{"id":5050,"date":"2026-04-15T18:01:13","date_gmt":"2026-04-15T10:01:13","guid":{"rendered":"https:\/\/www.semiconductorcutting.com\/?page_id=5050"},"modified":"2026-04-15T18:02:23","modified_gmt":"2026-04-15T10:02:23","slug":"double-sided-grinding-machine","status":"publish","type":"page","link":"https:\/\/www.semiconductorcutting.com\/es\/double-sided-grinding-machine\/","title":{"rendered":"Double sided grinding machine"},"content":{"rendered":"<div data-elementor-type=\"wp-page\" data-elementor-id=\"5050\" class=\"elementor elementor-5050\" data-elementor-post-type=\"page\">\n\t\t\t\t<div class=\"elementor-element elementor-element-46ff738 e-flex e-con-boxed e-con e-parent\" data-id=\"46ff738\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t\t\t<div class=\"elementor-element elementor-element-5ce3365 elementor-widget elementor-widget-html\" data-id=\"5ce3365\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"html.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<style>\r\n.lp-wrap { max-width: 960px; 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}\r\n  .lp-mats { grid-template-columns: 1fr; }\r\n}\r\n<\/style>\r\n\r\n<div class=\"lp-wrap\">\r\n\r\n<!-- \u2500\u2500 HERO \u2500\u2500 -->\r\n<div class=\"lp-hero\">\r\n  <p class=\"lp-hero-eyebrow\">Precision Surface Processing<\/p>\r\n  <h1>Double Sided Grinding Machine<\/h1>\r\n  <p class=\"lp-hero-sub\">3 models covering \u03a6210 mm to \u03a6480 mm workpieces. Flatness \u2264 0.015 mm, pressure control \u00b110 N, sub-nanometer Ra surface \u2014 for SiC wafers, sapphire, optical glass, and advanced ceramics.<\/p>\r\n  <div class=\"lp-hero-btns\">\r\n    <a href=\"\/es\/contact\/\" class=\"lp-btn-primary\">Request a Quote<\/a>\r\n    <a href=\"#models\" class=\"lp-btn-outline\">Compare 3 Models \u2193<\/a>\r\n  <\/div>\r\n<\/div>\r\n\r\n<!-- \u2500\u2500 TRUST BAR \u2500\u2500 -->\r\n<div class=\"lp-trustbar\">\r\n  <span>Flatness \u2264 0.015 mm<\/span>\r\n  <span>Pressure Control \u00b110 N<\/span>\r\n  <span>Sub-nanometer Ra Surface<\/span>\r\n  <span>Ultra-thin 0.1 mm Workpiece<\/span>\r\n  <span>TTV &lt; 1 \u03bcm (SiC wafer)<\/span>\r\n  <span>35+ Patents<\/span>\r\n<\/div>\r\n\r\n<!-- \u2500\u2500 INTRO \u2500\u2500 -->\r\n<div class=\"lp-section lp-intro\">\r\n  <h2 class=\"lp-h2\">High-Precision Double Sided Grinding Machine for Advanced Materials<\/h2>\r\n  <span class=\"lp-accent\"><\/span>\r\n  <p>A <strong>double sided grinding machine<\/strong> simultaneously processes both faces of a workpiece between two counter-rotating lapping plates, achieving flatness and parallelism that single-sided methods cannot match. Vimfun's planetary-drive series is purpose-built for hard, brittle, and high-value materials: silicon carbide (SiC) wafers, sapphire substrates, optical filters, alumina ceramics, crystal quartz, and precision mechanical components.<\/p>\r\n  <p>Each model uses a high-precision crossed roller bearing as the main spindle bearing \u2014 the same bearing class found in German and Japanese machine tool spindles. The planetary carrier system (sun gear + ring gear + planet carriers) ensures even pressure distribution across all workpieces simultaneously, eliminating the edge rolloff and flatness drift common in conventional single-axis grinding.