SNEC PV+ES has been held annually in Shanghai since 2007. By its 18th edition in 2025, the exhibition had grown to 360,000 m\u00b2 of floor space, with over 3,000 exhibitors from 95 countries. It is one of the world\u2019s largest and most influential PV and energy storage shows \u2014 and once a year, it\u2019s where most of the silicon and crystal processing industry gathers in one place.<\/p>\n\n\n\n
Join us in Shanghai this June.<\/p>\n\n\n\n
We\u2019re using this show to have deeper technical conversations across three connected stages of the silicon and crystal processing chain. Anyone who\u2019s worked in wafer processing knows these stages don\u2019t operate in isolation \u2014 a parameter shift in growth shows up in slicing yield, and a slicing issue surfaces in the grinding step.<\/p>\n\n\n\n
The growth stage determines ingot purity, dislocation density, and defect distribution. Hot zone design, seed positioning, pull rate curves, melt convection \u2014 any deviation here propagates into slicing loss and downstream yield problems, often invisible until later inspection.<\/p>\n\n\n\n
At Vimfun, this is not where we\u2019re strongest, and we won\u2019t pretend otherwise. What we\u2019d like to do at this stage of the conversation is listen<\/strong> \u2014 to hear what real problems customers are running into on the growth side, and explore where Vimfun can support better on process handoff and equipment compatibility downstream.<\/p>\n\n\n\n This is where Vimfun has spent the past decade. Our endless (closed-loop) diamond wire slicing technology works differently from traditional reciprocating multi-wire saws:<\/p>\n\n\n\n We have a full machine matrix for different materials and scales: SG20 series for lab-scale R&D; SH60-60 and SV60-60 for large graphite and ceramic blocks; SH60-R, SH100-R, SH150-R for quartz, sapphire, and other rotary applications.<\/p>\n\n\n\n Our equipment is in operation at Edmund Optics, Coherent, SGL Carbon, Mersen Graphite, and similar customers across 20+ countries \u2014 US, Germany, France, Korea, Singapore, India, and others. At SNEC, we\u2019ll bring sample machines and slicing samples to the booth, so you can see the cut surface and measure the precision yourself.<\/p>\n\n\n\n Nach dem Schneiden folgen Schleifen, L\u00e4ppen und Polieren. Diese Stufe beeinflusst die TTV (Gesamtdickenvariation), den Verzug und die Untergrundsch\u00e4den. Wenn dies schiefgeht, verschwindet die Pr\u00e4zision, f\u00fcr die Sie beim Schneiden gek\u00e4mpft haben.<\/p>\n\n\n\n Wir erforschen aktiv effizientere Schleif-Workflow-L\u00f6sungen mit Prozesspartnern. Wenn Sie Anforderungen oder Erfahrungen mit Schleif-\/L\u00e4ppger\u00e4ten und -prozessen haben \u2013 sprechen Sie uns am Stand an. Wir sind offen f\u00fcr Partnerschafts- und Integrationsgespr\u00e4che.<\/p>\n\n\n\n Es ist sinnvoll, bei Vimfun vorbeizuschauen, wenn Sie:<\/p>\n\n\n\n Um Wartezeiten zu vermeiden und sicherzustellen, dass wir Zeit f\u00fcr ein echtes Gespr\u00e4ch haben, teilen Sie uns bitte Ihre Reisepl\u00e4ne im Voraus mit. Wir werden Ingenieure und Vertriebsmitarbeiter bereithalten und k\u00f6nnen Ihnen auch bei der Beantragung des offiziellen SNEC-Besucherausweises helfen.<\/p>\n\n\n\n2. Wafer Slicing (Our Home Turf)<\/h3>\n\n\n\n
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3. Schleifen & Oberfl\u00e4chenvorbereitung<\/h3>\n\n\n\n
Was es wert ist, zum Stand zu kommen<\/h2>\n\n\n\n
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Treffen Sie im Voraus einen Termin<\/h2>\n\n\n\n