\/revisions\/5540"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.semiconductorcutting.com\/fr\/wp-json\/wp\/v2\/media\/4946"}],"wp:attachment":[{"href":"https:\/\/www.semiconductorcutting.com\/fr\/wp-json\/wp\/v2\/media?parent=5538"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.semiconductorcutting.com\/fr\/wp-json\/wp\/v2\/categories?post=5538"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.semiconductorcutting.com\/fr\/wp-json\/wp\/v2\/tags?post=5538"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}