<\/p>\r\n  <p>Vimfun's double sided grinding machine line inherits the complete R&D base of AVIC Jiangxi Optoelectronics, with 35+ patents and proven deployments at BYD, Foxconn, Lens Technology, and Bill Crystal. Whether your application demands TTV control for next-generation SiC power devices or flatness for precision optics, there is a Vimfun model matched to your production scale.<\/p>\r\n<\/div>\r\n\r\n<!-- \u2500\u2500 3 MODEL CARDS \u2500\u2500 -->\r\n<div class=\"lp-section\" id=\"models\">\r\n  <h2 class=\"lp-h2\">Choose Your Double Sided Grinding Machine<\/h2>\r\n  <span class=\"lp-accent\"><\/span>\r\n  <div class=\"lp-models\">\r\n\r\n    <!-- 13B -->\r\n    <div class=\"lp-card\">\r\n      <div class=\"lp-card-series\">Compact Series<\/div>\r\n      <h3>13B-6LY\/P<\/h3>\r\n      <p class=\"lp-card-sub\">6-Carrier \u00b7 Max \u03a6210 mm \u00b7 R&D &amp; Small Batch<\/p>\r\n      <div class=\"lp-card-specs\">\r\n        <div class=\"lp-spec-row\"><span class=\"lp-spec-label\">Max workpiece dia.<\/span><span class=\"lp-spec-val\">\u03a6210 mm<\/span><\/div>\r\n        <div class=\"lp-spec-row\"><span class=\"lp-spec-label\">Plate flatness<\/span><span class=\"lp-spec-val\">\u2264 0.015 mm<\/span><\/div>\r\n        <div class=\"lp-spec-row\"><span class=\"lp-spec-label\">Processing force<\/span><span class=\"lp-spec-val\">120\u20133500 N<\/span><\/div>\r\n        <div class=\"lp-spec-row\"><span class=\"lp-spec-label\">Pressure control<\/span><span class=\"lp-spec-val\">\u00b110 N<\/span><\/div>\r\n        <div class=\"lp-spec-row\"><span class=\"lp-spec-label\">Thickness accuracy<\/span><span class=\"lp-spec-val\">\u00b12 \u03bcm (opt.)<\/span><\/div>\r\n        <div class=\"lp-spec-row\"><span class=\"lp-spec-label\">Total power<\/span><span class=\"lp-spec-val\">18 kW<\/span><\/div>\r\n        <div class=\"lp-spec-row\"><span class=\"lp-spec-label\">Machine weight<\/span><span class=\"lp-spec-val\">~4,300 kg<\/span><\/div>\r\n      <\/div>\r\n      <div class=\"lp-card-best\">Best for: optical filters, sapphire wafers \u2264 8-inch, SiC substrates, R&amp;D labs and small production batches<\/div>\r\n      <div class=\"lp-card-btns\">\r\n        <a href=\"\/es\/productos\/grinding-13b\/\" class=\"lp-card-btn-primary\">Ver detalles<\/a>\r\n        <a href=\"\/es\/contact\/\" class=\"lp-card-btn-outline\">Solicitar presupuesto<\/a>\r\n      <\/div>\r\n    <\/div>\r\n\r\n    <!-- 16B \u2014 Most Popular -->\r\n    <div class=\"lp-card lp-card-featured\">\r\n      <div class=\"lp-card-badge\">El m\u00e1s popular<\/div>\r\n      <div class=\"lp-card-series\">Mid-Size Series<\/div>\r\n      <h3>16B-5LY\/P<\/h3>\r\n      <p class=\"lp-card-sub\">5-Carrier \u00b7 P5 Bearing \u00b7 Max \u03a6390 mm<\/p>\r\n      <div class=\"lp-card-specs\">\r\n        <div class=\"lp-spec-row\"><span class=\"lp-spec-label\">Max workpiece dia.<\/span><span class=\"lp-spec-val\">\u03a6390 mm<\/span><\/div>\r\n        <div class=\"lp-spec-row\"><span class=\"lp-spec-label\">Plate flatness<\/span><span class=\"lp-spec-val\">\u2264 0.015 mm<\/span><\/div>\r\n        <div class=\"lp-spec-row\"><span class=\"lp-spec-label\">Bearing grade<\/span><span class=\"lp-spec-val\">P5 crossed roller<\/span><\/div>\r\n        <div class=\"lp-spec-row\"><span class=\"lp-spec-label\">Pressure control<\/span><span class=\"lp-spec-val\">\u00b110 N<\/span><\/div>\r\n        <div class=\"lp-spec-row\"><span class=\"lp-spec-label\">Thickness accuracy<\/span><span class=\"lp-spec-val\">\u00b12 \u03bcm (opt.)<\/span><\/div>\r\n        <div class=\"lp-spec-row\"><span class=\"lp-spec-label\">Total power<\/span><span class=\"lp-spec-val\">20 kW<\/span><\/div>\r\n        <div class=\"lp-spec-row\"><span class=\"lp-spec-label\">Machine weight<\/span><span class=\"lp-spec-val\">~4,800 kg<\/span><\/div>\r\n      <\/div>\r\n      <div class=\"lp-card-best\">Best for: 12-inch wafer production, large optical glass, industrial ceramics, mid-to-high volume semiconductor lines<\/div>\r\n      <div class=\"lp-card-btns\">\r\n        <a href=\"\/es\/productos\/grinding-16b\/\" class=\"lp-card-btn-primary\">Ver detalles<\/a>\r\n        <a href=\"\/es\/contact\/\" class=\"lp-card-btn-outline\">Solicitar presupuesto<\/a>\r\n      <\/div>\r\n    <\/div>\r\n\r\n    <!-- 22BF -->\r\n    <div class=\"lp-card\">\r\n      <div class=\"lp-card-series\">Heavy-Duty Series<\/div>\r\n      <h3>22BF-5LY\/P<\/h3>\r\n      <p class=\"lp-card-sub\">5-Carrier \u00b7 Max \u03a6480 mm \u00b7 9000 N Force<\/p>\r\n      <div class=\"lp-card-specs\">\r\n        <div class=\"lp-spec-row\"><span class=\"lp-spec-label\">Max workpiece dia.<\/span><span class=\"lp-spec-val\">\u03a6480 mm<\/span><\/div>\r\n        <div class=\"lp-spec-row\"><span class=\"lp-spec-label\">Plate flatness<\/span><span class=\"lp-spec-val\">\u2264 0.02 mm<\/span><\/div>\r\n        <div class=\"lp-spec-row\"><span class=\"lp-spec-label\">Max force<\/span><span class=\"lp-spec-val\">9000 N (\u219212000)<\/span><\/div>\r\n        <div class=\"lp-spec-row\"><span class=\"lp-spec-label\">Pressure control<\/span><span class=\"lp-spec-val\">\u00b120 N<\/span><\/div>\r\n        <div class=\"lp-spec-row\"><span class=\"lp-spec-label\">Thickness accuracy<\/span><span class=\"lp-spec-val\">\u00b10.01 mm (opt.)<\/span><\/div>\r\n        <div class=\"lp-spec-row\"><span class=\"lp-spec-label\">Total power<\/span><span class=\"lp-spec-val\">36 kW<\/span><\/div>\r\n        <div class=\"lp-spec-row\"><span class=\"lp-spec-label\">Machine weight<\/span><span class=\"lp-spec-val\">~9,000 kg<\/span><\/div>\r\n      <\/div>\r\n      <div class=\"lp-card-best\">Best for: large ceramic blocks, thick mechanical components, heavy industrial production at maximum scale<\/div>\r\n      <div class=\"lp-card-btns\">\r\n        <a href=\"\/es\/producto\/double-sided-polishing\/\" class=\"lp-card-btn-primary\">Ver detalles<\/a>\r\n        <a href=\"\/es\/contact\/\" class=\"lp-card-btn-outline\">Solicitar presupuesto<\/a>\r\n      <\/div>\r\n    <\/div>\r\n\r\n  <\/div>\r\n<\/div>\r\n\r\n<!-- \u2500\u2500 SPEC COMPARISON TABLE \u2500\u2500 -->\r\n<div class=\"lp-section\">\r\n  <h2 class=\"lp-h2\">Full Specification Comparison \u2014 All 3 Double Sided Lapping Machine Models<\/h2>\r\n  <span class=\"lp-accent\"><\/span>\r\n  <div class=\"lp-table-wrap\">\r\n    <table class=\"lp-table\">\r\n      <thead>\r\n        <tr>\r\n          <th>Par\u00e1metro<\/th>\r\n          <th>13B-6LY\/P<\/th>\r\n          <th class=\"featured\">16B-5LY\/P \u2b50<\/th>\r\n          <th>22BF-5LY\/P<\/th>\r\n        <\/tr>\r\n      <\/thead>\r\n      <tbody>\r\n        <tr><td>Di\u00e1metro M\u00e1ximo de Pieza de Trabajo<\/td><td>\u03a6210 mm<\/td><td class=\"featured\">\u03a6390 mm<\/td><td>\u03a6480 mm<\/td><\/tr>\r\n        <tr><td>Grosor M\u00e1x. de Pieza<\/td><td>25 mm<\/td><td class=\"featured\">25 mm<\/td><td>45 mm<\/td><\/tr>\r\n        <tr><td>Planitud de la placa inferior<\/td><td>\u2264 0.015 mm<\/td><td class=\"featured\">\u2264 0.015 mm<\/td><td>\u2264 0.02 mm<\/td><\/tr>\r\n        <tr><td>Rango de Fuerza de Procesamiento<\/td><td>120\u20133500 N<\/td><td class=\"featured\">\u2014<\/td><td>150\u20139000 N<\/td><\/tr>\r\n        <tr><td>Precisi\u00f3n de control de presi\u00f3n<\/td><td>\u00b110 N<\/td><td class=\"featured\">\u00b110 N<\/td><td>\u00b120 N<\/td><\/tr>\r\n        <tr><td>Main Bearing<\/td><td>Crossed roller<\/td><td class=\"featured\">P5 crossed roller<\/td><td>Crossed roller<\/td><\/tr>\r\n        <tr><td>Medici\u00f3n de espesor (opcional)<\/td><td>\u00b12 \u03bcm<\/td><td class=\"featured\">\u00b12 \u03bcm<\/td><td>\u00b10,01 mm<\/td><\/tr>\r\n        <tr><td>N\u00famero de Portadores<\/td><td>6 piezas<\/td><td class=\"featured\">5 piezas<\/td><td>5 piezas<\/td><\/tr>\r\n        <tr><td>Plate OD<\/td><td>\u03a6933 mm<\/td><td class=\"featured\">\u03a61154 mm<\/td><td>\u03a61492 mm<\/td><\/tr>\r\n        <tr><td>Potencia total<\/td><td>18 kW<\/td><td class=\"featured\">20 kW<\/td><td>36 kW<\/td><\/tr>\r\n        <tr><td>Peso de la m\u00e1quina<\/td><td>~4,300 kg<\/td><td class=\"featured\">~4,800 kg<\/td><td>~9,000 kg<\/td><\/tr>\r\n      <\/tbody>\r\n    <\/table>\r\n  <\/div>\r\n<\/div>\r\n\r\n<!-- \u2500\u2500 MATERIALS \u2500\u2500 -->\r\n<div class=\"lp-section\">\r\n  <h2 class=\"lp-h2\">Materials Processed by Vimfun Double Sided Lapping Machines<\/h2>\r\n  <span class=\"lp-accent\"><\/span>\r\n  <div class=\"lp-mats\">\r\n    <div class=\"lp-mat\">\r\n      <div class=\"lp-mat-title\">Obleas semiconductoras<\/div>\r\n      <div class=\"lp-mat-desc\">SiC (silicon carbide), Si (silicon), GaAs \u2014 precision lapping to TTV &lt; 1 \u03bcm for power device and IC production. <a href=\"\/es\/solutions\/semiconductor\/\">\u2192 Semiconductor solutions<\/a><\/div>\r\n    <\/div>\r\n    <div class=\"lp-mat\">\r\n      <div class=\"lp-mat-title\">Sustratos de Zafiro<\/div>\r\n      <div class=\"lp-mat-desc\">LED-grade and optical-grade sapphire wafers. Sub-nanometer Ra surface roughness with diamond slurry on the double sided lapping machine. <a href=\"\/es\/solutions\/sapphire\/\">\u2192 Sapphire solutions<\/a><\/div>\r\n    <\/div>\r\n    <div class=\"lp-mat\">\r\n      <div class=\"lp-mat-title\">Optical Glass &amp; Filters<\/div>\r\n      <div class=\"lp-mat-desc\">Optical filter glass, blue glass substrates, BK7, fused silica. Flatness \u2264 0.015 mm for interference-quality surfaces in optical systems.<\/div>\r\n    <\/div>\r\n    <div class=\"lp-mat\">\r\n      <div class=\"lp-mat-title\">Cer\u00e1mica avanzada<\/div>\r\n      <div class=\"lp-mat-desc\">Alumina (Al\u2082O\u2083), silicon nitride (Si\u2083N\u2084), zirconia, AlN substrates. The 22BF handles large ceramic blocks up to \u03a6480 mm at 9000 N. <a href=\"\/es\/solutions\/ceramics\/\">\u2192 Ceramics solutions<\/a><\/div>\r\n    <\/div>\r\n    <div class=\"lp-mat\">\r\n      <div class=\"lp-mat-title\">Crystal &amp; Quartz<\/div>\r\n      <div class=\"lp-mat-desc\">Quartz wafers, piezoelectric crystals (LiNbO\u2083, LiTaO\u2083), optical crystals. Flatness and parallelism directly affect resonant frequency consistency.<\/div>\r\n    <\/div>\r\n    <div class=\"lp-mat\">\r\n      <div class=\"lp-mat-title\">Precision Mechanical Parts<\/div>\r\n      <div class=\"lp-mat-desc\">Bearing rings, seal faces, valve plates, and carbide components. The 22BF's 12,000 N expandable force handles hardened steels and cemented carbides.<\/div>\r\n    <\/div>\r\n  <\/div>\r\n<\/div>\r\n\r\n<!-- \u2500\u2500 WHY VIMFUN \u2500\u2500 -->\r\n<div class=\"lp-section\">\r\n  <h2 class=\"lp-h2\">Why Choose Vimfun Double Sided Lapping Machine<\/h2>\r\n  <span class=\"lp-accent\"><\/span>\r\n  <div class=\"lp-why\">\r\n    <div class=\"lp-why-item\">\r\n      <div class=\"lp-why-icon\">\ud83c\udfed<\/div>\r\n      <div>\r\n        <div class=\"lp-why-title\">Full Technology Inheritance from AVIC<\/div>\r\n        <div class=\"lp-why-desc\">Inherits the complete R&D and manufacturing base of AVIC Jiangxi Optoelectronics \u2014 the original developer of this planetary lapping architecture in China.<\/div>\r\n      <\/div>\r\n    <\/div>\r\n    <div class=\"lp-why-item\">\r\n      <div class=\"lp-why-icon\">\ud83d\udcd0<\/div>\r\n      <div>\r\n        <div class=\"lp-why-title\">Planitud de Placa Reparable en Campo<\/div>\r\n        <div class=\"lp-why-desc\">All models ship with field-repairable lapping plates. Flatness drift can be corrected on-site without returning the machine \u2014 minimizing production downtime.<\/div>\r\n      <\/div>\r\n    <\/div>\r\n    <div class=\"lp-why-item\">\r\n      <div class=\"lp-why-icon\">\u2699\ufe0f<\/div>\r\n      <div>\r\n        <div class=\"lp-why-title\">Independent 4-Axis VFD Speed Control<\/div>\r\n        <div class=\"lp-why-desc\">Lower plate, upper plate, outer ring gear, and sun gear are each independently variable-frequency driven for full lapping kinematic control across all materials.<\/div>\r\n      <\/div>\r\n    <\/div>\r\n    <div class=\"lp-why-item\">\r\n      <div class=\"lp-why-icon\">\ud83d\udd2c<\/div>\r\n      <div>\r\n        <div class=\"lp-why-title\">In-Process Thickness Measurement<\/div>\r\n        <div class=\"lp-why-desc\">Optional real-time thickness monitoring at \u00b12 \u03bcm (13B\/16B) or \u00b10.01 mm (22BF). Closed-loop control stops automatically at target thickness \u2014 no manual gauge checks needed.<\/div>\r\n      <\/div>\r\n    <\/div>\r\n    <div class=\"lp-why-item\">\r\n      <div class=\"lp-why-icon\">\ud83d\udd27<\/div>\r\n      <div>\r\n        <div class=\"lp-why-title\">Cadena de suministro completa de consumibles<\/div>\r\n        <div class=\"lp-why-desc\">Vimfun supplies matching <a href=\"\/es\/productos\/lapping-accessories\/\">lapping accessories<\/a>: slotted carriers, diamond conditioning wheels, ring gears, and polishing pads \u2014 all matched to exact machine specifications.<\/div>\r\n      <\/div>\r\n    <\/div>\r\n    <div class=\"lp-why-item\">\r\n      <div class=\"lp-why-icon\">\ud83c\udf0d<\/div>\r\n      <div>\r\n        <div class=\"lp-why-title\">Breaks the Import Equipment Monopoly<\/div>\r\n        <div class=\"lp-why-desc\">High-precision double sided lapping machines were previously dominated by SPEEDFAM (Japan) and German systems. Vimfun delivers equivalent precision at significantly lower total cost, with local service and rapid spare parts supply.<\/div>\r\n      <\/div>\r\n    <\/div>\r\n  <\/div>\r\n<\/div>\r\n\r\n<!-- \u2500\u2500 FAQ \u2500\u2500 -->\r\n<div class=\"lp-section\">\r\n  <h2 class=\"lp-h2\">Preguntas frecuentes<\/h2>\r\n  <span class=\"lp-accent\"><\/span>\r\n  <div class=\"lp-faq\">\r\n    <div class=\"lp-faq-item\">\r\n      <div class=\"lp-faq-q\">What is the difference between lapping and polishing on these machines?<\/div>\r\n      <div class=\"lp-faq-a\">Lapping uses a cast iron plate with free abrasive slurry (diamond or SiC) to remove material and establish flatness. Polishing uses a softer plate (polyurethane pad or stainless steel) with fine diamond suspension to achieve the final surface finish (Ra). Both operations run on the same machine with a plate changeover of approximately 2 hours. For semiconductor wafer manufacturing, lapping establishes flatness and TTV first, followed by polishing to the required Ra for downstream CMP or epitaxy.<\/div>\r\n    <\/div>\r\n    <div class=\"lp-faq-item\">\r\n      <div class=\"lp-faq-q\">Which double sided lapping machine model is right for SiC wafer production?<\/div>\r\n      <div class=\"lp-faq-a\">For 4-inch and 6-inch SiC wafers the 16B-5LY\/P is the most common choice \u2014 P5-grade bearing stability delivers TTV &lt; 1 \u03bcm results. For 8-inch SiC or high-volume 6-inch batches, the 22BF-5LY\/P is recommended. For R&D labs processing 2\u20134 inch material the 13B-6LY\/P offers the lowest entry cost with full flatness performance. See our <a href=\"\/es\/solutions\/semiconductor\/\" target=\"_blank\" rel=\"noopener\">semiconductor wafer processing solutions<\/a> page for detailed process parameters.<\/div>\r\n    <\/div>\r\n    <div class=\"lp-faq-item\">\r\n      <div class=\"lp-faq-q\">What flatness can a double sided lapping machine achieve?<\/div>\r\n      <div class=\"lp-faq-a\">The 13B and 16B achieve lower plate flatness \u2264 0.015 mm as standard. With optimized slurry and carrier parameters, workpiece flatness within 1\u20132 \u03bcm and TTV under 1 \u03bcm are routinely achieved. For flatness measurement standards, see <a href=\"https:\/\/www.sciencedirect.com\/topics\/engineering\/optical-flatness\" target=\"_blank\" rel=\"nofollow noopener\">ScienceDirect: Est\u00e1ndares de planitud \u00f3ptica<\/a>. The 22BF achieves \u2264 0.02 mm, appropriate for large-format ceramics and thick components.<\/div>\r\n    <\/div>\r\n    <div class=\"lp-faq-item\">\r\n      <div class=\"lp-faq-q\">Can the machine process ultra-thin workpieces (0.1 mm)?<\/div>\r\n      <div class=\"lp-faq-a\">Yes. Vimfun's double sided lapping machine series has demonstrated successful processing of workpieces as thin as 0.1 mm using slotted carrier plates with appropriate backing support. Ultra-thin processing requires carrier slot design matched to workpiece material \u2014 Vimfun's engineering team provides carrier specifications as part of the application review for thin-workpiece orders.<\/div>\r\n    <\/div>\r\n    <div class=\"lp-faq-item\">\r\n      <div class=\"lp-faq-q\">What consumables and accessories are required?<\/div>\r\n      <div class=\"lp-faq-a\">Primary consumables are: (1) lapping slurry or polishing suspension matched to your material, (2) carrier plates (slotted plates) sized to your workpiece, (3) diamond conditioning wheels for plate dressing, and (4) polishing pads for the polishing step. Vimfun supplies all of these through our <a href=\"\/es\/productos\/lapping-accessories\/\">lapping accessories<\/a> program, with specifications matched to each model to eliminate compatibility issues.<\/div>\r\n    <\/div>\r\n  <\/div>\r\n<\/div>\r\n\r\n<!-- \u2500\u2500 CTA \u2500\u2500 -->\r\n<div class=\"lp-cta\">\r\n  <div class=\"lp-cta-title\">Ready to Select Your Double Sided Grinding Machine?<\/div>\r\n  <div class=\"lp-cta-sub\">Send your workpiece specs and production targets \u2014 our engineers review your application and recommend the right model and process parameters before you commit.<\/div>\r\n  <div class=\"lp-cta-btns\">\r\n    <a href=\"\/es\/contact\/\" class=\"lp-cta-main\">Request a Quote<\/a>\r\n    <a href=\"https:\/\/wa.me\/8613027738908\" class=\"lp-cta-wa\" target=\"_blank\" rel=\"noopener nofollow\">\ud83d\udcac WhatsApp<\/a>\r\n  <\/div>\r\n  <div class=\"lp-cta-contact\">Correo electr\u00f3nico: <a href=\"mailto:daria@endlesswiresaw.com\">daria@endlesswiresaw.com<\/a> &nbsp;|\u00a0 Tel: +86 130 2773 8908<\/div>\r\n<\/div>\r\n\r\n<\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>","protected":false},"excerpt":{"rendered":"<p>Precision Surface Processing Double Sided Grinding Machine 3 models covering \u03a6210 mm to \u03a6480 mm workpieces. Flatness \u2264 0.015 mm, pressure control \u00b110 N, sub-nanometer Ra surface \u2014 for SiC wafers, sapphire, optical glass, and advanced ceramics. Request a Quote Compare 3 Models \u2193 Flatness \u2264 0.015 mm Pressure Control \u00b110 N Sub-nanometer Ra Surface [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"elementor_header_footer","meta":{"_acf_changed":false,"site-sidebar-layout":"no-sidebar","site-content-layout":"page-builder","ast-site-content-layout":"full-width-container","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"disabled","ast-breadcrumbs-content":"","ast-featured-img":"disabled","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"","adv-header-id-meta":"","stick-header-meta":"","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"footnotes":""},"class_list":["post-5050","page","type-page","status-publish","hentry"],"acf":[],"_links":{"self":[{"href":"https:\/\/www.semiconductorcutting.com\/es\/wp-json\/wp\/v2\/pages\/5050","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.semiconductorcutting.com\/es\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.semiconductorcutting.com\/es\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.semiconductorcutting.com\/es\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.semiconductorcutting.com\/es\/wp-json\/wp\/v2\/comments?post=5050"}],"version-history":[{"count":5,"href":"https:\/\/www.semiconductorcutting.com\/es\/wp-json\/wp\/v2\/pages\/5050\/revisions"}],"predecessor-version":[{"id":5055,"href":"https:\/\/www.semiconductorcutting.com\/es\/wp-json\/wp\/v2\/pages\/5050\/revisions\/5055"}],"wp:attachment":[{"href":"https:\/\/www.semiconductorcutting.com\/es\/wp-json\/wp\/v2\/media?parent=5050"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}